NASA’s Changing Electronics Landscape: NEPP Focus, Agency Alignment, and Technology Development Kenneth A. LaBel NEPP Program Co-Manager ken.label@nasa.gov Jonathan A. Pellish NASA EEE Parts Manager jonathan.pellish@nasa.gov Presented by Kenneth A. LaBel and Jonathan A. Pellish at the Microelectronics Reliability and Qualification Working (MRQW) Meeting, El Segundo, CA, February 6-8, 2018.
Acronyms • Three Dimensional (3D) • Goddard Space Flight Center(GSFC) • Radiation Hardened (RH) • Air Force (AF) • Goal Structuring Notation (GSN) • Radiation Hardness Assurance (RHA) • Air Force Space & Missile Systems Center (AF SMC) • High Bandwidth Memory (HBM) • Society of Automotive Engineers (SAE) • Advanced Micro Devices, Inc. (AMD) • High Performance Spacecraft Computing (HPSC) • Space Asset Protection Program (SAPP) • Ames Research Center (ARC) • Integrated Circuit (IC) • SCRIPPS Proton Therapy Center • Marconi Electronic Systems (MES) and British • Infrared (IR) (SCRIPPS) Aerospace (BAe) merged to form BAE Systems (BAE) • Indiana University Cyclotron Facility (IUCF) • Systems Engineering and Assurance • Bayesian Networks (BN) • Joint Electron Device Engineering Council (JEDEC) Modeling (SEAM) • Body of Knowledge (BOK) • Jet Propulsion Laboratories (JPL) • Single Event Burnout (SEB) • Brigham Young University (BYU) • Los Alamos National Laboratories (LANL) • Single Event Effect (SEE) • Capability Leadership Teams (CLTs) • Loma Linda University Medical Center (LLUMC) • NASA Space Environments Testing • Complementary Metal Oxide Semiconductor (CMOS) • Mission Assurance Improvement Workshop (MAIW) Management Office (SETMO) • Commercial Off-the-Shelf (COTS) • Model-Based Mission Assurance (MBMA) • Silicon Carbide (SiC) • Cosmic Ray Effects on Micro-Electronics (CRÈME) • Massachusetts General Hospital (MGH) • Air Force Space and Missile Systems • Double Data Rate (DDR) • Metal-Oxide-Semiconductor Field-Effect Transistor Center (SMC) • Dis-integrated Random Access Memory (DiRAM) (MOSFET) • Subject Matter Expert (SME) • Defense Logistics Agency (DLA) • National Aeronautics and Space Administration • Sandia National Laboratories (SNL) (NASA) • Defense MicroElectronics Activity (DMEA) • NASA Space Technology Mission • Naval Surface Warfare Center, Crane, Indiana (Navy • Department of Defense (DoD) Directorate (STMD) Crane) • Department of Energy (DOE) • System Modeling Language (SysML) • NASA Electronic Parts Assurance Group (NEPAG) • Electrical, Electronic, and Electromechanical (EEE) • Technical Operating Reports (TORs) • NASA Electronic Parts and Packaging (NEPP) Program • NEPP Electronics Technology Workshop (ETW) • Tri-University Meson Facility (TRIUMF) • NASA Engineering and Safety Center (NESC) • fully depleted silicon-on-insulator (FD-SOI) • Through Silicon Via (TSV) • Non-Military (Non-Mil) • Fin Field Effect Transistor (the conducting channel is • United States Navy National Reconnaissance Office wrapped by a thin silicon "fin") (FinFET) (NRO) • Field Programmable Gate Array (FPGAs) • NASA Office of the Chief Engineer (OCE) • Gallium Nitride (GaN) • NASA Office of Safety and Mission Assurance (OSMA) • Government-Industry Data Exchange Program • Package on Package (PoP) (GIDEP) Presented by Kenneth A. LaBel and Jonathan A. Pellish at the Microelectronics Reliability and Qualification Working (MRQW) Meeting, El Segundo, CA, February 6-8, 2018. 2
Outline • NASA Electrical, Electronic, and Electromechanical (EEE) Parts Landscape – Why the Change? – General Agency EEE Parts Interfaces – EEE Parts Manager: A New Role in the Agency • 2018 Activities – NASA Electronic Parts and Packaging (NEPP) Program – NASA Space Technology Mission Directorate (STMD) – NASA Space Environments Testing Management Office (SETMO) • Summary Presented by Kenneth A. LaBel and Jonathan A. Pellish at the Microelectronics Reliability and Qualification Working (MRQW) Meeting, El Segundo, CA, February 6-8, 2018. 3
EEE Parts – Why the Change? Image Credit: NASA Capabilities are defined as a combination of technical content, workforce, – specialized facilities and infrastructure, as well as unique tools and techniques NASA currently has 19 discipline, 7 system, 5 research, and 3 service capabilities – EEE parts falls under the Avionics discipline within the Capability Leadership – Model – EEE parts management function stood up for implementation Presented by Kenneth A. LaBel and Jonathan A. Pellish at the Microelectronics Reliability and Qualification Working (MRQW) Meeting, El Segundo, CA, February 6-8, 2018. 4
General NASA EEE Parts Interfaces Managed by GSFC Image Credit: NASA Presented by Kenneth A. LaBel and Jonathan A. Pellish at the Microelectronics Reliability and Qualification Working (MRQW) Meeting, El Segundo, CA, February 6-8, 2018. 5
NASA EEE Parts Manager • Manage consolidation and centralization of EEE parts workforce – Radiation effects on EEE parts are in scope, as is management of the Agency radiation facility block buy – GSFC is lead Center, with support from JPL • Provide resources for Centers to acquire EEE parts workforce expertise and a forum to coordinate activities with stakeholders (e.g., OCE, OSMA, SETMO, etc.) and customers • Track the state of the Agency EEE parts workforce, including Center expertise, demand, and capacity • Support Agency policy and technical decision- making processes • Evolve management functions as needed Presented by Kenneth A. LaBel and Jonathan A. Pellish at the Microelectronics Reliability and Qualification Working (MRQW) Meeting, El Segundo, CA, February 6-8, 2018. 6
NEPP Mission Statement Provide NASA’s leadership for developing and maintaining guidance for the screening, qualification, test, and reliable usage of electrical, electronic, and electromechanical (EEE) parts by NASA, in collaboration with other government Agencies and industry. Presented by Kenneth A. LaBel and Jonathan A. Pellish at the Microelectronics Reliability and Qualification Working (MRQW) Meeting, El Segundo, CA, February 6-8, 2018. 7
NEPP - Charter Agency Priorities – Technology Evaluation Independent Support • Advanced /new EEE • Commercial Crew parts/technologies • Small Mission • Ex. Advanced CMOS, Reliability GaN, SiC • Coordination with • Working Groups (NASA NASA Consolidation, , government, CLTs, NESC, STMD, aerospace) Trusted and RH SAPP, and radiation Electronics • Screening/qualification/ block buy test/usage guidelines • Collaboration with EEE Parts • Collaborate with • Partnering: NASA, NASA and other Infrastructure DoD/DOE on space Government Agencies, Agency Supply Chain radiation test • NEPAG Telecons and Industry, University, and Trust/Counterfeit infrastructure International Working Groups Electronics • SME Capabilities Organizations • Communication and • Support DoD efforts Outreach within NASA on Trusted Foundries and to the greater and FPGAs (w/NASA aerospace community STMD and OCE/Space Asset Protection) • Support DoD RH Agency Leadership efforts • NASA Policies and Procedures • Agency Guidelines, Body of Knowledge EEE Parts Problem (BOK) documents, and Best Practices Investigations Mission • Coordination of • Agency/Industry-wide Assurance Government and problems Industry Standards • GIDEP and NASA Alert • Audit Coordination development with AF, NRO, DLA • Partnering within NASA and other Agencies, Industry, University, and International Presented by Kenneth A. LaBel and Jonathan A. Pellish at the Microelectronics Reliability and Qualification Working (MRQW) Meeting, El Segundo, CA, February 6-8, 2018. 8
NEPP – Product Delivery NASA EEE Parts Policy and Standards Best Practices Government and and Guidelines Industry Standards • Test, usage, Representation screening, qualification • SAE G11/G12/ • Radiation facility JEDEC JC13 studies • Aerospace TORs NEPP Standard Products BOK • Test, summary, and • Technology and audit reports Assurance product status and • Conference and gap analysis workshop presentations • Alerts Related task areas: Technology/parts evaluations lead to new best practices, etc… Presented by Kenneth A. LaBel and Jonathan A. Pellish at the Microelectronics Reliability and Qualification Working (MRQW) Meeting, El Segundo, CA, February 6-8, 2018. 9
Body of Knowledge (BOK) Documents • What goes into a BOK – An overview of the technology – An overview of technology applicability to space/aeronautics – An overview of technology maturity, produceability and/or commercial availability – Reliability, qualification, and/or radiation knowledge-base – Technology direction or extent of the reliability issue for the future Identification of experts, technology sources, test houses, etc. – Facilities/capabilities – Recommendation for follow-on NEPP task (if applicable) Presented by Kenneth A. LaBel and Jonathan A. Pellish at the Microelectronics Reliability and Qualification Working (MRQW) Meeting, El Segundo, CA, February 6-8, 2018. 10
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