CONTACT: sales@linteqsrl.it +39 0331 1587978 CABLE Production Cable production for electronics wiring can be set for every typology of device. We produce from simple flat cables up to complex structures, following with care the development of the most innovative technologies and selecting the highest quality products and brands. A fully equipped production plant is dedicated to ribbon cable cut and manual/electrical crimping, completed by a machine for 100% cable testing. Available connectors to crimp such as dsub.transition, female perforated insulation. Tests and reliability All our cables are 100% tested with a machine detecting every connection defect to ensure best quality. For a better identification of cables, labeling inkjet or laser markings are available.
CONTACT: sales@linteqsrl.it +39 0331 1587978 PCB Production From simple 1layer boards to complex multilayers; rigid, flexible and aluminium boards. Press-fit holes, sequential buildup, heavy copper, controlled impedance, carbon inks, edge connectors and special requirements. Every product type and size has its own specialized range of production lines and a dedicated staff to follow each batch closely. For this reason we can offer prototype service, HMLV production, as well as customized long term programs and buffer stock solutions. PCB are manufactured according to the highest quality level rules and IPC standard, they follow certification requirements such as ISO, UL, RoHS, REACH,etc. Quality Our quality policy requires the control of each batch during production through a system that manages the on-time progress of the main steps, completed with the final incoming controls. Before delivery, each batch passes through our strict incoming tests. Only the batches compliant to the high level quality standards can reach the customers’ place.
CONTACT: sales@linteqsrl.it +39 0331 1587978 LABORATORY Reliability and material analysis Thanks to our close cooperation with cutting-edge laboratories we can offer a wide range of simulations and final tests. RELIABILITY - CLIMATIC CHAMBERS: thermal shock or cycles, T/HR + electrical feeding, vibration + shock, salt spray fog - PULL & SHEAR TEST: tocompare solder joints reliability before and after simulation - T.I.C.: to check contaminations presence after pcb production or after assembling process - IONIC CHROMATOGRAPHY to check specific contaminations MATERIAL ANALYSIS We can perform proper tests with : - TGA: water absorption - DMA: TG measurement - TMA: CTE measurement - DSC: materials polymerization, HAL melting temperature Qualification and failure analysis We can provive several tests to ass ess assembled products’quality : - X-RAY INSPECTION/ TOMOGRAPHY: to check solder circuits, solder balls, alloy residues, macro-cracks in solder alloy, open tracks. - MICRO-SECTIONS: to check micro-crack in solder alloy, voids, intermetallic growths, solder joints compliance to IPC standards - IONIC CHROMATOGRAPHY: to check specific contaminations
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