Andy Longford Managing Partner PandA Europe ”ELFNET – pointing the way to future standards in Lead- free Electronics” BIOGRAPHY Since 1998, Andy has been a director of PandA Europe, a European technical market consultancy company involved in Semiconductor chip Manufacturing, specialising in Packaging and Electronics Interconnection. He is currently involved in a number of European programs for MEMS package needs and has published a number of technical papers related to chip packaging technology. Andy is the chairman of the UK Industrial Advisory group for work on conductive adhesives. He has been Chairman of the SEMI European Test, Assembly and Packaging (TAP) Standards Committee since 1994 and is currently Co-Chair of the SEMI European Regional Standards Committee and a member of the SEMI International Standards Committee. From 2004, as part of the European ELFNET project, Andy is responsible for coordinating the Industry network activity in Lead(Pb) Free Electronics in Europe. Within SEMI he is now involved with the formation of working groups for the development of Standards in Flip Chip and Wafer level packaging. ABSTRACT ‘ELFNET – European Lead-Free Soldering Network’, is a new European network of national research organisations, technical experts and industry bodies in microelectronics. It aims to provide a platform to coordinate, integrate and optimise lead-free soldering research, thereby enabling electronic producers in the EU to meet the RoHS Directive and face a lead-free future. ELFNET will operate in 19 European countries and is funded by the European Commission. The ELFNET project comprises of a number of work packages, the key ones being the Technical Expert Groups (TEG) and Industry Networks (IN). These groups are charged with determining, collating and prioritising the key research and business issues relevant to the implementation of lead-free soldering technology in Europe. This presentation will explain the working of the ELFNET project and introduce the issues already determined, which in many of the areas investigated indicate a strong requirement for standardisation. Understanding the network capability and using the resources it makes available, will provide a platform for developing and introducing the new standards in lead free electronics in Europe.
CONTACT INFORMATION PandA Europe Lambourn, Berks, RG17 8YP United Kingdom andy@pandaeurope.com www.pandaeurope.com
Pointing the Way to Future Standards in Lead(Pb)-Free Electronics Milan 6 October 2004 Presented by : Andy Longford (PandA Europe) ELFNET WP3 Leader / co-ordinator – Group Leader of Automotive/Industrial IN-2 ELFNET Unit 3 - Curo Park Frogmore St Albans Hertfordshire AL2 2DD United Kingdom Tel +44 (0) 870 458 4242 Fax +44 (0) 870 458 4273 email info@europeanleadfree.net www.europeanleadfree.net ELFNET - European Lead-Free Soldering Network is partially funded by The European Commission Presentation Outline Elfnet history and objectives Elfnet operational structure The Drivers (environment) for Lead Free electronics Lead Free in Semiconductor Devices Elfnet results Benefits expected from Elfnet September 2004 www.europeanleadfree.net 2 1
Elfnet Mission Statement ELFNET [ E uropean L ead F ree soldering NET work] is a European network of national research organisations, technical experts and industry bodies enabling lead-free solutions in micro-electronics. It provides a platform to coordinate, integrate and optimise research to enable electronic producers in the EU to optimise solutions and meet the EU deadline to introduce lead-free soldering in consumer products by 1 July 2006 ELFNET is funded by the European Commission and operates in 19 European countries. By facilitating ‘best practice’, ELFNET will continue to contribute to Europe’s competitiveness in electronics manufacturing beyond 2006 September 2004 www.europeanleadfree.net 3 Development of the Network June 2000 – Alarm over inaction resulted in research & industry meeting Oct 2001 & Oct 2002 – Research review meetings discover massive fragmentation, unknown and outdated projects Industry demands better coordination by RTD’s across member states BUT funding not available EU FP6 Proposal developed Jan-June 2003 December 2003 – Eu agreed €2.3M (230 person-months) over 3 years Start date April 2004 (delayed from Jan 2004) Elfnet Kicked off in Amsterdam – June 2004 September 2004 – Website Launched September 2004 www.europeanleadfree.net 4 2
Project Goal “To urgently coordinate, integrate and optimise the critical mass of European research in lead-free soldering; providing pan-European support for implementation of the RoHS Directive” To a deadline of July 2006 for consumer products To a deadline of 2010 or before for IT-network products To implement lead-free technology in sectors outside scope of RoHS (e.g. automotive, aerospace) To develop Roadmaps for future requirements. September 2004 www.europeanleadfree.net 5 Specific Objectives To focus research – At least 5 new projects worth at least €10 million To refine R&D strategies – 54 meetings – 200 Affiliate members – 100,000 visitors to website To link existing networks – Signposting – Exchange meetings To harmonise knowledge base – Identify every knowledge source and provider – Disseminate for 30 Projects – Translate into local language To provide a focal point – Interface with stakeholders September 2004 www.europeanleadfree.net 6 3
ELFNET Structure Network Steering Committee Technical Expert Groups Industry Networks National Networks Initiate Networks in each Member State Collate State-of-the-Art Feedback Key Industry Issues Provide Hub for link to Europe Identify Priority Areas Benchmark Status Report Implementation Status Nurture Key Projects Connect to Research Base September 2004 www.europeanleadfree.net 7 European Set up … National Networks UK Sweden Germany Greece ITRI IVF TUB IMMG Denmark Belgium Poland France DELTA IMEC PAS ENSEIRB Switzerland Ireland Czech Rep. Spain EMPA INASMET NMRC IPM Finland Italy Slovakia Netherlands HUT PDM SAS TNO Norway Austria Portugal SINTEF UNIVIE ISQ September 2004 www.europeanleadfree.net 8 4
Technical Set up … Technical Expert Groups Solders Assembly ITRI, UK IVF, Sweden University of Wien, Austria DELTA, Denmark Avantec, France IMEC/TFCG, Belgium Celestica, UK Heraeus, Germany Loctite Multicore, UK Solectron Europe, Germany Components Reliability ENSEIRB, France EMPA, Switzerland Shipley Europe, UK IMMG, Greece AMI Semiconductor, Belgium ITRI, UK FCI, France NMRC, Ireland Schneider Electric, France Helsinki University of Technology, Finland Panda Europe, UK Philips, Netherlands Philips, Netherlands Recycling TU Berlin, Germany ITRI, UK Shipley Europe, UK September 2004 www.europeanleadfree.net 9 Industry Set up … Industry Networks Consumer Automotive & Industrial IT &Telecoms Aerospace Includes sectors outside the RoHS Directive Will include many additional ‘Affiliate’ industry partners subscribed to the project September 2004 www.europeanleadfree.net 10 5
The Drivers …. The Environment September 2004 www.europeanleadfree.net 11 General global lead-free initiatives 1991-93 1996-99 2002-2006 DTI project UK EU project IDEALS LEADFREE EFSOT ITRI, Multicore, Siemens, Philips, IMECAT PROTIN IMR GEC-Marconi, Marconi, Multicore, COST 531 LFS-for_SME’s BNR (Nortel) Witmetaal 1992-96 1999-2002 2002-2003 NCMS project USA NEMI project USA NEMI project USA National Centre for North American Follow-up key issues Manufacturing Sciences Electronics Manufacturing Initiative 1994-96 1998-99 2000-02 2001-03 JIEP project Japan NEDO project Japan JIEP project Japan Standards project Japan Lead-free committee JWES, JEITA, EIAJ Low temperature soldering Harmonised test methods 1990 1995 2000 2005 2010 year September 2004 www.europeanleadfree.net 12 6
EU Lead-Free Soldering ‘Activity’ EU Date > 2008 Japan Pressure EU Date < 2006 Alloy Selection Implementation Issues Technology Transfer 1998 2000 2002 2004 2006 2008 September 2004 www.europeanleadfree.net 13 RoHS - Research Lead-Free Status EU research – Originally leading but now fragmented, sparse and late – Funding mechanisms hinder rapid deployment – National boundaries exacerbate lack of coordination Japanese research advanced, US investing $millions First major EU technical conference June 2003, Brussels EU Technical Advisory Committee (TAC) meetings still in progress Final but critical technical issues being addressed only now – Specific process & materials issues – Testing & Compliance – Standards – Technology development for the future September 2004 www.europeanleadfree.net 14 7
Lead-Free Projects - EU Research Technology Transfer IMECAT – Assembly LFS-for SME’s LEADFREE – Reliability GREENROSE DESREL – Reliability LEADOUT EFSOT – Environmental Networks INNOLOT – Harsh Environments COST 531 PROTIN - Tin Whiskers NoNE IMR – Lead-Free Soldering BFE Coordination …… ELFNET September 2004 www.europeanleadfree.net 15 What about Semiconductors ? September 2004 www.europeanleadfree.net 16 8
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