NASA Electrical, Electronic and Electromechanical (EEE) Parts Assurance An Overview NASA STEP Level 2 August 17, 2017 Webinar for NASA Safety Center Kenneth A. LaBel Michael J. Sampson ken.label@nasa.gov michael.j.sampson@nasa.gov 301-286-9936 301-614-6233 Acknowledgment: Co- Managers, NEPP Program NASA/GSFC This work was sponsored by: http://nepp.nasa.gov NASA Office of Safety & Mission Assurance Open Access Presented by Michael J. Sampson at the NASA Safety and Mission Assurance Technical Excellence Program (STEP) Webinar, August 17, 2017.
Acronyms • American Association of Independent Advisors (AAIA) • Kennedy Space Center (KSC) • Automotive Electronics Council (AEC) • Langley Research Center (LaRC) • United States Army Aviation and Missile Research Development and Engineering • Air Force Life Cycle Management Center (LCMC) Center (AMRDEC) • Missile Defense Agency (MDA) • Applied Physics Laboratory (APL) • Military (MIL) • Appendix (Appdx) • Military Specifications (MIL Spec) • Ames Procedural Requirements (APR) • Multi-Layer Ceramic Chip Capacitors (MLCC) • Ames Research Center • Marshall Space Flight Center (MSFC) Commercial Off The Shelf (COTS) • • National Aeronautics and Space Administration (NASA) • Canadian Space Agency • Naval Sea Systems Command (NAVSEA) • Defense Logistics Agency (DLA) • The NASA Electronic Parts Assurance Group (NEPAG) • Electrical, Electronic, and Electromechanical (EEE) • The NASA Electronic Parts and Packaging (NEPP) Program Express Logistics Carriers (ELCs) • NASA Policy Directive (NPD) • • Environment Control • A thin layer of p-type semiconductor sandwiched between two n-type semiconductors (NPN) • Engineering Practice (EP) • NASA Procedural Requirements (NPR) • Electronic Parts Application Reporting & Tracking System (EPARTS) • NASA Parts Selection List (NPSL) • EEE Parts Management and Control Plan (EPMCP) National Reconnaissance Office (NRO) • • European Space Agency (ESA) • Office of Management and Budget (OMB) • Electrostatic Discharge (ESD) • Office of Safety and Mission Assurance (OSMA) • Electronic Components & Standardization (EZSS) • Part Acquisition & Review System (PARS) • Field Programmable Gate Array (FPGA) • Parts Engineering Technical Standard (PETS) • Government-Industry Data Exchange Program (GIDEP) • Parts, Materials, and Processes Control Board (PMPCB) • Glenn Research Center (GRC) • Package on Package (PoP) • Ground Support Equipment (GSE) • Production Part Approval Process (PPAP) • Goddard Space Flight Center (GSFC) • Preferred Parts List (PPL) • Human Body Model (HBM) • Quad Flat-Pack (QFP) • NASA Headquarters (HQ) • Qualified Manufacturers List (QML) • IPC is an Association Connecting Electronics Industries. In 1999, IPC changed its name • Qualified Product List (QPL) from Institute for Interconnecting and Packaging Electronic Circuits to IPC. • Society of Automotive Engineers (SAE) Institutional Parts Program Requirements (IPPR) • • Safety and Mission Assurance (SMA) • International Space Station (ISS) • Space and Missile Systems Center (SMC) • International Traffic in Arms Regulations (ITAR) • System on Chip (SOC) • Japan Aerospace Exploration Agency (JAXA) • Space Station Program (SSP) Joint Electron Device Engineering Council (JEDEC) • • NASA Safety and Mission Assurance Technical Excellence Program (STEP) • NASA Jet Propulsion Laboratory (JPL) • NASA Technology Readiness Levels (TRLs) • Johnson Space Center (JSC) • United States Air Force (USAF) To be presented by Michael J. Sampson at the NASA Safety and Mission Assurance Technical Excellence Program (STEP) Webinar, August 17, 2017. 2
Outline Introduction • o So, What is a EEE Part? NASA EEE Parts Assurance Structure • o Documentation - NASA-STD-8739.10 NASA Electronic Parts and Packaging (NEPP) • Program o NASA Electronic Parts Assurance Group (NEPAG) Examples of Assurance Challenges • o EEE Part-level ESD risks o Automotive EEE Parts o EEE Part problem investigations • Reverse-bias of tantalum capacitors • Cracking of ceramic chip capacitors • Counterfeit trending Future Challenges • Summary and Comments • To be presented by Michael J. Sampson at the NASA Safety and Mission Assurance Technical Excellence Program (STEP) Webinar, August 17, 2017.
EEE Part Types Per Table 1 of NASA-STD-8739.10 Active Parts To be presented by Michael J. Sampson at the NASA Safety and Mission Assurance Technical Excellence Program (STEP) Webinar, August 17, 2017. 5
EEE Parts and Space Applications EEE parts are available in “grades” • o Designed and tested for specific environmental characteristics. • E.g., Operating temperature range, vacuum, radiation exposure,… o Examples: Aerospace, Military, Automotive, Medical, Extended-Temperature-Commercial, and Commercial Aerospace Grade is the traditional choice for space • usage, but has relatively few available parts and their performance lags behind commercial counterparts (speed, power). Designed and tested for radiation and reliability for space usage. o NASA uses a wide range of EEE part grades • depending on many factors (technical, programmatic, and risk). To be presented by Michael J. Sampson at the NASA Safety and Mission Assurance Technical Excellence Program (STEP) Webinar, August 17, 2017. 6
Compilation of Assorted EEE Parts Photos Source: NASA GSFC Code 562 Parts Analysis Laboratory Compiled by Jay Brusse/ASRC AS&D at NASA GSFC Presented by Michael J. Sampson at the NASA Safety and Mission Assurance Technical Excellence Program (STEP) Webinar, August 17, 2017.
Some Typical EEE Parts used by NASA Cross Section Ceramic Chip Capacitor Tantalum Chip Cross Section Capacitor To be presented by Michael J. Sampson at the NASA Safety and Mission Assurance Technical Excellence Program (STEP) Webinar, August 17, 2017. 8
More Capacitors Internal Construction Wet Slug Tantalum Capacitor Internal Features Metallized Film Capacitor To be presented by Michael J. Sampson at the NASA Safety and Mission Assurance Technical Excellence Program (STEP) Webinar, August 17, 2017. 9
Resistors Internal Construction Resistor, Wirewound Internal Construction Resistor, Foil To be presented by Michael J. Sampson at the NASA Safety and Mission Assurance Technical Excellence Program (STEP) Webinar, August 17, 2017. 10
Microcircuits Field Programmable Gate Array Internal Construction (FPGA) in a Quad Flat-Pack (QFP) 2 mm Internal Hybrid Microcircuit Construction DC/DC Converter Package 2.2” X 2.7” To be presented by Michael J. Sampson at the NASA Safety and Mission Assurance Technical Excellence Program (STEP) Webinar, August 17, 2017. 11
Connectors & Electrical Contacts Circular Connector D-Subminiature Connector Coaxial, Radio Frequency Socket and Pin Contacts Connector To be presented by Michael J. Sampson at the NASA Safety and Mission Assurance Technical Excellence Program (STEP) Webinar, August 17, 2017. 12
Frequency Control Devices Crystal Oscillator “Hybrid” Internal Construction Crystal Internal Construction Crystal Crystal To be presented by Michael J. Sampson at the NASA Safety and Mission Assurance Technical Excellence Program (STEP) Webinar, August 17, 2017. 13
Old Versus New Relay Technologies Case Removed Mechanical Solid-State, Opto- Isolated To be presented by Michael J. Sampson at the NASA Safety and Mission Assurance Technical Excellence Program (STEP) Webinar, August 17, 2017. 14
Discrete Semiconductors Internal Construction MOSFET, P-Channel Internal Construction NPN Silicon Switching Transistor To be presented by Michael J. Sampson at the NASA Safety and Mission Assurance Technical Excellence Program (STEP) Webinar, August 17, 2017. 15
Magnetics Transformer Internal Construction Power Inductor Internal Construction To be presented by Michael J. Sampson at the NASA Safety and Mission Assurance Technical Excellence Program (STEP) Webinar, August 17, 2017. 16
Circuit Protection Devices Cartridge Fuse Internal Construction Solid Body Fuse Internal Construction To be presented by Michael J. Sampson at the NASA Safety and Mission Assurance Technical Excellence Program (STEP) Webinar, August 17, 2017. 17
And They Can Be Very SMALL 5 mm To be presented by Michael J. Sampson at the NASA Safety and Mission Assurance Technical Excellence Program (STEP) Webinar, August 17, 2017. 18
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