OP OPPOR ORTUNITIES FOR OR PIC’S ON ON IN INP OC OCT 29, 2019
AG AGENDA § What is Integrated Photonics? § Addressable markets § Introduction to SMART Photonics § Value chain and way of working § Some concrete applications § Conclusions 2
CO CONVE VENTIONAL PHO HOTONICS CS Photonics Market size (2018): ± $ 650 Billion 3
BU BUILDI DING A CIRC RCUIT T WITH TH ONLY Y 3 BA BASIC ELEMENTS TS Electronic chips InP Photonic Integrated Chips Electronic integration Photonic integration 3 basic elements 3 basic elements Waveguide PWD j Phase PHM Amplitude A SOA 4
PH PHOT OTON ONIC INTEGRATION ON RESEMBLE LES ELE LECTRON ONIC REVOLUT OLUTION ON El Electronic integration ha has cha hanged the he world Ph Photonic integration will change the world d again! 5
IN INP IN INTEGRATIO ION P PLATFORM § Photonic integration needs active and passive components § Light sources and amplification can only be realized in Indium Phosphide (InP) § Monolithic integration of all functionalities! § Mature technology § Butt-joint integration: no compromise between active and passive components § Full on-wafer electrical testing § Enabler for low-cost integrated circuits! waveguides phase modulators gratings Amplifiers/ laser gain section 6
CO COMPARISON PHO HOTONIC C TECHN CHNOLOGIES Integrated Photonics platform technologies Technique InP Si Photonics Hybrid Si. Schematic view Silicon based Silicon based Silicon element Integrated full chip with chip with InP InP element InP based chip connected InP based lasers laser bonded Maximum bandwidth 1 > 1,000 Gb/s 100 Gb/s 400 Gb/s Integration level Full - Limited Passive components Lasers Active comp. Phase modulators InP Fab InP Fab InP Fab (eg eg SM SMART RT) Required production facilities (eg eg SM SMART RT) (eg eg SM SMART RT) Si Fab Si Fab InP/Si bonding Fab Key: Poor performance High performance Source: 1 At competitivesizeand cost
INTEGRATED IN IN INP CH CHIPS MORE CO COST-EF EFFICIEN ENT THAN HYBRID SILICON A more efficient process flow and better scalability… Lower mask cost Process flow comparison Mask cost comparison (EUR’000) Back-end Back-end INDICATIVE processing processing No continuous InP Waveguide InP Waveguide flow, litho and etch litho and etch ~50x more ! individual dies Fully scalable expensive per functional Assembly: die Not required wafer-scale material: attach process Limited scalability Epitaxial growth Epitaxial growth Si Waveguide litho 0 1,500 Not required and etch Hybrid InP Hybrid Silicon InP ~EUR 20k ~EUR 1,000k Silicon 8
IN INP P PLATFORM C CAPABIL ILIT ITIE IES 9
KE KEY Y MARKE RKET T OPPORTU RTUNITI TIES IN COMMUNICATI TION AND D SENSING § Communication applications key trends: design § Ongoing transition to higher network speed § Access networks are migrating from DSL towards Fiber (FttX ) § 5G Energy Chip § Ongoing rise in data traffic Manufacturing High tech § Increasing cloud based storage capacity (datacenters) required § Transition towards advanced coherent optical to technology Automotive 5G Wireless § PICs on InP create disruptive sensing solutions for many sectors: Packaging § Health & Medical Big Data § Automotive Healthcare § Aerospace / Aviation § Machinery § Energy Aviation § Consumer Electronics Communication applications Sensing appications 10
IN INTEGRATED PHOTONIC ICS WIL ILL HELP SOLVE MAJOR SOCIE IETAL IS ISSUES With Integrated Photonics we use IC’s that operate on the basis of light instead of electronics. Faster data rates and reduced Medical diagnostics: portable This leads to strongly improved and power consumption and close to patient completely novel functionalities: § Smaller, faster, better performance and lower power § Photonic IC’s (PIC’s) can be used to address major problems in society IoT Mobility: Autonomous driving Eye safe LIDAR systems 11
ST STRONG MARKET GROWTH, H, DRIVE VEN BY IN INP IN INTEGRATED PHOTONIC ICS Application value, driven by PIC PIC value itself PIC market estimates 2024 (USD B) InP Photonics development 2017-2024 (USD M) 4.0 $12,000 Roland Berger 3.5 Markets&Markets $10,000 3.0 Stratistics MRC Knowledge Sourcing Intelligence LLP $8,000 2.5 BCC Research $6,000 2.0 1.5 $4,000 1.0 $2,000 0.5 $0 2017 2018 2019 2020 2021 2022 2023 2024 - 2014 2015 2016 2017 2018 2019 2020 2021 2022 2023 2024 Telecom Datacom Sensing
TH THE WORL RLD D IS PAYI YING ATTE TTENTI TION! Source Photonics opens new InP laser fab 26 Feb 2019 - Facility in China will double production capacity of lasers and other photonic components Source: Optics.org Synopsys and SMART Photonics Expand InP-Based PIC Design Automation Development of SMART Photonics PDK for Synopsys’ PIC Design Suite Enables a Complete and Seamless InP-Based Design Flow Source: Million Insights “Silicon Photonics Market to Exhibit Based on Rising Usage of Huge Photonic Growth Cisco to acquire silicon photonics chip maker Luxtera for $660 million Increasing Technology Optical Demand and Multiplexers 2025” for Source: TechCrunch S o u Till r c e : B l o o m b e r g 13
SM SMART IS IS B BUIL ILDIN ING O ON > >30 Y YEARS T TECHNOLOGY H HERIT ITAGE Origin Spin-off SMART Photonics First production First Multi Project Wafer produced Acquisition First commercialization New fab POEC acquired components by Uniphase for Scale up to First step in control € 1.2B serve global Move to HTC and customers as NanoLab established installation of tool set state of the Onboarding TU/e in HTC facility (50% of art photonics Established first shared process) foundry facility for integrated Photonics prototyping Round Achieve full control Early 1994 2012 2013 2017 2020 >2022 1991 1998 2002 1980’s Total investment in fundamental InP and Photonics research estimated at € 300M 14
OU OUR FACILI LITIES • SMART Photonics @High Tech Campus – > 900m 2 Production facility • 570m 2 3” Production cleanroom (Class 1000) – Processing and epitaxy • SMART Photonics @NanoLab cleanroom Eindhoven – 850m 2 Fully equipped R&D facility 15
SM SMART PH PHOT OTON ONICS BUS USINESS MOD ODEL § We are the first player offering production of In InP integrated photonic chips as a foundry § The foundry model is well established in the Semiconductor industry and currently accounts for mo more than 40% of the market § Our customers are predominantly OEMs and system companies § We use a generic process to support customers in a very broad set of application areas § We sell our IC’s to large global companies as well as rapidly growing start-ups § Market demand is presently exceeding our current capacity and is growing DESIGN PICs PACKAGING MODULE SYSTEM END USERS GOOGLE, SYSTEM FACEBOOK, DESIGN HOUSES OEMs COMPANIES AIRBUS, PHILIPS (E.G. CISCO) HEALTHCARE 16
VA VALUE CHA CHAIN FULLY EMBEDDED IN THE HE NETHE HERLANDS § We are the first player offering production of In InP integrated photonic chips as a foundry § The foundry model is well established in the Semiconductor industry and currently accounts for mo more than 40% of the market § Our customers are predominantly OEMs and system companies § We use a generic process to support customers in a very broad set of application areas § We sell our IC’s to large global companies as well as rapidly growing start-ups § Market demand is presently exceeding our current capacity and is growing DESIGN PICs PACKAGING MODULE SYSTEM END USERS 17
DE DESIGN TO TOOLS Design Kit Foundry Designer Mask Generator Circuit Simulator Physical Simulations 18
LA LAYOU OUT-AW AWAR ARE SCHEMAT ATIC DESIGN FLOW § Functional design using parameterized building blocks § Fast and accurate modeling of large-scale PIC designs § Automatically sweep and optimize parameters § Orientations and connections are kept and passed to the mask generation software 19
GE GENERIC PROC OCESS DEPLOY LOYED THROU OUGH GH DESIGN GN KIT (P (PDK) Process Design Kit with our Building blocks is key IP ...and is offered via the design software of: • Key Intellectual Property of the company resides in the broadest set of building blocks for Integrated Photonics • Releasing building blocks take extensive effort. PDK thus represents a strong unfair competitive advantage for the long term • Process Design Kits are available: – Access via state of the art software tools – Design manual and Functional building block description – Full layout-aware design flow – Circuit simulation and Mask design 20
EX EXAMPLE: E: 2.5 GHZ MODE E LOCKED ED LASER SER • Frequency comb laser for gas sensing • 30 mm cavity • < 4mm 2 -20 -45 -30 -50 I SOA =115mA, U SA =-2.7V Spectral power (dBm/Hz) -55 -30 -35 -60 Power density (dBm/res) -65 Spectral power (dBm/Hz) -40 -70 -40 -75 -80 -45 2.40 2.45 2.50 2.55 2.60 2.65 Frequency (GHz) -50 -50 -55 -60 -60 -70 -65 -70 -80 1550.75 1551.00 1551.25 1551.50 1551.75 0 2 4 6 8 10 12 14 Wavelength (nm) Frequency (GHz) S. Tahvili and S. Latkowski, COBRA 21
EX EXAMPLE: E: COMB LASER SER FOR GAS S SEN SENSI SING 22
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