TF Si module processing PVMD Arno Smets Delft University of Technology
Device structure a-Si:H superstrate p-i-n solar cell Glass TCO P3 a-Si P2 P1 p-i-n Back contact
HyET solar flexible module Al foil
HyET solar flexible module Al foil TCO Atmospheric pressure CVD deposition
HyET solar flexible module Al foil TCO a- Si:H PECVD
HyET solar flexible module Al foil TCO a- Si:H back contact Sputtering deposition
HyET solar flexible module Al foil TCO a- Si:H back contact Series connection
HyET solar flexible module Al foil TCO a- Si:H back contact carrier foil Lamination of carrier foil
HyET solar flexible module TCO a- Si:H back contact carrier foil Etching of temporary foil
HyET solar flexible module TCO a- Si:H back contact carrier foil Contacting and cutting
HyET solar flexible module encapsulant TCO a- Si:H back contact carrier foil encapsulant Encapsulation of modules
a-Si:H superstrate p-i-n solar cell Glass TCO a-Si p-i-n Back contact encapsulant TCO a- Si:H back contact carrier foil encapsulant
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