The NASA Electronic Parts and Packaging (NEPP) Program NASA Items of Interest Space Parts Working Group April 4-5, 2017 Los Angeles, California Kenneth A. LaBel Michael J. Sampson ken.label@nasa.gov michael.j.sampson@nasa.gov 301-286-9936 301-614-6233 Acknowledgment: Co- Managers, NEPP Program NASA/GSFC This work was sponsored by: http://nepp.nasa.gov NASA Office of Safety & Mission Assurance Open Access Presented at the Space Parts Working Group (SPWG) April 4, 2017
Acronyms Acronym Definition Acronym Definition Acronym Definition FlexRay FlexRay communications bus NASA National Aeronautics and Space Administration 3D Three Dimensional NAVY Crane Naval Surface Warfare Center, Crane, Indiana ADC analog-to-digital converter FPGA Field Programmable Gate Array NEPP NASA Electronic Parts and Packaging FY Fiscal Year AES Advanced Encryption Standard NGSP Next Generation Space Processor GaN Gallium Nitride AF SMC Air Force Space & Missile Systems Center NOR Not OR logic gate Gb/s gigabyte per second AFRL Air Force Research Laboratory NSRL NASA Space Radiation Lab Gen Generation AMOLED Active Matrix Organic Light Emitting Diode Occam Open Conditional Content Access Management GIC Global Industry Classification AMS Agile Mixed Signal OKC Oklahoma City GPU Graphics Processing Unit ARM ARM Holdings Public Limited Company OLED Organic Light Emitting Diode GSFC Goddard Space Flight Center CAN Controller Area Network PBGA Plastic Ball Grid Array HALT Highly Accelerated Life Test CAN-FD Controller Area Network Flexible Data-Rate PCIe Peripheral Component Interconnect Express HAST Highly Accelerated Stress Testing CBRAM Conductive Bridging Random Access Memory Peripheral Component Interconnect Express HDIO High Density Digital Input/Output PCIe Gen2 CCI Correct Coding Initiative Generation 2 HDR High-Dynamic-Range CGA Column Grid Array Peripheral Component Interconnect Express HEMTs High-electron-mobility transistors PCIe Gen4 CIGS Copper Indium Gallium Selenide Generation 4 HP Labs Hewlett-Packard Laboratories CMOS Complementary Metal Oxide Semiconductor PS-GTR Global Regulation on Pedestrian Safety HPIO High Performance Input/Output COTS Commercial Off The Shelf R&D Research and Development HUPTI Hampton University Proton Therapy Institute CPU Computer Processing Unit RAM Random Access Memory HW Hardware ReRAM Resistive Random Access Memory CRC Cyclic Redundancy Check I2C Inter-Integrated Circuit RF Radio Frequency CREME Cosmic Ray Effects on Micro-Electronics IBM International Business Machines RGB Red, Green, and Blue CSE Computer Science and Engineering IBM/GF International Business Machines/GlobalFoundaries RH RAD-Hard CU Cu alloy IC Integrated Circuit SAR Successive-Approximation-Register D-Cache Data Cache I-Cache Instruction Cache SATA Serial Advanced Technology Attachment DCU Display Controller Unit IoT Internet of Things SCU Secondary Control Unit DDR Double Data Rate IP Intellectual Property SD/eMMC Secure Digital embedded MultiMediaCard DDR2 Double Data Rate Two IR Infrared SD-HC Secure Digital High Capacity DDR3 Double Data Rate Three IR/Infineon International Rectifier/Infineon Technologies SDRAM Synchronous Dynamic Random Access Memory DDR4 Double Data Rate Four IUCF Indiana University Cyclotron Facility SEE Single Event Effect DMA Direct Memory Access JPEG Joint Photographic Experts Group SERDES Serializer/Deserializer KB Kilobyte DNA Deoxyribonucleic Acid SiC Silicon Carbide L2 Cache independent caches organized as a hierarchy (L1, L2, etc.) DoD Department of Defense SMMU System Memory Management Unit LCoS Liquid-Crystal-on-Silicon DRAM Dynamic Random Access Memory SOC System on a chip LET linear energy transfer DSP Digital Signal Processing SPI Serial Peripheral Interface LinFlex Local Interconnect Network Flexible dSPI Dynamic Signal Processing Instrument SPU Synergistic Processor Unit Slater Proton Treatment and Research Center at Loma Linda DTRA Defense Threat Reduction Agency TCM Tightly Coupled Memory LLUMC University Medical Center Dual Ch Dual Channel TI Texas Instruments L-mem Long-Memory TRIUMF Tri-University Meson Facility ECC Error-Correcting Code LP Low Power TRL Technology Readiness Level EEE Electrical, Electronic, and Electromechanical M/L BIST Memory/Logic Built-In Self-Test T-Sensor Temperature-Sensor EMAC Equipment Monitor And Control MBSE Model-Based Systems Engineering TSMC Taiwan Semiconductor Manufacturing Company EPC Efficient Power Conversion MEMS Micro Electrical-Mechanical System UART Universal Asynchronous Receiver/Transmitter ESL Electronic System Level MGH Mass General Francis H. Burr Proton Therapy University of Florida Health Proton Therapy eTimers Event Timers UFHPTI MIPI Mobile Industry Processor Interface Institute FCCU Fluidized Catalytic Cracking Unit MOSFETS Metal Oxide Semiconductor Field Effect Transistors USB Universal Serial Bus FeRAM Ferroelectric RAM MPSoC Multi-Processor System on a Chip VNAND Vertical NAND Fin Field Effect Transistor (the conducting MRAM Magnetoresistive Random Access Memory WBG Wide Band Gap FinFET channel is wrapped by a thin silicon "fin") Msg Message WDT Watchdog Timer Presented by Mike Sampson at the Space Parts Working Group (SPWG) April 4, 2017 2
Outline • NEPP Program Overview • Mike’s Highlights and “Concerns” • Electrostatic Discharge (ESD) • Radiation Update • Automotive Parts • Parts Issues • GIDEP and Counterfeits • A Look Forward • Summary Presented by Mike Sampson at the Space Parts Working Group (SPWG) April 4, 2017 3
NEPP Chartered in the 1980’s to ensure electronic • commodities expertise supported the Agency. o The NASA Electronic Parts Assurance Group (NEPAG) was created in 2000, as a sub-element of NEPP for • Information sharing between NASA Centers and other agencies, and • Sufficient infrastructure to support Agency needs and leadership in EEE Parts Assurance NEPP evaluates new EEE parts technologies and • develops insertion, test, screening, and qualification guidance. o We do not qualify specific parts, but develop the knowledge on HOW to qualify/test the parts. NEPAG supports audits, specification and • standard reviews failure investigations etc. Presented by Mike Sampson at the Space Parts Working Group (SPWG) April 4, 2017 4
NEPAG “Extended Family” Associates NASA HQ DLA Land & OSMA Partners Maritime NEPP NASA Centers John Evans NAVSEA SAE GIDEP Crane Bill Pumford Jan Maier NASA JSC Carlton Faller USAF/SMC JPL NASA ARC ESA Dave Davis Shri Agarwal Kuok Ling Ralf de Marino NASA GRC MDA NRO NASA KSC NEPAG Kristen Barry Birdsong Mark Silvius Erik Denson Boomer NASA GSFC CSA JAXA NASA MSFC Lyudmyla Nick Giurleo Koichi Suzuki Pat McManus Panashchenko NASA LaRC John Pandolf Aerospace U.S. Army / JEDEC Corp. AMRDEC AAIA John Adams USAF LCMC Jeff Jarvis APL / EZSS Brad Steiner Bob Woodward Huy Dang Presented by Mike Sampson at the Space Parts Working Group (SPWG) April 4, 2017 5
Program Highlights NEPAG has celebrated 16 years of stimulating, weekly • discussions and knowledge interchange that is/has been Educational, Influential, Collaborative, and Current New multi-agency Working Group established for coordinated o disposition of proposed changes to specifications and standards New NASA Standard, “Electrical, Electronic, and • Electromechanical (EEE) Parts Management and Control Requirements for Space Flight Hardware & Critical Ground Support Equipment” NASA-STD-8739.10 Standardizes NASA traditional practices for the selection, o acquisition, traceability, testing, handling, packaging, storage, and application of EEE parts Includes radiation, prohibited materials and counterfeit o avoidance Working with Aerospace to develop an agreement to • share support of MIL QPL/QML audits led by the Defense Logistics Agency Land and Maritime Presented by Mike Sampson at the Space Parts Working Group (SPWG) April 4, 2017 6
NASA Concern - ESD Electro Static Discharge (ESD) MIL-STD-883, Test Method 3015 • Too old, long test times o Needs to be revisited for new technology o Smaller feature sizes, lots of contacts/pins, advanced packaging (2.5/3D) • 883 vs JEDEC (3 zaps/pin vs 1 zap/pin, for HBM test) o Equipment used to assemble /process parts/wafers need closer look – o special talk at Space subcommittee meeting Generic issue; applies to all parts military/space (and COTS) o MIL-PRF-38535 • Clarify requirements o No specific ESD requirements for wafer foundries • DLA is conducting their engineering practice (EP) study o NASA EEE Parts Bulletin • Published a special edition on ESD, 2 nd part published soon o NASA ESD Surveys Conducted to bring awareness o Presented by Mike Sampson at the Space Parts Working Group (SPWG) April 4, 2017 7
A Changing Landscape (Shipping/Handling/ESD Challenge) A New Trend – Supply Chain Management Ensuring gap-free alignment for each qualified product (All entities in the supply chain must be certified/approved) Performed By? Production Step Company A Die Design and Fabrication Company B Fabrication Company C Wafer Bumping Company D Package Design and Package Manufacturing Company E Package Design Company F Assembly Company G Column Attach and Solderability Company H Screening, Electrical and Package Tests Company I Radiation Testing 8 Presented by Mike Sampson at the Space Parts Working Group (SPWG) April 4, 2017
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