Zhuhai Allfavor Electronic Co., Ltd. The Experienced Flex PCB Supplier
Contents General Information Major Products Inner Operation Process Chart Mfg Capacity Mfg Equipment Operation Detail Company Culture
Group Background Established May, 2005 Headquarters: Allfavor Technology (Hong Kong) Ltd. Factory Locations: Rigid PC Board Manufacturer: - Nanjing Plant: Nanjing Allfavor Electronic Co., Ltd. Focusing on medium and high volume orders - Shenzhen Plant: Allfavor Circuits (Shenzhen) Co., Ltd. Focusing on high mix low volume with quick delivery Flex PC Board Manufacturer: - Zhuhai Plant: Zhuhai Allfavor Electronic Co., Ltd. Focusing on Flex PCB and Flex/Rigid PCB
Group Location Nanjing Allfavor Electronic Co., Ltd. Allfavor Circuits (Shenzhen) Co., Ltd. Zhuhai Allfavor Electronic Co., Ltd. Yunong Park,Sanzao Town, Jinwan District, Zhuhai
Quality System
Zhuhai Allfavor Information Founding Time: Jun 20th, 2005 Registered Capital: 2.5M USD Employees: 100 Marketing Focus: 1. 2 Layer and Multi Layer Flexible PCB 2. Rigid / Flex PCB Website: www.allfavorpcb.com
Quality Policy • Producing High Quality Products • On Time Delivery • Continuous Improvement QMS • Customer Satisfaction
Organization Chart Plant Manager Financial Human Resource Quality Process Technic Production Costs Administration Quality Control Process Control Production Control Cashier Recruitment Document Control Engineering Data Waste Water Chemical/Physical Accounting Training Lab Operation Excellence, Team Work, Objective Driven
Contents General Information Major Products Inner Operation Process Chart Mfg Capacity Mfg Equipment Operation Detail Company Culture
Single Sided FPC “Polyimide film & copper foil to form circuit” - Fujitsu Printer Module - Hollowing Board - Hitachi POS Module - LG PDP Module Application: - Panasonic Motor Module - Camcorder, CDRW cubic element patch - SHARP LCD Module - CD RW drive parts - PDP, Camera Module - Inkjet Printer Head drive parts - Mobile phone electromagnetic wave shielding - Panasonic Digital Camera
Double Sided FPC “Form the circuits on the double sides of the Polyimide film, assemble components on the double sides.” - LCD Module - SONY Digital Cameral - Panasonic Digital Cameral - Car LED Light - Hyundai Car Navigation - EPSON Printer Module - Panasonic Monitor Application: - LCD Module - GM - Military Car Product - Mobile Phone Keypad, Side Key, Camera Module Lamp Module - Car Navigation - LED Light / Flashlight
Multilayers / Rigid FPCB - COMBA - Smart Light - Car Ass’y - 8 layers Rigid FPCB Telecom Module Module Application: - Mobile Phone, Camera CCD Ass’y - CDRW Pick up Ass’y - Medical Device, Health Care Module - Health Care - Medical Device Module Module
Our Customers
Contents General Information Major Products Inner Operation Process Chart Mfg Capacity Mfg Equipment Operation Detail Company Culture
Process Chart Pattern Film FCCL Gerber Data CNC Drilling PTH Pattern Pattern Plotting Dry-Film Film Developing Punching Exposure Film QC DES Cover-Lay Lamination Cover-Lay Die Process Hot-Press Surface Finish Bare Board Test Punching Inspection/QA
Manufacture Capacity 序号 项 目 制成能力 NO NO Item Item Capacity Capacity 层数 1 1-12 layers lay count 类型 FPC & rigid-flex PCB 2 board type 完成板尺寸（最大） 3 500*800mm max final board dimesion 最大板料厚度（双面含铜） 4 0.350mm max FCCL thickness (double side copper) 最小板料厚度（含铜） single side 0.043mm 5 min FCCL thickness (single copper) double side 0.036mm 最小线宽和线距 0.050mm/0.050mm 6 min trace width & space 图形对图形公差 7 ±0.075mm 工艺能力 alignment tolerance technology 图形对孔位精度 capacity 8 ±0.1mm pattern to hole tolerance 蚀刻公差 9 ±20％(min±10%) etching tolerance 阻抗控制公差 10 ±10% impedance control tolerance 金手指最小间距 11 0.075mm min gold finger space 成品厚度公差 (板厚 0.05-0.10mm) 12 ±0.015mm final FPC thickness tolerance (board thk 0.05-0.10mm) 成品厚度公差 板厚0.11-0.2mm 13 ±0.02mm final FPC thickness tolerance (board thk 0.11-0.20mm) 成品厚度公差 板厚0.21-0.40mm 14 ±0.03mm final FPC thickness tolerance (board thk 0.21-0.4mm)
Manufacture Capacity 序号 项 目 制成能力 NO NO Item Item Capacity Capacity 最小钻咀尺寸 0.15mm 15 min hole size 最大钻咀尺寸 16 6.50mm max hole size 钻孔/沉镀铜能力 drill and PTH 钻孔公差 PTH ±0.1mm 17 capacity hole size tolerance NPTH ±0.025mm 位置公差 1st ±0.076mm 18 hole position tolerance 2nd±0.10mm PTH孔最小孔壁铜厚 19 ≥8um min PTH hole wall copper thickness 电镀镍/金厚度 nickel 2-9um 20 nickel gold plating thickness gold 0.025-4.8um 沉镍/金厚度 nickel 2-6um 21 electroless nickel immesion gold gold 0.025-0.16um 表面处理 surface finished 镀锡厚度 22 tin 3-20um tin plating thickness 沉锡厚度 23 tin 0.6-1.2um immersion tin thickness drill ∮0.35mm 最小覆盖膜开窗 24 laser 0.40*0.40mm coverlay min square window mould 0.50*0.50mm 最小覆盖膜开窗间距 laser 0.20mm 25 覆盖膜能力 coverlay min space between windows mould 0.50mm coverlay capacity 覆盖膜对位公差 26 ±0.10mm coverlay shift tolerance 覆盖膜溢胶量 27 ≤0.08mm resin flow
Manufacture Capacity 序号 项 目 制成能力 NO NO Item Item Capacity Capacity 模具冲切尺寸公差 ±0.05mm(precise mould） 28 mould punching dimension tolerance ±0.1mm（general mould） min radius 0.2mm 模具最小方形开窗口 0.6*0.6mm（general mould） 29 min mould cut square window 0.5*0.5mm(precise mould） 模具和激光切割能力 模具最小开窗间距 0.6mm（general mould） mould pnuching 30 and laser cutting min mould cut space between windows 0.5mm(precise mould） capacity 激光切割尺寸公差 31 ±0.05mm laser cutting dimension tolerance 激光切割最小开窗 32 0.30mm laser cutting min square window 激光切割最小开窗间距 33 0.20mm laser cutting min spac between window 飞针测试最薄厚度的板 34 0.05mm min fly probel test board thickness 飞针测试点高低最大落差 35 1.5mm 测试能力 max drop in test electronice test 最小电测焊盘距离 capacity 36 0.15mm min ET pad space 最小电测试焊盘 37 0.20*0.20 mm min ET pad size 最小字符高度 38 0.8mm min legend hight 最小字符宽度 39 0.8mm min legend width 字符最小线宽 40 0.1mm 阻焊/字符能力 min legend trace width solder mask and 字符到PAD/到SMD legend capacity 41 0.2/0.2mm legend to pad/smd space 最小绿油桥宽度 42 0.075mm min solder bridge width 绿油到PAD/绿油到SMD（感光) 43 0.1mm min solder mask to pad/SMD spac
Manufacture Capacity 序号 项 目 制成能力 NO NO Item Item Capacity Capacity single side 4days FPC样品交期 44 double sides 6days FPC sample leadtime multilay 9days 软硬结合样品板交期 45 11days rigid-flex PCB sample leadtime 交付能力 deliver capacity single side 6days FPC量产交期 46 double sides 8days FPC mass production leadtime multilay 12days 软硬结合板量产交期 47 18days rigid-flex PCB mass production leadtime 单面无卤（有胶/无胶） copper 12um/18um/35um/70um 48 single side hanlogen free(2 layer/ 3 layer) PI 12.5um/25um/50um 常用材材 双面无卤（无胶/有胶） copper 12um/18um/35um/70um normal base 49 double side hanlogen free (2 layer/3 layer) PI/12.5um/25um/50um material 覆盖膜规格 PI 12.5/25/50um 50 coverlay specification adhesive 15/25/30/35/50um 纯胶材料规格 51 15/25/30/40/50um adhesive specification PI补强材料规格（不含胶） 52 12.5/15/25/40/50um PI stiffener specification (without adhesive) PET补强材料规格（不含胶） white ：0.05-0.25mm； 53 PET stiffener specification (without adhesive) natural：0.025-0.25mm 辅助材料 auxiliary FR4补强材料规格（不含胶） 0.10-3.5mm 54 material FR4 stiffener specification (without adhesive) 钢片补强 0.10-2.0 mm 55 steel stiffener specification 3M胶纸 56 50um/100um/130um 3M tape specification 屏蔽膜规格 16um/22um 57 shielding film specification
Major Mfg Equipment Parallel Exposure Machine DES Line Quick Press Machine OSP Wash Machine
Major Mfg Equipment Auto Hole Punch Coverlay Cutting Machine Legend Inkjet Printer BBT Machine Punch Machine
Test Equipment CMI Metallurgical Microscopy 3-Dimensional Tester Peel Strength Tester
Test Equipment AOI Flying Probe Tester Low Resistance Tester
Equipment Investment JUL 2015 Drilling OSP Routing CL Cutting Parallel light DES APR FEB DI Water Machine Machine exposure machine Machine Machine Machine BBT Machine Flying Low Legend FPCB Auto Hole Probe Resistance APR Inkjet SEP Inkjet DEC Punch AOI Tester tester Printer Printer 2016 AUG RMB 5M Investment 500
Process Control Sample ： Exposure Sample ： AOI
Process Control Etching Raw Material Store Requirements
Process Control Equipment Check List Power/Water Check List
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