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KSTAR Conference and Fusion Science Workshop, Muju, Feb 24-26, 2014 1 Investigation of High Current Induced PFC Interlayer Failure and Development VDE Simulator using Transferred Arc Torch Jin Young Lee, Hyun-Su Kim, Sun-Taek Lim, Younggil Jin,


  1. KSTAR Conference and Fusion Science Workshop, Muju, Feb 24-26, 2014 1 Investigation of High Current Induced PFC Interlayer Failure and Development VDE Simulator using Transferred Arc Torch Jin Young Lee, Hyun-Su Kim, Sun-Taek Lim, Younggil Jin, Jae-Min Song and Gon-Ho Kim Department of Energy Systems (Nuclear) Engineering, Seoul National University, Seoul 151-741, Korea Plasma Seoul National University Application Department of Nuclear Engineering Laboratory

  2. Vertical Displacement Event in Tokamaks 2 [1] Thermal quenching [high heat flux] Current quenching [Halo current] J halo xB damage Runaway electron damage • Halo current at VDE - ITER : ~ 8 MA (limitation) - JET : ~ 3.5 MA - ASDEX : ~ 700 kA Heat flux : ~ GW/m 2 Current flux : 20 ~ 200 MA/m 2 During VDE Plasma Seoul National University Application Department of Nuclear Engineering [1] ITER physics expert group on disruption, Nucl. Fusion 39. 2251. (1999). Laboratory

  3. Void Generation by High Current Flux on Heterogeneous Bond [2] 3 e e  e e e e e Intermetallic compound Vacancy Void For CW current (Electric device, minor ELM) For Pulse current (major ELM, VDE)   d       d n n     m 1      R n t J t J  dt dt • Void relaxation factor   d      TTF    c n t J t d t K    MTTF R 0 0  DC MTTF          pulse DC      a 1 D a D 1 e 1 e    D 1       a Time to failure (TTF) is a function of current flux, a D 1 e   J(t) and background void character, R( δ )  Higher temperature, pulse duration in Tokamak case Plasma Seoul National University Application [2] J. Tao, et. Al., Phys. Symp., pp. 338-343. (1992), Department of Nuclear Engineering Laboratory

  4. Interlayer Void Formation Effect on PFC Life Time 4 [3] [4] • IGBT bridge joint (~ MA/m 2 ), 180 o C • High current flux [> MA/m 2 ] enhance heterogeneous bond material diffusion  intermetallic compound formation  void generation • Void transient to interlayer crack by thermal stress at the heterogeneous bond vicinity Plasma Seoul National University [3] Miyazaki, T. et el., Microelectronics Reliablity, Vol. 46,pp. 1898-1903, (2006). Application [4] R. Mitteau, 5rd Karlsruhe International school on fusion technol. Department of Nuclear Engineering Laboratory

  5. Experimental Setup for Simulate Current Quench on PFC 5 A 8000 Pulse current profile 6000 Current [A] 4000 W Cu 2000 W C 0 -0.50 -0.25 0.00 0.25 0.50 Time [msec] I Pulse high current ~ 10 kA ~ 200 μ sec (1/10 of current quench time) W Graphite Pulse I Current flux : 0.1, 1 GA/m2 Cycle : 100 cycle (10 cycle of VDE) Plasma Seoul National University Application Department of Nuclear Engineering Laboratory

  6. Heterogeneous Bond Fracture by Current Quench : W-Graphite 6 Pristine 0.1 GA/m 2 1 GA/m 2 X 1k Graphite Graphite Titanium Titanium Graphite Tungsten Tungsten Titanium Tungsten • High current flux induced W-Ti-Graphite blazed specimen in room temperature condition • Bond material (Ti) diffusion is observed Plasma Seoul National University Application Department of Nuclear Engineering Laboratory

  7. Heterogeneous Bond Fracture by Current Quench : W-Cu 7 0.1 GA/m 2 1 GA/m 2 Pristine X 1k X 5k • High current flux induced W-Cu blazed specimen in room temperature condition • Only current quenching condition of VDE is simulated and thermal quenching simulator development is in progress Plasma Seoul National University Application Department of Nuclear Engineering Laboratory

  8. Transferred Arc Plasma Characteristics : SNU-PAL 8 Arc cathode Arc anode Arc operation current-power Anode spot : anode surface 70 60 Voltage [V] • Arc spot characteristic 50 ~ 300 A, 10 kW Heat flux : ~ 1 GW/m 2 - - Current flux : ~ 1 GA/m 2 40 transferred plasma method 30 60 80 100 120 140 Current [A] Plasma Seoul National University Application Department of Nuclear Engineering Laboratory

  9. Thermal and Current Quench Simulator Development by Swept Arc Spot 9 Auxiliary pulse magnetic field Target Arc spot swept by auxiliary pulse B-field - ~ GW/m 2 , GA/m 2 spot sweep • Force balance for arc sweep ρ = 10 22 #/m 3         E = ~ 5x10 3 V/m ( ) F e E v B f E J B J = 10 9 A/m 2  F F To diffract 45 o , electric force Lorentz        19 22 3 3  1.6 10 C 10 #/ m 5 10 V / m E     B 0.8 mTesla 80 G 9 2 J 10 A m / Required auxiliary B-field Plasma Seoul National University Application Department of Nuclear Engineering Laboratory

  10. Design of Pulse Magnetic Field Coil for Arc swift 10 • Auxiliary magnetic field coil design 1 kA • Pulse magnetic field measurement 80 Pulse magnetic field B-dot probe 60 B-field [G] 40 20 0 Auxiliary coil -20 0 20 40 60 80 100 Plasma Seoul National University Time [  sec] Application Department of Nuclear Engineering Laboratory

  11. Summary 11 • Current quench damage on PFC is simulate by pulse current source : 0.1, 1 GA/m 2 , 200 μ sec 100 cycle in room temperature condition to evaluate PFC damage on ITER VDE condition • Bond material (Ti) diffusion is observed in W-Ti-Graphite specimen and analysis the effect of electro-migration on material diffusion is in progress • In particular W-Cu intermetallic compound is not observed in 0.1, 1 GA/m 2 flux, 200 μ sec pulse 100 cycle in room temperature. • Thermal and current quench simulator development using transferred arc torch facility in progress - Auxiliary magnetic coil is designed and coil installation in transferred arc torch is in progress Plasma Seoul National University Application Department of Nuclear Engineering Laboratory

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