The µ PIC-based neutron imaging detector ( µ NID) for energy-resolved neutron imaging at J-PARC � Joe Parker CROSS � � 15 � MPGD ��� @ ��� 14 December 2018 �
� 15 � MPGD ���� 14 Dec 2018 � J. Parker � RADEN and µ NID development members � JAEA/J-PARC Center Takenao Shinohara Tetsuya Kai Kenichi Oikawa (BL10) Masahide Harada (BL10) Takeshi Nakatani Mariko Sagawa Kosuke Hiroi Yuhua Su CROSS Joe Parker ( µ NID Lead Developer) Hirotoshi Hayashida Yoshihiro Matsumoto Nagoya University Yoshiaki Kiyanagi Kyoto University Toru Tanimori Atsushi Takada ( µ NID development) Taito Takemura Tomoyuki Taniguchi Ken Onozaka Mitsuru Abe
� 15 � MPGD ���� 14 Dec 2018 � J. Parker � Outline � • (Brief) Intro to energy � resolved neutron imaging • Current status of the µ NID at RADEN • Ongoing development • 215 µ m pitch MEMS µ PIC • µ NID with boron converter
� 15 � MPGD ���� 14 Dec 2018 � J. Parker � Energy-resolved neutron imaging at RADEN � • Energy-dependence � Energy-dependent neutron quantitative information on transmission � macroscopic distribution of microscopic quantities Resonance absorption • Pulsed neutrons � wide energy range, accurate energy determination by Bragg-edge, Magnetic imaging time-of-flight • Use time-resolved imaging detectors at RADEN: • Sub-mm spatial resolution • Sub- µ s time resolution � meV � Energy � 1 keV � • Mcps count rate 10 �� Wavelength � 10 -2 �� • Strong background rejection �
� 15 � MPGD ���� 14 Dec 2018 � J. Parker � µ PIC-based Neutron Imaging Detector ( µ NID) �
� 15 � MPGD ���� 14 Dec 2018 � J. Parker � µ PIC-based neutron imaging detector ( µ NID) � Neutron detection via n + 3 He � p + t � • Gaseous time-projection � chamber Overall track length ~ �� mm in gas • CF 4 -iC 4 H 10 - 3 He (45:5:50) at 2 atm • µ PIC micropattern readout • Compact ASIC+FPGA data 2.5 cm � encoder front-end E � • 3-dimensional tracking of decay pattern + time-over-threshold 33 cm • Accurate position reconstruction µ PIC readout • Strong gamma rejection 10 cm x 10 cm area, 400 µ m pitch x,y strips � 400 μ m Digital encoder with time-over-threshold (TOT) Anode Cathode TOT for proton-triton track µ PIC � Energy Deposition 400 μ m 30 Time-above-threshold (clocks) Threshold � Neutron Proton 25 Triton 20 Discriminator � 15 Polyimide 10 substrate Time-over-threshold 50 μ m 5 100 μ m ( ∝ energy dep.) � 0 0 10 20 30 40 50 60 X (strips)
� 15 � MPGD ���� 14 Dec 2018 � J. Parker � µ PIC-based neutron imaging detector ( µ NID) � Ethernet � Encoders � DAQ PC � External timing signals � SiTCP � GbE × 4 � µ PIC � Encoders � Control box • FPGA-based encoders for �� DAQ high-speed data acquisition controller ±2.5V, +3.3V � �� System Sensor power � monitor • Data transfer via Gigabit �� DC power Vessel pressure � Ethernet with SiTCP Ambient temperature � • FPGA-based system controller � Network � Monitoring � DAQ control � Power �
� 15 � MPGD ���� 14 Dec 2018 � J. Parker � µ NID performance and usage at RADEN � Image of Gd test target 8 cm � Base performance characteristics � Active area � 10 x 10 cm 2 � Spatial resolution � 0.1 mm � Time resolution � 0.25 µ s � � -sensitivity � < 10 -12 � Efficiency @25.3meV � 26% � Count rate capacity � 8 Mcps � Effective max count rate � > 1 Mcps � Detector usage at RADEN (2018A) µ NID 34 days Bin size: 40 x 40 µ m 2 CCD camera 20 days Time-over-threshold (ns) 250 Fine spatial Other counting-type 36 days 200 Triton Proton resolution using 150 µ NID used primarily for Bragg-edge, template fit to 100 Template magnetic imaging, and phase TOT distribution 50 for fit imaging measurements at RADEN 0 -2 0 2 4 6 8 Distance from interaction point (mm)
� 15 � MPGD ���� 14 Dec 2018 � J. Parker � µ NID control software/analysis GUI � • New DAQ controller Software frameworks at the MLF hardware and detector IROHA2 – Experimental device control control software system with web-based UI (MLF) • Based on DAQ DAQ Middleware – Detector control and middleware data collection (KEK) � • Full integration into beam line control system µ NID analysis GUI • In use since March 2018 • New browser-based UI for offline analysis • First update with simplified interface, better data visualization, etc. • In use since April 2018
� 15 � MPGD ���� 14 Dec 2018 � J. Parker � Automated measurements � Computed tomography • Increased rate and integrated Fe step 2°/step 91 images � wedge control • Perform complex 5 cm measurements more easily • Computed tomography with TOF • Quantify effects of scattering, beam hardening, etc. Magnetic imaging of running motor • Combine with energy- resolved imaging techniques Polarization image Model electric motor (provided by Hitachi) • Dynamic samples • Fold TOF info with motion/ 4 cm � process frequency P/P 0 • Currently limited to cyclical processes 4 cm � K. Hiroi et al., J. Phys.: Conf. Series 862 (2017) 012008 �
� 15 � MPGD ���� 14 Dec 2018 � J. Parker � Ongoing development � • 215 µ m pitch MEMS µ PIC for improved spatial resolution • µ NID with boron converter for increased rate performance �
� 15 � MPGD ���� 14 Dec 2018 � J. Parker � Current and projected performance of event-type imaging detectors at RADEN � 100 Boron-µNID � Count rate (Mcps) � 10 µNID µNID (Optimum rate LiTA12 performance) � (MEMS) � 1 µNID GEM 0.1 0.01 0.1 1 10 Spatial resolution (mm) �
� 15 � MPGD ���� 14 Dec 2018 � J. Parker � Small-pitch MEMS µ PIC �
� 15 � MPGD ���� 14 Dec 2018 � J. Parker � Small-pitch MEMS µ PIC � Surface of TSV µ PIC • Improve spatial resolution 215 µ m TSV µ PIC (digital microscope) � with reduced strip pitch • Develop small-pitch µ PIC • Manufacture using MEMS 55 mm � on silicon substrate (by 215 µ m � DaiNippon Printing Company, Ltd.) � Thru- silicon-via (TSV) µ PIC • Successfully produced 215 Current PCB µ PIC TSV µ PIC � µ m pitch µ PIC (down from (400 µ m pitch) � 400 µ m) • Small (14 x 14 mm 2 ) and Cu � larger area TSV µ PICs (55 x 100 µ m � 400 µ m � 55 mm 2 ) tested at RADEN 10~15 µ m � 4~11 µ m � 15 µ m �
� 15 � MPGD ���� 14 Dec 2018 � J. Parker � First test of TSV µ PIC at RADEN (MPGD2016) � Neutron TOF (MEMS uPIC test) s Neutron TOF on µ Counts/pulse/25 0.12 215 µ m section � 280 µ m pitch 0.1 (192 × 192 strips) � 0.08 0.06 0.04 0.02 0 0 5 10 15 20 25 30 35 40 Time (ms) 215 µ m pitch (64 × 64 strips) � • No signal measured on 280 µ m section (gain too low) TSV µ PIC test board � • Signal confirmed on 215 µ m section Gas filling used for test: • Observed gain instability P10:CF 4 :He (60:30:10) @2 atm �
� 15 � MPGD ���� 14 Dec 2018 � J. Parker � Gain instability under irradiation (MPGD2017) � Mean TOT vs Time 12.0 Grounded Average TOT (clocks) � • TSV µ PIC gain observed to 590V � Floating 11.5 increase with neutron exposure even for 15 µ m 11.0 SiO 2 layer 10.5 • Tried grounding Si substrate 410V � 10.0 9.5 215 µ m pitch 0:00 1:00 2:00 3:00 4:00 5:00 (64 × 64 strips) � Elapsed time (min) � Grounding substrate Cu � 400 µ m � appears to stabilize gain � GND Necessary anode HV 10 µ m � was also reduced � 4 µ m � 15 µ m �
� 15 � MPGD ���� 14 Dec 2018 � J. Parker � Large-area TSV µ PIC test at RADEN � • Imaging confirmed but spatial Image taken with 215 µ m pitch TSV µ PIC at BL22 � resolution not improved as expected (slightly worse than PCB µ PIC) • Gain instability under neutron exposure � improved by grounding 55 mm � substrate but not eliminated Mean TOT vs Time 15 500V Odd behavior 510V 14 Mean TOT near end 13 460V 12 Large current (>1 µ A) § Gain stability : new MEMS µ PIC on all strips with glass substrate (TGV µ PIC) 11 0:00 2:00 4:00 6:00 8:00 10:00 12:00 14:00 § Spatial resolution : optimize gas Time (hours) for shorter tracks? TSV185 (4/1) TSV165 (5/22)
P R E L I M I N A R Y � MEMS µ PIC with glass substrate (12/10) � µ PIC gain stability at RADEN TGV µ PIC test board Strip pitch: 215 µ m 24 Silicon Area: 27.5 x 27.5 mm 2 22 Mean TOT 20 PCB 18 Glass 16 14 12 0:00 2:00 4:00 6:00 Time (hours) • Initial testing performed at Kyoto U. (Abe-san’s talk) • Gain stability measured at RADEN – Improved over silicon substrate – Slightly worse than PCB µ PIC Image from digital microscope
P R E L I M I N A R Y � Imaging with the 215 µ m MEMS µ PICs � 215 µ m TSV µ PIC � 400 µ m PCB µ PIC � 215 µ m TGV µ PIC � 21.5 µ m bins 40 µ m bins 21.5 µ m bins l Image quality with TGV µ PIC looks good l Resolution may be slightly improved compared to PCB µ PIC Note: measurement statistics are different for each image
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