An X-band System-in-Package Active Antenna Module 96868804 - PowerPoint PPT Presentation

國立台北科技大學電資學院碩士在職專班 書 報 討 論 An X-band System-in-Package Active Antenna Module 學 生：李景堯 學 號：96868804 ２００８年３月８日

Agenda � Abstract � Introduction � Overview Of 3-LAYER Package � Transceiver Architecture And Specifications � Measurement Results For The Passive Antenna � Transmit-Receive Measurements � Conclusion 2

Abstract SiP Antenna SiP Antenna � Development of a low cost, compact RF front end SiP solution for X-band. � A printed antenna is integrated with a multilayer BGA package using low cost laminate substrates. � Can help mitigate the feed network losses and phase errors. 3

Introduction � System-on-Chip (SoC) is another technique that aims at achieving the total system integration in a single unit by integrating all the system functionalities in one single wafer process. 4

� The system-on-package (SoP) approach developed by Georgia Institute of Technology achieves the system integration in a similar way as SiP. APM BT+ WiFi Samsung WiFi Samsung BT 5

� The system-in-package (SiP) concept seeks to integrate multiple ICs along with other system components like passives, interconnects and antenna into a single functional package. � X-band SiP solution where the radiating element has been successfully integrated with the transmit/receive ICs in a 3-layer, low cost package. The module utilizes currently available low cost substrates and discrete passives. 6

Overview of 3-Layer Package 20 mil RTDuroid5880 ( ε r = 2.2, tan δ = 0.001) 5 mil GETEK ( ε r = 3.9, tan δ = 0.01) 31 mil GETEK 62 mil FR-4 ~ 10 7 � A couple dollars 7

Transceiver Architecture And Specifications Conductive silver epoxy and Wire bonds High cost GaAs ICs SiCMOS or SiGe ICs 8

Measurement Results For The Passive Antenna (PCAAD 5.0) Estimate: 7.3 dB and 89.4% efficiency 6.4 dB (gain of 6.8 dB) Efficiency of 81.3% Solder ball transitions between 10.2 GHz the motherboard and the package and the wire bond connections inside the package The patch showed a return loss of around 25 dB before and after it was mounted on the motherboard. 9

Transmit-Receive Measurements 10

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A. Receiver Measurements IF for the receiver : 300 MHz 23.9 dB LO frequency : 10.5 GHz Estimated gain : 25 dB Measured gain : 23.9 dB 10.2 GHz Upper sideband image rejection (at 10.8 GHz) of 12 dB 12

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14 Transmitter chain was 17.3 dB B. Transmitter Measurement 10.2 GHz 17.3 dB

Conclusion � An inexpensive, highly integrated X-band active antenna element has been demonstrated. � The packaging scheme utilizes the currently available low cost laminate substrates and BGA technique to achieve the integration of the entire transmit and down-converter chain with an antenna. � The measured gain of the active element is comparable to the estimated gain in both the modes, thus showing that packaging does not affect the IC performances drastically. � The central short used in the package helps suppress package resonances in the desired X-band as well as improves the isolation within the package. 15

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