T14: Overall cassette design and prototypes process Jim Strait L3 Co-Manager, 402.04.05 November 30, 2017
Outline Scope of WBS 402.4.5 – Cassettes Cassette conceptual design Requirements Conceptual design Different types of cassettes Interfaces Safety and Hazards R&D and Engineering Institutions and personnel Prototyping program Risks Value Engineering Milestones Guide to the talks in this session T14: Cassette design J. Strait, 2017 November 30 2
Scope: WBS 402.4.5 – Cassettes 402.4.5 – Cassettes 402.4.5.1 – Cassette Components 402.4.5.1.1 – Cooling Plates Cassette cooling plates and covers. 402.4.5.1.2 – Silicon-module motherboards* Motherboards to service the silicon modules. 402.4.5.1.3 – Cassette Interface and Cables Cassette interfaces and all HV and LV cables and fibers that run between the interface and the motherboards. 402.4.5.2 – Cassette Mechanics and Tooling The equipment, tooling, fixtures, and facilities needed for the assembly, testing and shipping of the cassettes 402.4.5.3 – Cassette Assembly, Testing and Shipping Assembly and testing of prototype and production cassettes and shipment of production cassettes to CERN. ___________________________________________________________________________ *Scintillator-module motherboards are covered under 402.4.6 – Scintillator System T14: Cassette design J. Strait, 2017 November 30 3
Scope: WBS 402.4.5 – Cassettes The Endcap Calorimeter system requires the following types and numbers of cassettes 168 Double-sided, 60° wide, all-silicon cassettes for the CE-E 192 Single-sided, 30° wide, all-silicon cassettes for the CE-H 384 Single-sided, 30° wide, mixed silicon/scintillator cassettes for the CE-H USCMS is responsible for building a subset of these: 192 Single-sided, 30° wide, all-silicon cassettes for the CE-H 168 Single-sided, 30° wide, mixed silicon/scintillator cassettes for the CE-H Plus 1 spare of each type and size (30 total) CMS Management requests that all cassette assembly sites be able to make any type of cassette. We plan to provide space but not all tooling to meet this request. T14: Cassette design J. Strait, 2017 November 30 4
Conceptual Design T14: Cassette design J. Strait, 2017 November 30 5
Requirements (1) Cassettes are complete, self-contained detector sub- assemblies, which are assembled into the HGCAL mechanical structure to form the Endcap Calorimeters. The cassettes must: Combine silicon and scintillator modules and their respective motherboards into an integrated detector, ready to be read out. Provide a mechanism to maintain the temperature of the active detectors (silicon sensors and SiPMs) at a stable temperature -30°C Provide interfaces to the services necessary to test and operate the detectors: - HV to bias the sensors - LV to power the on-detector electronics - Fibers to read out the data and send control signals - Refrigeration fluid T14: Cassette design J. Strait, 2017 November 30 6
Requirements (2) The cassettes must: Provide a robust mechanical structure for the active detectors elements Conform to the endcap geometry, which is set by - r min and r max = f(z) (interface with the rest of CMS) - defined sampling structure of the calorimeter Be of minimal thickness to maximize the density of the calorimeter Be of manageable size and weight to facilitate - Handling during assembly and testing - Shipping from cassette assembly site to CERN/CMS - Handling during insertion into the endcap mechanical structure Minimize the complexity of requirements placed on the detector elements that are integrated into the cassette. T14: Cassette design J. Strait, 2017 November 30 7
Cassette Conceptual Design T14: Cassette design J. Strait, 2017 November 30 8
Three types of cassettes CE‐E CE‐H Double sided Single sided Silicon Sensors Silicon Sensors CE‐H Single sided Silicon + Scint/SiPM Sensors T14: Cassette design J. Strait, 2017 November 30 9
Cassette Type Characteristics Silicon Modules Cassettte Active # Scint Tile Width Width Length Mass # in # Full # Partial Type sides Modules (°) (m) (m) (kg) CMS 1.56 ‐ 1.24 ‐ 220 ‐ CE‐E 2 91 ‐ 102 4 ‐ 13 0 60° 168 1.67 1.32 250 CE‐H 0.87 ‐ 1.33 ‐ 56 ‐ 1 26 ‐ 33 2 ‐ 5 0 30° 192 (Silicon) 0.97 1.47 68 CE‐H 1.00 ‐ 1.54 ‐ 74 ‐ 1 5 ‐ 19 1 ‐ 4 3 ‐ 12 30° 384 (Mixed) 1.39 2.17 144 The US deliverables are: All CE-H (Silicon) cassettes: 192 + 16 spares 7 layers of CE-H (Mixed) cassettes: 168 + 14 spares => 360 cassettes + 30 spares = 390 total T14: Cassette design J. Strait, 2017 November 30 10
CE-E Cassette T14: Cassette design J. Strait, 2017 November 30 11
CE-H Cassette – Silicon Section Further details in M. Alyari’s talk cassette cover motherboard silicon modules cooling plate T14: Cassette design J. Strait, 2017 November 30 12
Cooling Plate Main functions: • Cool sensors and electronics • Position and support the detector elements • Attachment to external support structure Cassette design details and cooling calculations in E.Voirin’s talk. Cooling plate fabrication in M.Alyari’s talk. T14: Cassette design J. Strait, 2017 November 30 13
Mounting Silicon Modules Further details in M. Alyari’s talk T14: Cassette design J. Strait, 2017 November 30 14
Silicon Modules and Motherboards motherboard silicon modules Details in E.Frahm’s talk. T14: Cassette design J. Strait, 2017 November 30 15
Mixed Silicon-Scintillator Cassettes Scintillator/SiPM Tile‐Module Details in T.Kolberg’s talk. T14: Cassette design J. Strait, 2017 November 30 16
Mixed Cassette Cross-Section Cassette edge with SiPM motherboard and cassette interface T14: Cassette design J. Strait, 2017 November 30 17
Interfaces The cassettes are the major detector integration unit: Silicon modules and Scintillator/SiPM tile modules Motherboards for silicon and SiPM detectors Services connections between on-detector electronics and the outside world - Low-voltage power (digital and analog) for the electronics - High-voltage to bias the sensors - Optical connections for trigger, data and detector control - Instrumentation for cryogenics and environmental control Cooling for the active elements Mechanical support and precise positioning within the absorber structure T14: Cassette design J. Strait, 2017 November 30 18
Safety and Hazards Standard industrial hazards: Lifting heavy objects (cooling plates) Ergonomics of cassette assembly: e.g. leaning to install modules in the middle of a cooling plate, repetitive motions, etc. Potentially sharp edges of components … High voltage Cryogenic (-30°) operations Possible ODH from CO 2 coolant or dry nitrogen. (Very large leaks would be required to generate an ODH condition.) No extraordinary hazards – all within the capabilities of Fermilab / SiDet to safely control. Further discussion of hazards in Z. Gecse’s talk T14: Cassette design J. Strait, 2017 November 30 19
R&D and Engineering T14: Cassette design J. Strait, 2017 November 30 20
Institutional and Personnel Involvement Fermilab M.Alyari (postdoc), P.Rubinov (eng), S.Timpone (eng), E.Voirin (eng), H.Cheung (sci), Z.Gecse (sci), J.Strait (sci), S.Tkaczyk (sci) Minnesota M.Revering (student), E.Frahm (eng), J.Mans (prof), R.Rusack (prof) Brown Greg Landsberg (prof) Alabama Conor Henderson (prof) Collaboration with LLR/CERN on cassette design LLR: C.Ochando (sci), T.Pierre-Emile (eng), G.Fayolle (eng), M.Roy (tech) CERN: H.Gerwig (eng), S.Surkov* (eng) * Formally U. of Wisconsin T14: Cassette design J. Strait, 2017 November 30 21
Cassette Prototyping Program The cassette prototype program proceeds in 3 phases… Thermo-electro-mechanical mockup In process now … milestone to complete by Aug 2018 See presentation by M. Alyari Prototype series #1 Fully functional prototypes using first complete front-end chip version and development version of the motherboard Design work to start this spring … milestone to complete by May 2019 Prototype series #2 Prototype with (near) final front-end and motherboard electronics Design work to start in 2019 … milestone to complete by Sep 2020 … leading to the start of cassette production in summer 2021 T14: Cassette design J. Strait, 2017 November 30 22
Thermo-electro-mechanical mockup 8” sensors and modules do not exist yet => build a mockup to learn key features of cassette design and assembly with dummy modules and motherboards. 30° cooling plate with CO2 cooling loop of size ~ largest CE-H all-silicon cassette 8 in. “dummy” modules with passive silicon wafers, prototype baseplates, simplified PCB to simulate electronics heating and test high- speed data transmission Corresponding simplified motherboard. Extensive array of temperature measurements T14: Cassette design J. Strait, 2017 November 30 23
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