A Year in the Life of the NASA Electronic Parts and Packaging (NEPP) Program A NASA Office of Safety and Mission Assurance (OSMA) Program Kenneth A. LaBel, NEPP Program Co-Manager ken.label@nasa.gov 1 Presented by Kenneth A. LaBel at the Radiation Hardened Electronics Technology (RHET) Conference, Colorado Springs, CO, November 6-8, 2017.
Acronyms Acronym Definition Acronym Definition 3D Three Dimensional (3D) IR Infrared (IR) AF Air Force (AF) JEDEC Joint Electron Device Engineering Council (JEDEC) AF SMC Air Force Space and Missile Systems Center (AF SMC) LANL Los Alamos National Laboratories (LANL) AI Artificial Intelligence (AI) MAIW Military AI Works (MAIW) ARC NASA Ames Research Center (ARC) MBMA Model-Based Missions Assurance (MBMA) BAE BAE Systems (BAE) Mil Military (Mil) BN Bayesian Networks (BN) MOSFET Metal–Oxide–Semiconductor Field-Effect Transistor (MOSFET) BOK Body of Knowledge (BOK) MPSOC Multi-Processing System on Chip (MPSOC) BYU Brigham Young University (BYU) NASA National Aeronautics and Space Administration (NASA) CLTs NASA CIO Leadership Teams (CLTs) Navy Crane Naval Surface Warfare Center, Crane, Indiana (Navy Crane) CMOS Complementary Metal Oxide Semiconductor (CMOS) NEPAG NASA EEE Parts Assurance Group (NEPAG) COTS Commercial Off The Shelf (COTS) NEPP NASA Electronic Parts and Packaging (NEPP) Program CRÈME Cosmic Ray Effects on Micro Electronics NESC NASA National Electric Safety Code (NESC) Cu Copper NRO United States Navy National Reconnaissance Office (NRO) Double Data Rate (DDR) [DDR3 = Generation 3; DDR4 = DDR OCE Office of the Chief Engineer (OCE) Generation 4] OSMA NASA Office of Safety and Mission Assurance (OSMA) Program DiRAM Dis-integrated Random Access Memory (DiRAM) PBGA Plastic Ball Grid Array DLA Defense Logistics Agency (DLA) PoP Package-on-Package (PoP) DMEA Defense Microelectronics Activity (DMEA) QFN Quad-Flat No-Leads (QFN) DoD Department of Defense (DoD) R&M Reliability and Maintainability (R&M) DOE Department of Energy (DOE) RH Radiation Hardened (RH) DRAM Dynamic Random-Access Memory (DRAM) RHA Radiation Hardness Assurance EEE Electrical, Electronic, and Electromechanical (EEE) SAE Society of Automotive Engineers (SAE) ESA European Space Agency (ESA) SAPP Space Asset Protection Program (SAPP) ETW Electronics Technology Workshop (ETW) SEAM Systems Engineering and Assurance Modeling (SEAM) FD-SOI Fully-Depleted Silicon-On-Insulator (FD-SOI) SEB Single Event Burnout (SEB) FinFETs Fin Field Effect Transistors (FinFETs) SEE Single Event Effect (SEE) FPGA Field Programmable Gate Array (FPGA) SiC Silicon Carbide (SiC) GaN Gallium Nitride (GaN) SME Small and Medium-sized Enterprises (SME) GIDEP Government-Industry Data Exchange Program (GIDEP) SNL Sandia National Laboratories (SNL) GPU Graphics Processing Unit (GPU) SOC Systems on a Chip (SOC) GSN Goal Structuring Notation (GSN) STMD NASA's Space Technology Mission Directorate (STMD) HBM High Bandwidth Memory (HBM) SysML System Modeling Language (SysML) HPSC High Performance Spacecraft Computing (HPSC) IC Integrated Circuit (IC) TOR Technical Operating Report (TOR) Presented by Kenneth A. LaBel at the Radiation Hardened Electronics Technology (RHET) Conference, Colorado Springs, CO, November 6-8, 2017. 2
NEPP Mission Statement Provide NASA’s leadership for developing and maintaining guidance for the screening, qualification, test, and reliable usage of electrical, electronic, and electromechanical (EEE) parts by NASA, in collaboration with other government Agencies and industry. Presented by Kenneth A. LaBel at the Radiation Hardened Electronics Technology (RHET) Conference, Colorado Springs, CO, November 6-8, 2017. 3
NEPP - Charter Agency Priorities – Technology Evaluation Independent Support • Advanced /new EEE • Commercial Crew parts/technologies • Small Mission • Ex. Advanced CMOS, Reliability GaN, SiC • Coordination with • Working Groups (NASA NASA Consolidation, , government, CLTs, NESC, STMD, aerospace) Trusted and RH SAPP, and radiation • Screening/qualification/ Electronics block buy test/usage guidelines • Collaboration with EEE Parts • Collaborate with • Partnering: NASA, NASA and other Infrastructure DoD/DOE on space Government Agencies, Agency Supply Chain radiation test Industry, University, • NEPAG Telecons and and Trust/Counterfeit infrastructure Working Groups International Electronics • SME Capabilities Organizations • Communication and • Support DoD efforts Outreach within NASA on Trusted Foundries and to the greater and FPGAs (w/NASA aerospace community STMD and OCE/Space Asset Protection) • Support DoD RH Agency Leadership efforts • NASA Policies and Procedures • Agency Guidelines, Body of Knowledge EEE Parts Problem (BOK) documents, and Best Practices Investigations Mission • Coordination of • Agency/Industry-wide Assurance Government and problems Industry Standards • GIDEP and NASA Alert • Audit Coordination development with AF, NRO, DLA • Partnering within NASA and other Agencies, Industry, University, and International Presented by Kenneth A. LaBel at the Radiation Hardened Electronics Technology (RHET) Conference, Colorado Springs, CO, November 6-8, 2017. 4
NEPP – Product Delivery NASA EEE Parts Policy and Standards Best Practices Government and and Guidelines Industry Standards • Test, usage, Representation screening, qualification • SAE G11/G12/ • Radiation facility JEDEC JC13 studies • Aerospace TORs NEPP Standard Products BOK • Test, summary, and • Technology and audit reports Assurance product status and • Conference and gap analysis workshop presentations • Alerts Related task areas: Technology/parts evaluations lead to new best practices, etc… Presented by Kenneth A. LaBel at the Radiation Hardened Electronics Technology (RHET) Conference, Colorado Springs, CO, November 6-8, 2017. 5
Body of Knowledge (BOK) Documents • What goes into a BOK – An overview of the technology – An overview of technology applicability to space/aeronautics – An overview of technology maturity, produceability and/or commercial availability – Reliability, qualification, and/or radiation knowledge-base – Technology direction or extent of the reliability issue for the future Identification of experts, technology sources, test houses, etc. – Facilities/capabilities – Recommendation for follow-on NEPP task (if applicable) Presented by Kenneth A. LaBel at the Radiation Hardened Electronics Technology (RHET) Conference, Colorado Springs, CO, November 6-8, 2017. 6
What’s New for NEPP in FY18 • Increased emphasis on needs of small missions such as CubeSats and model-based mission assurance (MBMA) – Partnering with other NASA organizations, Agencies, and universities • More assurance products – BOKs, Guidelines, Tools, Information Sharing, Training • Significant update of the NEPP website – Easier to find guidance and search for data – New tie-ins to the SmallSat community • Support for Agency efforts for EEE Parts Consolidation, Radiation Beam Block Buys, and Capability Leadership Teams Presented by Kenneth A. LaBel at the Radiation Hardened Electronics Technology (RHET) Conference, Colorado Springs, CO, November 6-8, 2017. 7
Advanced Technologies • Technology/device evaluations with a nod to developing test methods and user guidance AMD Ryzen Processor Hynix 3D Flash Memory • New: collaboration with DMEA and GlobalFoundries on 22nm FD-SOI and 28nm bulk radiation evaluation Presented by Kenneth A. LaBel at the Radiation Hardened Electronics Technology (RHET) Conference, Colorado Springs, CO, November 6-8, 2017. 8
NEPP – Processors, Systems on a Chip (SOC), and Field Programmable Gate Arrays (FPGAs) State of the Art “Space” FPGAs COTS • Microsemi RTG4 Processors • Xilinx MPSOC+ • Sub 32nm CMOS, • ESA Brave (future) FinFETs, etc • “Trusted” FPGA • Samsung, Intel, (future) AMD Graphics COTS FPGAs Processor • Xilinx Kintex+ Units (GPUs) • Mitigation evaluation • Intel, AMD, Nvidia • TBD: Microsemi • Enabling data PolarFire processing Radiation Hardened Partnering Processor Best Evaluation • Processors: Navy Practices Crane, BAE/NRO- • BAE RAD55XX • FPGAs: AF SMC, and • Vorago SNL, LANL, BYU,… (microcontrollers) • Microsemi, Xilinx, Guidelines • Support High Synopsis Performance • Cubic Aerospace Spacecraft Computing (HPSC) Potential task areas: artificial intelligence (AI) hardware, Intel Stratix 10 Presented by Kenneth A. LaBel at the Radiation Hardened Electronics Technology (RHET) Conference, Colorado Springs, CO, November 6-8, 2017. 9
NEPP – Memories New materials/ DRAMs architectures • DDR4 test capability (in • Resistive progress) • Fujitsu/Panasonic • Commercial DDR • Spin torque transfer (various) magnetoresistive • Tezzaron DiRAM • Avalanche, Everspin (w/HPSC) • 3D Xpoint • Enabling high • Intel Optane performance • Enabling “universal” computing memories Commercial Flash Partnering • 3D • Navy Crane • Samsung, Hynix, Micron • NASA STMD • Planar – TBD • Avalanche Best • Enabling data storage • University of Padova density Practices and Guidelines Related task areas: Deprocessing for single event testing (also w/processors, FPGAs,…) Presented by Kenneth A. LaBel at the Radiation Hardened Electronics Technology (RHET) Conference, Colorado Springs, CO, November 6-8, 2017. 10
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