Tyndall 2025 Core equipment upgrade and transition towards Smart - PowerPoint PPT Presentation

Tyndall 2025 – Core equipment upgrade and transition towards Smart Manufacturing ENRIS 2019 – Enschede 16 th - 18th June 2019 Graeme Maxwell Tyndall National Institute graeme.maxwell@tyndall.ie

Where Are we?

Tyndall – Infrastructure numbers • 18,000 m 2 of buildings. • 1,200 m 2 of cleanrooms. • Pumping 250 l/s of fluid. • Conditioning 120 m³/s of fresh air. • Exhausting 40 m³/s of air. • Approximately 11 GW energy pa • 7.8 M kWhrs for electricity • 3.2 M kWhrs for gas

Tyndall - Operational numbers 500+ researchers & engineers, • students, support staff Approx 250 staff, the rest are students/ o postdocs 51 nationalities • ca. €38M Income each year • 85% of which is competitively won o 25% industry funding o Over 200 industry partnerships and • customers worldwide 230+ peer reviewed publications pa • 22 EU H2020 projects • 20 Industry Researchers-in-Residence • ISO 9001; ISO 500001; ISO 17025 •

Tyndall Growth Plan • Identified as part of the National Development Plan “We will … upgrade and expand the Tyndall National Institute in Cork to stay at the forefront of new technologies and build on its successful industry engagement model in sectors such as health and life sciences, ICT, energy and agri- tech.” - Government of Ireland, National Develop Plan 2018 - 2027 • Involves ~ €50M capital upgrade and the construction of an addition building • Designed to facilitate a doubling in size as part of Tyndall 2025 strategic plan

Elements of the core equipment upgrade plan Building the case – need simple message 1. Clarifying existing and identifying emerging research 2. themes and alignment with national thematic centres – eg CONFIRM – Smart Manufacture Mapping to capability requirements 3. Prioritisation 4. Procurement 5. Review and revise 6.

Equipment audit & obsolescence Capital status in fab areas Capital item YOP 2012 2013 2014 2015 2016 2017 2018 2019 2020 2021 2022 Wafer / device pre- and post conditioning Semitool SRD 1991 6" Semitool <1995 4" Semitool <1995 Rapid thermal Anealler AST SHS 1000 RTP 1991 Bio Rad benchtop furnace <1995 Carbolite Furnace 1991 Capital status in fab areas KARL SUSS SCRIBER 1991 Semitool SAT (Spray Acid Tool) 2004 Jet first rapid Thermal Annealer (Jet first 150) 2010 Laser Dicer 2013 Capital item YOP 2012 2013 2014 2015 2016 2017 2018 2019 2020 2021 2022 Material deposition 1992 ELECTROTECH DELTA PECVD Nordiko Sputterer 2550 1991 Furnace A STACK 1991 FURNACE B STACK 1991 1991 FURNACE C STACK Furnace D STACK 1991 Ion Implanter 1991 Wafer / device pre- and post conditioning Nordiko Sputterer <1995 PECVD, STS 310 PC , Doped and undoped oxides 2001 STS Multiplex CVD 2005 Sputterer - PlasmalabSystem400 - Oxford Instrument 2005 Semitool SRD 1991 Temscal 2005 6" Semitool <1995 Fiji F202DCS System ALD 2009 EVG 501 Bonder 2009 4" Semitool <1995 Thermco 6" Furnace 2010 AML Bonder 2010 Rapid thermal Anealler AST SHS 1000 RTP 1991 EVG 301 Cleaner bonder 2012 SCIL Embosser 2012 Bio Rad benchtop furnace <1995 Temescal installed in 2012 2012 Leybold Optics Syrus Pro Evaporator 2013 Carbolite Furnace 1991 Wafer / device patterning KARL SUSS SCRIBER 1991 Canon 600 aligner Main Fab 1991 Semitool SAT (Spray Acid Tool) 2004 Ultratech 1500 1X Stepper 1991 Jet first rapid Thermal Annealer (Jet first 150) 2010 Mask Plate Cleaner 1991 DNS Resist Develop Tracks 1991 Laser Dicer 2013 DNS SOG Tracks 1991 SUSS MICROTEK- Mask Aligner MA 1006 III-V <1995 IMP Direct write <1995 DNS Tracks <1995 Material deposition EVG 420 <1995 JEOL JBX6000 FS/E electron beam lithography tool 2001 Suss MA6 DUV aligner III-V 2010 1992 ELECTROTECH DELTA PECVD Material removal Nordiko Sputterer 2550 1991 Matrix Asher 1992 PLASMOD ASHER IIIV-E33 <1995 Furnace A STACK 1991 Trikon ICP Etcher Metal Etch 2001 Trikon M0RI Etch Silicon and Oxide 2001 FURNACE B STACK 1991 Trikon PERIE Etcher Nitride and Oxide 2001 FURNACE C STACK 1991 Multiplex Ion Etcher (ICP) 2005 STS ASE / AOE 2005 Furnace D STACK 1991 CHEMICAL DELAYERING & PLANARIZATION (LOGITECH) 2007 ICP - PlasmalabSystem100 - Oxford Instruments 2009 Ion Implanter 1991 PLA Asher 2010 Diener Asher 2011 Nordiko Sputterer <1995 Oxford PlasmaPro ICP Etcher 2013 PECVD, STS 310 PC , Doped and undoped oxides 2001 Material / device metrology & analysis 2005 STS Multiplex CVD CV Plotter 1998 Sputterer - PlasmalabSystem400 - Oxford Instrument 2005 Prometrix Omnimap RS35 1991 Profileometer P-15 1991 Temscal 2005 Nanospec <2000 Nanometrics Thin Film AB63+AB55 III-V <2000 Fiji F202DCS System ALD 2009 Tencor Surfscan 4500 2000 Nanospec 3000 2002 EVG 501 Bonder 2009 Gaertner Elipsometer in Fab 2008 Nikon Line Measurement Equipment 2008 Thermco 6" Furnace 2010 Dektak Profiler 2009 Woollman Ellipsometer 2010 AML Bonder 2010 SEM in Block C Cleanroom 2011 Dektak (Mems) 2011 EVG 301 Cleaner bonder 2012 Jeol SEM 6610LV 2012 JEOL SEM 6490LV 2012 SCIL Embosser 2012 Temescal installed in 2012 2012 Material / device functional test Cascade semi-automatic prober 2006 Leybold Optics Syrus Pro Evaporator 2013 Precision oscilloscope 2006 Autogarde cascade prober 2007 PNA & Multimeter Head Controller 2007 Wafer / device patterning Picofox automatic spectrometer 2008 Manual prober 2008 Device Forensics - reliability, packaging, DPA, analysis Canon 600 aligner Main Fab 1991 Reliability Test equipment 1995 Ultratech 1500 1X Stepper 1991 Royce Pull Tester 1995 Microsectioning equipment 2000 Mask Plate Cleaner 1991 Decapsulation tool 2001 Logitech PM5 Grinder 2002 DNS Resist Develop Tracks 1991 Dicing Saw 2004 Scanning acoustic microscope 2015 DNS SOG Tracks 1991 CT scanning X-ray 2015 SUSS MICROTEK- Mask Aligner MA 1006 III-V <1995 Infrastructure IMP Direct write <1995 Spectron Gas Cabinets 1991 DI plant - various vintage on parts. <1999 DNS Tracks <1995 Block A air handling units almost at full capacity - limited abilit2008 EVG 420 <1995 JEOL JBX6000 FS/E electron beam lithography tool 2001 Age Service status Suss MA6 DUV aligner III-V 2010 Being depreciated - less than 7 years old Full backup available 7 Out of warranty but servicable - 5 year window Some backup available Age Service status Thanks to Kay Gastinger at NTNU for the format Being depreciated - less than 7 years old Full backup available Old / Obsolete - over 12 years old Out of warranty but servicable - 5 year window Some backup available No or very limited backup available Old / Obsolete - over 12 years old No or very limited backup available

Inputs to capability requirements #3 Stakeholder input & roadmapping - outlines 5-10 year time horizon Tooling choices #2 Current & upcoming 1-5 years procurement project activities - horizon defines 1-5 year 1-15 year operational requirements horizon #1 Equipment audit & obsolescence Immediate – 5 year view 8

Current capability areas 3 lines in 2 cleanrooms • CMOS – 4” line, cassette to cassette operation o MEMs line – 4” with some 6” tooling. Manual wafer processing o Compound Semiconductor (III-V) line – pieces, 2”, 3” wafers and 6” - o 8” Si for heterogeneous integration. Manual processing Flexible fabrication protocols but needs strict rules on traffic flow • through/from the different lines Direction of traffic is CMOS ↔ MEMs → III -V o Decision to move tooling to 8“ capable • Better tooling available – 4” & 6” tooling becoming legacy product or o niche Supports higher TRL agenda o Aligns with commercial partners – ease of downstreaming and direct o wafer exchange Does not preclude processing smaller wafers if necessary o 4” silicon becoming harder to source o 9

Input #2 Current & upcoming project activities Existing programmes (1- 4 year time horizon) • EU & ERC o SFI PI awards and new/existing centres o EI – Enterprise Ireland o Commercial o Currently >250 research contracts with combined value >€150M • Submitted proposals (2-6 year time horizon) • EU & ERC o SFI PI awards and renewal of existing centres o 80 pro roposals submitte ted and awaiti ting a fu funding decis ecision with ith a va valu lue • of >€62M Provides themes for existing programmes (1-5 years) • 10