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PCB CB B ACKD CKDRIL ILLING
I MPEDANCE D ISCONTINUITIES R EFLECT E NERGY
15 mil stub length Overview of Backdrilling, Gisin and Stepinski, Sanmina-SCI
6.25 Gb/s estimates
• • • •
Stackup and Construction Technique Determine the Via Construction
Foil – Multi-laminations Cap – Single Lamination
Stac acke ked Stag agger ered Las aser er F Formed Vias ias
Dry Electr Laminate Drill Strip Etch Mask oplate All Mechanical Vias are Created in a through-hole process. Through Hole Vias become blind and buried after lamination
Core Manufactured Copper-clad fiberglass More Fiberglass / Less Resin Better Signal & Power Integrity Less Z-Axis variation Prepreg Fiberglass and Uncured Resin / no copper Less Fiberglass / More resin More Z-Axis Variation
• • README M48 M48 T HERE ARE 2 CONTROL -D EPTH D RILL F ILES ; C ONTROL D EPTH D RILL F ILE 1 OF 2 ; C ONTROL D EPTH D RILL F ILE 2 OF 2 M AXIMUM S TUB L ENGTH 10 MILS ; D RILL L AYER 1-11 D O N OT C UT 12 ; D RILL L AYER 1-5 D O N OT C UT 6 FMAT, 2 FMAT, 2 I NCH I NCH T1C0.0140 T1C0.0140 % T2C0.0100 G90 % G05 G90 T1 G05 X3.082Y2.754 T1 X3.234Y4.711 X5.549Y2.201 X2.934Y2.223 X5.549Y2.221 X3.293Y1.137 T2 X3.247Y0.284
E LIJA JAH @R @R OYA YAL C IRC ITS . COM IRCUIT COM
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