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T14: Overall cassette design and prototypes process Jim Strait L3 Co-Manager, 402.04.05 November 30, 2017 Outline Scope of WBS 402.4.5 Cassettes Cassette conceptual design Requirements Conceptual design Different types


  1. T14: Overall cassette design and prototypes process Jim Strait L3 Co-Manager, 402.04.05 November 30, 2017

  2. Outline  Scope of WBS 402.4.5 – Cassettes  Cassette conceptual design  Requirements  Conceptual design  Different types of cassettes  Interfaces  Safety and Hazards  R&D and Engineering  Institutions and personnel  Prototyping program  Risks  Value Engineering  Milestones  Guide to the talks in this session T14: Cassette design J. Strait, 2017 November 30 2

  3. Scope: WBS 402.4.5 – Cassettes 402.4.5 – Cassettes 402.4.5.1 – Cassette Components 402.4.5.1.1 – Cooling Plates Cassette cooling plates and covers. 402.4.5.1.2 – Silicon-module motherboards* Motherboards to service the silicon modules. 402.4.5.1.3 – Cassette Interface and Cables Cassette interfaces and all HV and LV cables and fibers that run between the interface and the motherboards. 402.4.5.2 – Cassette Mechanics and Tooling The equipment, tooling, fixtures, and facilities needed for the assembly, testing and shipping of the cassettes 402.4.5.3 – Cassette Assembly, Testing and Shipping Assembly and testing of prototype and production cassettes and shipment of production cassettes to CERN. ___________________________________________________________________________ *Scintillator-module motherboards are covered under 402.4.6 – Scintillator System T14: Cassette design J. Strait, 2017 November 30 3

  4. Scope: WBS 402.4.5 – Cassettes The Endcap Calorimeter system requires the following types and numbers of cassettes  168 Double-sided, 60° wide, all-silicon cassettes for the CE-E  192 Single-sided, 30° wide, all-silicon cassettes for the CE-H  384 Single-sided, 30° wide, mixed silicon/scintillator cassettes for the CE-H USCMS is responsible for building a subset of these:  192 Single-sided, 30° wide, all-silicon cassettes for the CE-H  168 Single-sided, 30° wide, mixed silicon/scintillator cassettes for the CE-H  Plus 1 spare of each type and size (30 total) CMS Management requests that all cassette assembly sites be able to make any type of cassette.  We plan to provide space but not all tooling to meet this request. T14: Cassette design J. Strait, 2017 November 30 4

  5. Conceptual Design T14: Cassette design J. Strait, 2017 November 30 5

  6. Requirements (1)  Cassettes are complete, self-contained detector sub- assemblies, which are assembled into the HGCAL mechanical structure to form the Endcap Calorimeters.  The cassettes must:  Combine silicon and scintillator modules and their respective motherboards into an integrated detector, ready to be read out.  Provide a mechanism to maintain the temperature of the active detectors (silicon sensors and SiPMs) at a stable temperature  -30°C  Provide interfaces to the services necessary to test and operate the detectors: - HV to bias the sensors - LV to power the on-detector electronics - Fibers to read out the data and send control signals - Refrigeration fluid T14: Cassette design J. Strait, 2017 November 30 6

  7. Requirements (2)  The cassettes must:  Provide a robust mechanical structure for the active detectors elements  Conform to the endcap geometry, which is set by - r min and r max = f(z) (interface with the rest of CMS) - defined sampling structure of the calorimeter  Be of minimal thickness to maximize the density of the calorimeter  Be of manageable size and weight to facilitate - Handling during assembly and testing - Shipping from cassette assembly site to CERN/CMS - Handling during insertion into the endcap mechanical structure  Minimize the complexity of requirements placed on the detector elements that are integrated into the cassette. T14: Cassette design J. Strait, 2017 November 30 7

  8. Cassette Conceptual Design T14: Cassette design J. Strait, 2017 November 30 8

  9. Three types of cassettes CE‐E CE‐H Double sided Single sided Silicon Sensors Silicon Sensors CE‐H Single sided Silicon + Scint/SiPM Sensors T14: Cassette design J. Strait, 2017 November 30 9

  10. Cassette Type Characteristics Silicon Modules Cassettte Active # Scint Tile Width Width Length Mass # in # Full # Partial Type sides Modules (°) (m) (m) (kg) CMS 1.56 ‐ 1.24 ‐ 220 ‐ CE‐E 2 91 ‐ 102 4 ‐ 13 0 60° 168 1.67 1.32 250 CE‐H 0.87 ‐ 1.33 ‐ 56 ‐ 1 26 ‐ 33 2 ‐ 5 0 30° 192 (Silicon) 0.97 1.47 68 CE‐H 1.00 ‐ 1.54 ‐ 74 ‐ 1 5 ‐ 19 1 ‐ 4 3 ‐ 12 30° 384 (Mixed) 1.39 2.17 144 The US deliverables are:  All CE-H (Silicon) cassettes: 192 + 16 spares  7 layers of CE-H (Mixed) cassettes: 168 + 14 spares => 360 cassettes + 30 spares = 390 total T14: Cassette design J. Strait, 2017 November 30 10

  11. CE-E Cassette T14: Cassette design J. Strait, 2017 November 30 11

  12. CE-H Cassette – Silicon Section Further details in M. Alyari’s talk cassette cover motherboard silicon modules cooling plate T14: Cassette design J. Strait, 2017 November 30 12

  13. Cooling Plate Main functions: • Cool sensors and electronics • Position and support the detector elements • Attachment to external support structure Cassette design details and cooling calculations in E.Voirin’s talk. Cooling plate fabrication in M.Alyari’s talk. T14: Cassette design J. Strait, 2017 November 30 13

  14. Mounting Silicon Modules Further details in M. Alyari’s talk T14: Cassette design J. Strait, 2017 November 30 14

  15. Silicon Modules and Motherboards motherboard silicon modules Details in E.Frahm’s talk. T14: Cassette design J. Strait, 2017 November 30 15

  16. Mixed Silicon-Scintillator Cassettes Scintillator/SiPM Tile‐Module Details in T.Kolberg’s talk. T14: Cassette design J. Strait, 2017 November 30 16

  17. Mixed Cassette Cross-Section Cassette edge with SiPM motherboard and cassette interface T14: Cassette design J. Strait, 2017 November 30 17

  18. Interfaces  The cassettes are the major detector integration unit:  Silicon modules and Scintillator/SiPM tile modules  Motherboards for silicon and SiPM detectors  Services connections between on-detector electronics and the outside world - Low-voltage power (digital and analog) for the electronics - High-voltage to bias the sensors - Optical connections for trigger, data and detector control - Instrumentation for cryogenics and environmental control  Cooling for the active elements  Mechanical support and precise positioning within the absorber structure T14: Cassette design J. Strait, 2017 November 30 18

  19. Safety and Hazards  Standard industrial hazards:  Lifting heavy objects (cooling plates)  Ergonomics of cassette assembly: e.g. leaning to install modules in the middle of a cooling plate, repetitive motions, etc.  Potentially sharp edges of components  …  High voltage  Cryogenic (-30°) operations  Possible ODH from CO 2 coolant or dry nitrogen. (Very large leaks would be required to generate an ODH condition.) No extraordinary hazards – all within the capabilities of Fermilab / SiDet to safely control. Further discussion of hazards in Z. Gecse’s talk T14: Cassette design J. Strait, 2017 November 30 19

  20. R&D and Engineering T14: Cassette design J. Strait, 2017 November 30 20

  21. Institutional and Personnel Involvement  Fermilab M.Alyari (postdoc), P.Rubinov (eng), S.Timpone (eng), E.Voirin (eng), H.Cheung (sci), Z.Gecse (sci), J.Strait (sci), S.Tkaczyk (sci)  Minnesota M.Revering (student), E.Frahm (eng), J.Mans (prof), R.Rusack (prof)  Brown Greg Landsberg (prof)  Alabama Conor Henderson (prof)  Collaboration with LLR/CERN on cassette design LLR: C.Ochando (sci), T.Pierre-Emile (eng), G.Fayolle (eng), M.Roy (tech) CERN: H.Gerwig (eng), S.Surkov* (eng) * Formally U. of Wisconsin T14: Cassette design J. Strait, 2017 November 30 21

  22. Cassette Prototyping Program The cassette prototype program proceeds in 3 phases…  Thermo-electro-mechanical mockup  In process now … milestone to complete by Aug 2018  See presentation by M. Alyari  Prototype series #1  Fully functional prototypes using first complete front-end chip version and development version of the motherboard  Design work to start this spring … milestone to complete by May 2019  Prototype series #2  Prototype with (near) final front-end and motherboard electronics  Design work to start in 2019 … milestone to complete by Sep 2020 … leading to the start of cassette production in summer 2021 T14: Cassette design J. Strait, 2017 November 30 22

  23. Thermo-electro-mechanical mockup 8” sensors and modules do not exist yet => build a mockup to learn key features of cassette design and assembly with dummy modules and motherboards.  30° cooling plate with CO2 cooling loop of size ~ largest CE-H all-silicon cassette  8 in. “dummy” modules with passive silicon wafers, prototype baseplates, simplified PCB to simulate electronics heating and test high- speed data transmission  Corresponding simplified motherboard.  Extensive array of temperature measurements T14: Cassette design J. Strait, 2017 November 30 23

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