9 th International Congress M Molded Interconnect Devices th – 30 th , 2010 September 29 t Nuremberg – Fu uerth, Germany A Fluidic 3D-MID Fabricate ed by a New LDS Compatible Sacrificial 2K-Process with Thermal Management of a Power-LED as an A P LED A pplication Example li i E l sch * and Bertram Schmidt ** Thomas Leneke * , Sören Hirs * TEPROSA A, ** IMOS , Otto-von-Guericke U niversity Magdeburg P.O. Box 4120, 39016 Magdeburg, Germany
Introduction Dipl.-Ing. Thomas Leneke Tel: +49 (0) 391 / 67-18228 Otto-von-Guericke-University y of Magdeburg eMail: thomas.leneke@teprosa.de Chair of Microsystems Introduction TM & 3D-MID MEMS Packaging Reliability Proof of Concept Core Competenc ces Embedded Ducts Results 3D MID Activi 3D-MID Activi ities ities Outlook Outlook Research Research Equipment Equipment Service Service • 1K/2K Injection Molding • Reliability of Chip on MID/Flex • Consultation/Conceptual D Design • MEMS on MID • LDS/Hot Embossing/Aerosol Structuring • Simulation/CAD • PVD/Galvanic/Electroless Metallization • Product Miniaturization by MID • Prototyping/Pilot Run • Medical MID Systems • Soldering/Wire-Bonding/Flip-Chip • Testing/Qualification Connection • MID Sensor Structures • MID Sensor Structures Fluidic 3D-MID • Thermal/Electrical/X-Ray Testing MID 2010 Sept. 29 th , 2010, Fuerth, Germany Slide 2
Introduction – 3D-MID D Spectrum Dipl.-Ing. Thomas Leneke Tel: +49 (0) 391 / 67-18228 eMail: sensor-substrates optical transceiver thomas.leneke@teprosa.de hearing aid camera module MECHANIC antenna LED package OP TIC GEOMETRIC Introduction TM & 3D-MID Proof of Concept ELECTRIC ELECTRIC Embedded Ducts Results Outlook Outlook FLUI IDIC MAGNETIC Slide 3 ? ? flow sensor (microvalve) inclination sensor Fluidic 3D-MID MID 2010 Sept. 29 th , 2010, Fuerth, Germany
Introduction – Technology y Demonstrator Dipl.-Ing. Thomas Leneke Tel: +49 (0) 391 / 67-18228 eMail: thomas.leneke@teprosa.de Touch Sensor 3D-Metallization (LDS) Introduction SMD TM & 3D-MID Proof of Concept Embedded Ducts Flip-Chip Results Power Supply Outlook Outlook C Channels Channels Multilayer Fluidic 3D-MID MID 2010 Sept. 29 th , 2010, Fuerth, Germany Slide 4
Introduction – Fluidic c & 3D-MID Dipl.-Ing. Thomas Leneke Tel: +49 (0) 391 / 67-18228 eMail: thomas.leneke@teprosa.de Applications: chemical, life sciences, autom motive thermal management Introduction TM & 3D-MID only straight Requirements: tubes, channels, cavities Proof of Concept Embedded Ducts sealing, plugging, connecting g by injection molding Results I/O ports, nozzle by injection molding Outlook Outlook hybrid [1,2] valves, pumps, sensors Limitations: injection molding, material [1] Munz et al [1] Munz et. al., A 3 A 3 3/2 Normally Closed Polymer Piezoelectric Microvalve 3/2 Normally Closed Polymer Piezoelectric Microvalve with Integrated MID Electronics, MID Conference 2002 Fluidic 3D-MID [2] Warkentin et. a l., Miniature Flow Sensor Systems and Accelerometers MID 2010 Based on MID, MID Conference 2002 Sept. 29 th , 2010, Fuerth, Germany Slide 5
Thermal Managemen t & 3D-MID Dipl.-Ing. Thomas Leneke Cooling Metho C li M th ods d Tel: +49 (0) 391 / 67-18228 eMail: thomas.leneke@teprosa.de Introduction TM & 3D-MID Proof of Concept Embedded Ducts Results Outlook Outlook Fluidic 3D-MID MID 2010 Source: Advanced Electronic Packaging ISBN: 100-471-466093 Sept. 29 th , 2010, Fuerth, Germany Slide 6
Thermal Managemen g t & 3D-MID Dipl.-Ing. Thomas Leneke Tel: +49 (0) 391 / 67-18228 Materials eMail: thomas.leneke@teprosa.de Vectra Pocan DP unit water copper E820i LDS T7140 LDS Introduction ⎡ ⎤ g TM & 3D-MID 1.79 1.75 0.99 8.92 density ⎢ ⎥ cm³ ⎣ ⎦ Proof of Concept Embedded Ducts tensile [ ] 9000 12000 - 120000 MPa modulus Results Outlook Outlook melt [ ] 335 255 0 1084.4 ° C temperature ⎡ ⎡ W ⎤ ⎤ W thermal 0.26 0.3 0.59 381 ⎢ ⎥ ⋅ K m ⎣ ⎦ conductivity Fluidic 3D-MID MID 2010 Sept. 29 th , 2010, Fuerth, Germany Slide 7
Thermal Managemen g t & 3D-MID Dipl.-Ing. Thomas Leneke Tel: +49 (0) 391 / 67-18228 Demonstrato or eMail: thomas.leneke@teprosa.de Introduction TM & 3D-MID Proof of Concept Embedded Ducts Results Outlook Outlook Fluidic 3D-MID MID 2010 Sept. 29 th , 2010, Fuerth, Germany Slide 8
Thermal Managemen g t & 3D-MID Dipl.-Ing. Thomas Leneke Tel: +49 (0) 391 / 67-18228 Improved Demon nstrator eMail: thomas.leneke@teprosa.de Introduction TM & 3D-MID Proof of Concept Embedded Ducts Results Outlook Outlook Fluidic 3D-MID MID 2010 Sept. 29 th , 2010, Fuerth, Germany Slide 9
Proof of Concept - S p Setup p Dipl.-Ing. Thomas Leneke Tel: +49 (0) 391 / 67-18228 eMail: thomas.leneke@teprosa.de • integration of the 3D-MID in a cooling circuit Introduction • measurement of liquid flow, t f li id fl reservoiur temperature & TM & 3D-MID LED temperature Proof of Concept Embedded Ducts Results Outlook Outlook pump reservoir, radiator Fluidic 3D-MID MID 2010 Sept. 29 th , 2010, Fuerth, Germany Slide 10
Proof of Concept - S p Setup p Dipl.-Ing. Thomas Leneke Tel: +49 (0) 391 / 67-18228 eMail: thomas.leneke@teprosa.de - T-type thermocouple is used to determine LE ED temperature - silicon seal is opened to establish thermal co ontact to the LED chip - LED forward current is varied between 300 – – 600 mA Introduction TM & 3D-MID Proof of Concept Embedded Ducts Results Outlook Outlook Fluidic 3D-MID Test setup to determine the LED temperature with a thermocouple. The tip of the thermocouple is inserted MID 2010 in the silicon seal. Sept. 29 th , 2010, Fuerth, Germany Slide 11
Proof of Concept - R p Results Dipl.-Ing. Thomas Leneke Tel: +49 (0) 391 / 67-18228 eMail: thomas.leneke@teprosa.de - measurements of the LED Introduction temperature at various currents temperature at various currents - thermal management with and TM & 3D-MID without thermal via support Proof of Concept Embedded Ducts Results Outlook Outlook ∆ T via shows the temperature - difference between the active difference between the active cooling with and without thermal vias Fluidic 3D-MID MID 2010 Sept. 29 th , 2010, Fuerth, Germany Slide 12
3D-MID Embedded C Channels Dipl.-Ing. Thomas Leneke Tel: +49 (0) 391 / 67-18228 Previous Utiliza ation eMail: thomas.leneke@teprosa.de • connection of single channels by flexible tu bes • difficult handling due to snapping tubes Introduction • manual gluing is difficult and time consumin ng TM & 3D-MID • unnecessary long channel increases pressu ure drop Proof of Concept Embedded Ducts Results Outlook Outlook → new integrated solution i → new integrated solution i is desirable !! is desirable !! Fluidic 3D-MID MID 2010 Sept. 29 th , 2010, Fuerth, Germany Slide 13
3D-MID Embedded C Channels Dipl.-Ing. Thomas Leneke Tel: +49 (0) 391 / 67-18228 Fabrication Pro ocess eMail: thomas.leneke@teprosa.de To create MID-embedded channel structure To create MID embedded channel structure es for fludic applicatoins a es for fludic applicatoins a new overmolding 2K-process is developed. Introduction LDS TM & 3D-MID OVERMOLD CREATE REMOVE 2K Proof of Concept WITH COMPONENT 1 COMPONENT 1 COMPONENT 2 Embedded Ducts LSS Results … Outlook Outlook Fluidic 3D-MID MID 2010 Sept. 29 th , 2010, Fuerth, Germany Slide 14
3D-MID Embedded C Channels Dipl.-Ing. Thomas Leneke Tel: +49 (0) 391 / 67-18228 Component A Requ uirements eMail: thomas.leneke@teprosa.de • mallable to the desired shape p • withstand overmolding process (tempera ature, pressure) • removable (selectively to component B) ( y ) Introduction LCP-LDS TM & 3D-MID Component A Solvent candidate compatible? Proof of Concept PBT Phenol Yes Embedded Ducts PSU Toluol No Results PPE Phenol Yes Outlook Outlook PGA NaOH Yes Brass Cu HNO 3 +HCL Yes Steel T Test results of the chemical solubility of t lt f th h i l l bilit f Fluidic 3D-MID various polymers and metals and their compatibility to the LDS process. MID 2010 Sept. 29 th , 2010, Fuerth, Germany Slide 15
3D-MID Embedded C Channels Dipl.-Ing. Thomas Leneke Tel: +49 (0) 391 / 67-18228 Component B Over rmolding eMail: thomas.leneke@teprosa.de Material: Vectra E820i LDS Proce ssing + very low viscosity • inje ection pressure (up to 100 MPa) Introduction + chemical resistant h i l i t t • inje i j ection speed (up to 40 ccm/s) ti d ( t 40 / ) TM & 3D-MID � expensive • inje ection temperature (320 °C) Proof of Concept Overmolding Issues Embedded Ducts Results Outlook Outlook velocity pressure time to freeze extreme environment for com extreme environment for com mponent A to resist mponent A to resist Fluidic 3D-MID MID 2010 Sept. 29 th , 2010, Fuerth, Germany Slide 16
3D-MID Embedded C Channels Dipl.-Ing. Thomas Leneke Tel: +49 (0) 391 / 67-18228 Component A Rem moving eMail: thomas.leneke@teprosa.de Introduction TM & 3D-MID Proof of Concept Embedded Ducts Results Outlook Outlook initial condition after 2 days after 5 5 days after 8 days Process sequence of an embedded channel formation by dissolving a sacrificial meta al component. Fluidic 3D-MID MID 2010 Sept. 29 th , 2010, Fuerth, Germany Slide 17
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