CLICdp Tracker Technology Meeting ITDs Petal e.g. ITD2 ‐ Preliminary Thermal Calculation ITDs Petal e.g. ITD2 ‐ Preliminary Thermal Calculation Szymon Sroka, Fernando Duarte Ramos
Presentation Layout Presentation Layout Design Parameters & Boundary Conditions ITDs PETAL Baseline Design Thermal Simulation in ANSYS Thermal Studies Szymon Krzysztof Sroka 24/02/2017 2
Reminder ‐ ITDs support structures Szymon Krzysztof Sroka 24/02/2017 3
Reminder ‐ ITDs support structures 1 Support Structure • 2 Petal ‐ the Object of interest Support Structure + Petals • • Szymon Krzysztof Sroka 24/02/2017 4
Design parameters & Boundary Conditions DPs: Chip power dissipation • Assumed range of Chip Power Dissipation 0.01 ‐ 0.15 W cm ‐ 2 Operational temperature and uniformity • Ambient temperature T = 22 ⁰ C Chip operational temperature T < 30 ⁰ C Coolant Input temperature T = 15 ⁰ C Water Cooling System • System has to be leak ‐ less ‐ the pressure drop should remain well below 1 bar in order to guarantee return of the water flow BCs: T min > T dew ‐ point (assumed 12 ⁰ C ) • Minimum chip operational temperature above the Dew Point Reliability • Robust design with minimum maintenance required Operating Conditions • Materials and design compatible with operation in the CLIC Inner Region Szymon Krzysztof Sroka 24/02/2017 5
ITDs PETAL Baseline Design Assumptions: Mechanical layout (Petal ITD): • CF Skins (K13D2U, T = 150 μ m; 60% Fibre; 40% Epoxy) PGS ( Pyrolytic Graphite Sheet, T = 25 μ m) Glue Layer ( Eccobond 54, T = 100 μ m) CORE (Rohacell IG51, T = 3.5 mm) + Graphite Foam (Allcomp K9, T = 3.5 mm) + Cooling Pipe (ID = 2.05; TH = 140 µm) + Cooling Fluid (Water) Glue Layer ( Eccobond 54, T = 100 μ m) Core & Carbon Foam & Cooling Pipe PGS ( Pyrolytic Graphite Sheet, T = 25 μ m) CF Skins (K13D2U, T = 150 μ m; 60% Fibre; 40% Epoxy) & Cooling Fluid Glue Interface (Eccobond 54, T = 100 μ m) • DIRECTION PARTICLES Power Bus Module Module of Traker Disks : • PGS PGS CFS CFS Silicon Pixel Chips ( T = 200 μ m ( 100 + 100) ) FPC Insulating layer (Polyimide, T = 50 μ m) FPC Metal layer (Aluminium, T = 50 μ m) FPC Insulating layer (Polyimide, T = 50 μ m Glue Interface (Eccobond 54, T = 100 μ m) • Power Bus: • Insulating layer (Polyimide, T = 100 μ m) Additional Glue Interfaces (Eccobond 54, T = 100 μ m): • Metal layer (Aluminium, T = 200 μ m) Core & Carbon Foam Carbon Foam & Cooling Pipe Insulating layer (Polyimide, T = 100 μ m) Szymon Krzysztof Sroka 24/02/2017 6
ITDs PETAL Baseline Design THERMAL DENSITY CTE COMPONENTS MATERIAL CONDUCTIVITY [ kg/m 3 ] [1/C] x 10 ‐ 6 [ W/m*C] CFS K13D2U 1742 2.6 [ 294; 159; 1.2 ] INTERFACE PGS ( PYROLYTIC GRAPHITE SHEET) 1900 93 1600 MECHANICAL LAYOUT GLUE HYSOL ECCOBOND 45 1240 58 0.35 (PETAL ITD) CORE ROHACELL IG51 52 1 0.03 CARBON FOAM ALLCOMP K9 220 3.5 [ 34; 38; 34 ] TITANIUM CP2 R50400_COOLING PIPE 4510 8.4 21 ALUMINIUM 5251 A95251 2690 25 134 COOLING PIPE POLYIMIDE ( KAPTON ) 1540 20 0.385 CF TUBE (T300) 1770 19.2 1 COOLANT WATER 998.3 207 0.604 GLUE INTERFACE HYSOL ECCOBOND 45 1240 58 0.35 MODULE OF SILICON SENSORS SILICON 2329 2.61 156 TRACKER DISKS FPC INSULATING POLYIMIDE ( KAPTON ) 1540 20 0.385 LAYERS METAL LAYER ALUMINIUM 2690 22.2 205 GLUE INTERFACE HYSOL ECCOBOND 45 1240 58 0.35 PB INSULATING POWER POLYIMIDE ( KAPTON ) 1540 20 0.385 BUS LAYERS METAL LAYER ALUMINIUM 2690 22.2 237.5 Szymon Krzysztof Sroka 24/02/2017 7
ITDs PETAL Baseline Design – Cooling Loop 1 “Curly” Cooling Pipe 2 Straight Cooling Pipe Technical Details: Technical Details: Length of CP = 973 [mm] Length of CP = 911 [mm] ID of CP = 2.05 [mm] ID of CP = 2.05 [mm] Thickness of CP = 140 [µm] Thickness of CP = 140 [µm] Material Candidates e.g. : Material Candidates e.g. : Titanium Polyimide (Kapton) Aluminium Carbon Fibre Szymon Krzysztof Sroka 24/02/2017 8
ITDs PETAL Baseline Design – Cooling Loop 1 “Curly” Cooling Pipe 2 Straight Cooling Pipe Internal Structure: Core & C. Foam Internal Structure: Core & C. Foam Material Candidates e.g. : Material Candidates e.g. : Titanium Polyimide (Kapton) Aluminium Carbon Fibre Szymon Krzysztof Sroka 24/02/2017 9
Thermal Simulation in ANSYS – BCs 1 3 • BCs: Heat Flux • BCs: NC ( Air ) SILICON SENSORS CFS ( BACK SIDE) CFS ( FRONT SIDE) POWER BUS 2 4 • BCs: Radiation • BCs: Cooling Loop CFS ( BACK SIDE) WATER INLET TEMP CFS ( FRONT SIDE) FLOW CONVECTION POWER BUS (Water & Inner CT Wall) MASS FLOW RATE Szymon Krzysztof Sroka 24/02/2017 10
Thermal Simulation in ANSYS – Mesh 1 2 Szymon Krzysztof Sroka 24/02/2017 11
Thermal Simulation in ANSYS –Temp. Distribution “Curly” Cooling Pipe 1 1.2 Obtained in case of: Obtained in case of: Heat Flux = 1500 Wm ‐ 2 Heat Flux = 1500 Wm ‐ 2 Mass Flow Rate = 20.4 Lh ‐ 1 Mass Flow Rate = 20.4 Lh ‐ 1 Cooling Pipe Material : Cooling Pipe Material : Aluminium Titanium Szymon Krzysztof Sroka 24/02/2017 12
Thermal Simulation in ANSYS –Temp. Distribution Straight Cooling Pipe 2 2.1 Obtained in case of: Obtained in case of: Heat Flux = 1500 Wm ‐ 2 Heat Flux = 1500 Wm ‐ 2 Mass Flow Rate = 20.4 Lh ‐ 1 Mass Flow Rate = 20.4 Lh ‐ 1 Cooling Pipe Material : Cooling Pipe Material : Polyimide (Kapton) Carbon Fibre Szymon Krzysztof Sroka 24/02/2017 13
Thermal Studies CHTC ‐ Duct walls CHTC ‐ Duct walls CHTC ‐ CFS ASSUMED POWER POWER HEAT FLUX MASS FLOW & Internal flow of & Internal flow of NB. OF ( Vertical T CF ‐ Input Δ T CF water [W/m 2 K] water [W/m 2 K] CHIP DISSIPATION APPLIED (ANSYS) RATE CASE plate) & air [ ⁰ C ] [ ⁰ C ] [W/cm 2 ] [W/m 2 ] (W) [ L/h] ‐‐ > TI & AL ‐‐ > Kapton & CF [W/m 2 K] ( L CL = 976 [mm ] ) ( L CL = 911 [mm ] 1 0.15 71.05 1500 9667 9667 20.40 2 0.10 47.37 1000 13.60 1527 1544 3 0.080 37.90 800 10.88 1449 1472 4 0.060 28.42 600 8.16 1366 1384 5 0.040 18.95 400 1275 1288 5.41 13.115 15 3 6 (IB) 0.034 16.10 340 4.62 1246 1257 7 0.030 14.21 300 4.08 1226 1236 8 0.020 9.47 200 2.72 1174 1181 9 OB) 0.0185 8.76 185 1166 1173 2.52 10 0.010 4.74 100 1.36 1118 1122 Szymon Krzysztof Sroka 24/02/2017 14
Thermal Studies Thermal Performance Objective: Evaluation of 12.5 the thermal performance Turbulent Flow 11.5 of the proposed design by 10.5 simulating the chip surface temperature at various 9.5 flow rates and power Max Chip operational temperature Δ T CHIP VS ENVIROMENT [ ⁰ C] 8.5 dissipation at chips 7.5 6.5 ID = 2.05 mm, Titanium Pipe 5.5 ID = 2.05 mm, Aluminium Pipe ID = 2.05 mm, Kapton ( Polyimide ) Pipe 4.5 ID = 2.05 mm, CF Pipe 3.5 Results: The proposed 2.5 design presents good 1.5 thermal performance at the assumed power 0.5 dissipation: 0 5 10 15 20 25 30 35 40 45 50 55 60 65 70 75 ‐ 0.5 (0.01 – 0.15 W cm ‐ 2) ‐ 1.5 POWER APPLIED [W] Szymon Krzysztof Sroka 24/02/2017 15
Thermal Studies Pressure Drop 0.32 0.31 Objective: Verification 0.3 Turbulent Flow the compatibility of the 0.29 0.28 proposed design with the 0.27 0.26 leak – less operation 0.25 0.24 system by simulating the 0.23 pressure drop at various 0.22 0.21 flow rates and power 0.2 Δ p H20 [bar] 0.19 dissipation at chips 0.18 0.17 0.16 0.15 ID = 2.05 mm, Titanium and Aluminium 0.14 0.13 ID = 2.05 mm, Polyimide and CF 0.12 0.11 0.1 0.09 0.08 Results: The proposed 0.07 design is compatible 0.06 0.05 with the leak – less 0.04 0.03 operation system 0.02 0.01 0 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 H 2 0 flow rate [ L/h] Szymon Krzysztof Sroka 24/02/2017 16
Thermal Studies ‐ ITDs PETAL 1 “Curly” Cooling Pipe X0 RL DENSITY Mass COMPONENTS MATERIAL Thickness [ kg/m 3 ] [ gm ] [ cm ] [%X0] CFS K13D2U 1742 2 x 150 [µm] 33.57 24.512 0.122 PGS ( PYROLYTIC GRAPHITE INTERFACE 1900 2 x 25 [µm] 6.10 22.474 0.022 SHEET) MECHANICAL LAYOUT GLUE HYSOL ECCOBOND 45 1240 4 x 100 [µm] 29.6 35.5 0.112 [Th = 3.5 [mm]] (PETAL ITD) CORE ROHACELL IG51 52 9.52 784.6 0.036 T_smeared = 2.8 [mm] CARBON [Th = 3.5 [mm]] ALLCOMP K9 220 9.18 194.1 0.036 T_smeared = 0.7 [mm] FOAM TITANIUM CP2 (ID = 2.05 [mm] 4510 4.23 3.592 0.055 COOLING R50400_COOLING PIPE TH = 0.14 [mm]) PIPE ALUMINIUM 5251 A95251 2690 T_smeared = 19.8 [µm] 2.53 8.896 0.022 COOLANT WATER 998.3 T_smeared = 67.8 [µm] 3.21 36.08 0.0188 TOTAL 91.18 + CP TOTAL 0.347 + CP Szymon Krzysztof Sroka 24/02/2017 17
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