PICS project Project at a Glance Future of integrated capacitors → New generation of high density 3D integrated capacitors → Develop adequate industrial tools (batch ALD, etching) Funded by FP7-SME → 2 years program → 1M € of EU contribution Consortium → 3 SMEs from France, Germany and Finland → 2 RTD from France and Germany
PICS project Context Offering solutions for highly integrated and high performances electronic modules → Target high-end markets like medical or aeronautics … Technological gap for IPDiA's PICS capacitors → Higher density, higher voltage of use, long terms reliability Choice of ALD deposition → Develop the associated tools (batch, etching) to get an industrial solution
PICS project Main Goals / Objectives Develop a new generation of integrated capacitors → World record 500nF/mm² capacitors into silicon → High stability and reliability, low leakage → New dielectric deposited by ALD → ALD batch equipment to reduce cost-of-ownership → Leading edge technology for thick high-K materials Assess the manufacturability → Develop adequate industrial tools (batch ALD, etching) → Reliability studies
PICS project Concept Find suitable dielectric stacks to Integration of the new fulfill High Density and High Voltage dielectric into the IPDiA process requirements with less changes as possible Deposition by ALD into 3D trench capacitors with the right Start a qualification procedure thickness and composition to ensure long term reliability Cost effective batch ALD tool and high-k dielectric etching tool, compatible with 6’’ IPDiA process
PICS project Main achievements IPDiA's specs fulfilled for all applications → Developments of suitable dielectric stacks and their integration into 3D trench capacitors → Miniaturization in medical domain : 500nF/mm² , V bd > 12V → Miniaturization in harsh environment (industrial, automotive) : 150nF/mm² , V bd > 25V Picosun tool ready for batch processing → Better uniformity, step coverage, throughput, material properties ... High-K etching process transfered to Sentech tool and ready for exploitation
PICS project IPDiA Independent Company located in Caen, Normandy, France Dedicated to manufacturing of leading edge Integrated Passive Devices 15 M € revenues, 100 people and operating own Silicon wafer fab Strong R&D team and collaborations with leading research institutes
PICS project Picosun
PICS project Sentech
PICS project CEA-Leti Research and technology institute located in Grenoble, France Create innovation and transfer it to industry 1700 employees, 250M € budget, 8000m² clean rooms, 500 process tools Activities in energy, healthcare, IT, defence and security
PICS project Fraunhofer IPMS-CNT Located north of Dresden, next to semiconductor manufacturers Globalfoundries, Infineon, X-Fab Research and development for micro- and nanoelectronics manufacturing → Nanopatterning, High-k-based Devices, Interconnects 8 M € budget, staff of 51
PICS project Contact Information Charlotte JENNEQUIN - IPDiA Phone: +33(0)2 31 535 400 2 rue de la girafe 1400 Caen France http://www.fp7-pics.eu The PICS project has received funding from the European Union's Seventh Framework Program managed by REA-Research Executive Agency http://ec.europa.eu/rea (FP7/2007- 2013) under grant agreement n° FP7-SME-2013-2-606149.
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