USING SURFACE-MOUNT COMPONENTS IN AN EMBEDDED SYSTEMS LAB ERIK - PowerPoint PPT Presentation

USING SURFACE-MOUNT COMPONENTS IN AN 
 EMBEDDED SYSTEMS LAB ERIK BRUNVAND SCHOOL OF COMPUTING UNIVERSITY OF UTAH

Student Projects Fall 2014

Student Projects Fall 2014

SMD Packages http://www.microchip.com/ http://www.righto.com/

SMD Packages Metric Imperial comparison code code comparison 0402 01005 0.1x0.1 mm 0.01x0.01 in 0603 0201 (10x10 mils) 1005 0402 1608 0603 2012 0805 1x1mm 0.1x0.1 in 2520 1008 http://www.sbs4dcc.com (100x100 mils) 3216 1206 3225 1210 4516 1806 4532 1812 5025 2010 6332 2512 1x1 cm Actual 0.5x0.5in size (500x500 mils) http://en.wikipedia.org/wiki/Surface-mount_technology https://blog.adafruit.com

SMD IC packages SOIC 1.27mm pin pitch 
 (0.05”) 
 SSOP/TSSOP 0.65mm pin pitch 
 QFP/TQFP/LQFP 0.5mm pin pitch 
 QFN/TQFN/LQFN 0.5mm pin pitch

Procedure - by hand 1. Design/Fab PCB 2. Apply solder/flux or solder paste 3. Add components 4. Solder carefully using soldering iron, drag soldering, or hot air http://store.curiousinventor.com/guides/Surface_Mount_Soldering/

Procedure - by hand https://www.youtube.com/watch?v=5uiroWBkdFY 1. Design/Fab PCB 2. Apply solder/flux or solder paste 3. Add components 4. Solder carefully using soldering iron, drag soldering, or hot air hackaday.com

Reflow Soldering A soldering technique using solder paste and an oven Solder paste (mixture of flux and solder) is applied to the board Components are 
 “nestled” into the 
 paste The board is heated, 
 the solder melts, and 
 the components are secured to the board http://store.curiousinventor.com/guides/Surface_Mount_Soldering/

Reflow Soldering http://www.wisegeek.org/what-is-a-circuit-board.htm A soldering technique using solder paste and an oven Solder paste (mixture of flux and solder) is applied to the board Components are 
 “nestled” into the 
 paste The board is heated, 
 the solder melts, and 
 the components are secured to the board http://capnstech.blogspot.com/

Reflow Soldering http://www.idleloop.com/robotics/stencil/

Reflow Procedure 1. Design/Fab PCB 2. Cut solder stencil 3. Apply solder paste through stencil 4. Add components 5. Bake in the oven

Procedure 1. Design/Fab PCB EagleCAD, KiCAD, Altium, etc… Local PCB 
 fabricators Or panel-share 
 such as OSH Park

Procedure 1. Design/Fab PCB EagleCAD, KiCAD, Altium, etc… Local PCB 
 fabricators Or panel-share 
 such as OSH Park

Procedure 2. Cut solder stencil Solder or Paste 
 layer on the PCB 2-4mm mylar Laser cutter Vinyl cutter

Procedure 2. Cut solder stencil Solder or Paste 
 layer on the PCB 2-4mm mylar Laser cutter Vinyl cutter http://www.idleloop.com/robotics/stencil/

Procedure 3. Apply solder paste 
 through stencil Solder paste sticks to PCB pads

Procedure 4. Add components Tweezers help An inspection scope 
 also helps https://www.stencilsunlimited.com/smt_stencils/smt_stencil_tutorial_page1.htm http://www.idleloop.com/robotics/stencil/

http://en.wikipedia.org/wiki/Reflow_soldering Procedure 5. Bake in the oven You can actually use a toaster oven or griddle A reflow oven has a 
 more careful heat 
 profile

Whole Setup Around $2,000-3,000 in equipment Huge improvement in the complexity / sophistication of HW projects in our senior capstone class

Contact / Info Erik Brunvand elb@cs.utah.edu www.cs.utah.edu/~elb http://store.curiousinventor.com/guides/Surface_Mount_Soldering/