SURFACE- -MOUNTING OF POWER DEVICES MOUNTING OF POWER DEVICES - PowerPoint PPT Presentation

SURFACE- -MOUNTING OF POWER DEVICES MOUNTING OF POWER DEVICES SURFACE TO ALUMINUM HEAT SINKS TO ALUMINUM HEAT SINKS SMTA PanPacific Jim Fraivillig Fraivillig Technologies Thermal Management Boston, MA Hawaii March 11, 2004 SURFACE- SURFACE -MOUNTING OF POWER DEVICES MOUNTING OF POWER DEVICES ON ALUMINUM HEAT SINKS ON ALUMINUM HEAT SINKS

PowerSite technology PowerSite technology . • Convert aluminum heat sinks to surface-mount applications => solder-on power devices • Heat-seal copper to aluminum with all-polyimide ‘TPI’ bond film insulation • Excellent thermal management • Improved performance with lower cost • Patented SURFACE- SURFACE -MOUNTING OF POWER DEVICES MOUNTING OF POWER DEVICES ON ALUMINUM HEAT SINKS ON ALUMINUM HEAT SINKS

Heat-seal lamination POWERSITE TM COPPER POLYIMIDE ADHESIVE ( thermoplastic, 0.15 mil ) TPI FILM HEAT SINK (Aluminum) Performance advantages of PowerSites: • Thin, highly thermally-conductive insulation • All-polyimide durability • Any heat sink • No device attachment hardware

TPI bond film • All-polyimide • Heat-seals at 250-300 o C to aluminum • 200C operation OK • 300C exposure OK SURFACE- SURFACE -MOUNTING OF POWER DEVICES MOUNTING OF POWER DEVICES ON ALUMINUM HEAT SINKS ON ALUMINUM HEAT SINKS

Next-Generation Thermal Management THERMAL Introduction INTERFACE Mica/grease 1940s Sil-Pads 1960s Ceramic (DBC) 1960s Insulated metal 1980s substrate (IMS) PowerSites 2000 SURFACE- SURFACE -MOUNTING OF POWER DEVICES MOUNTING OF POWER DEVICES ON ALUMINUM HEAT SINKS ON ALUMINUM HEAT SINKS

SURFACE- SURFACE -MOUNTING OF POWER DEVICES MOUNTING OF POWER DEVICES ON ALUMINUM HEAT SINKS ON ALUMINUM HEAT SINKS

Typical PowerSite TM design conversion Conventional Method with PowerSite Assembly Thermal Pads, Screws, Nuts, Clamps SURFACE- SURFACE -MOUNTING OF POWER DEVICES MOUNTING OF POWER DEVICES ON ALUMINUM HEAT SINKS ON ALUMINUM HEAT SINKS

FT’s TPI TPI- -based technologies based technologies FT’s ALL-POLYIMIDE ‘TPI’ BOND FILM ‘POWERVIA’ THERMAL COLUMNS Sold as stand-alone insulation in Mounting discrete power devices on • • punched parts PCB, providing thermal path to heat sink Kapton MT + thin coating of Present market standard: Plated-thru • • thermoplastic polyimide adhesive (0.15 holes + Sil-Pad mil each side) Patented • Used as basis of other FT products • ‘POWERSITE’ SOLDERABLE PADS ‘POWERFLEX’ PRINTED CIRCUITS Mounting discrete power devices to Power circuit pattern bonded to • • heat sinks aluminum heat sink Present market standard: Sil-Pads with Present market standard: IMS (‘Thermal • • attachment hardware Clad’) Patented Patents pending • •

PowerFlex TM applications • TPI printed circuits, bonded to... • Aluminum baseplates SURFACE- SURFACE -MOUNTING OF POWER DEVICES MOUNTING OF POWER DEVICES ON ALUMINUM HEAT SINKS ON ALUMINUM HEAT SINKS

TM flexible interconnects PowerFlex TM flexible interconnects PowerFlex DESIGN OPTIONS: Stamped heat sinks • Layer interconnection Conventional PCB (to control board) (FR4 epoxy glass) TPI bond film (on PCB bottom-side) • Reduce ‘footprint’ ( ‘brick’ size ) • Increase power density • Bond to any heat sink SURFACE- SURFACE -MOUNTING OF POWER DEVICES MOUNTING OF POWER DEVICES ON ALUMINUM HEAT SINKS ON ALUMINUM HEAT SINKS

PowerVia technology PowerVia technology Optimal through- -hole thermal transfer hole thermal transfer Optimal through SURFACE- SURFACE -MOUNTING OF POWER DEVICES MOUNTING OF POWER DEVICES ON ALUMINUM HEAT SINKS ON ALUMINUM HEAT SINKS

PowerVia technology PowerVia technology Optimal through- -hole thermal transfer hole thermal transfer Optimal through PowerVias for D2Paks PowerVias inserted into PCB SURFACE- SURFACE -MOUNTING OF POWER DEVICES MOUNTING OF POWER DEVICES ON ALUMINUM HEAT SINKS ON ALUMINUM HEAT SINKS

Comparison of PowerVia Comparison of PowerVia with with conventional thermal via conventional thermal via SURFACE- SURFACE -MOUNTING OF POWER DEVICES MOUNTING OF POWER DEVICES ON ALUMINUM HEAT SINKS ON ALUMINUM HEAT SINKS

PowerSite thermal comparisons PowerSite thermal comparisons Versus insulator pads “Laminated copper” = PowerSite technology Versus IMS SOURCE: Parker Chomerics Technical study, 2000

PowerSite thermal comparisons PowerSite thermal comparisons Versus insulator pads PowerSite TM advantage: TO-220 2 o C/W TO-247 1 o C/W ( compared to alumina-filled pad material ) “Laminated copper” = PowerSite technology Versus IMS PowerSite TM pads are equivalent to IMS ( alumina-filled IMS material ) SOURCE: Parker Chomerics Technical study, 2000

TM thermal transfer performance PowerFlex TM thermal transfer performance PowerFlex COMPARISON: • TPI single-layer • IMS single-layer • Tested with Anatech pulse SURFACE- SURFACE -MOUNTING OF POWER DEVICES MOUNTING OF POWER DEVICES ON ALUMINUM HEAT SINKS ON ALUMINUM HEAT SINKS

PowerVia ™ thermal transfer testing thermal transfer testing PowerVia Thermal resistance testing of D2Pak (R j-s ), using PowerVias Anatech pulse tester: D2Pak Conventional thermal via • (plated-thru-hole + insulation pad + attachment hardware) Cylindrical column • PowerVia Rectangular column • PowerVia Thermal vias SURFACE- SURFACE -MOUNTING OF POWER DEVICES MOUNTING OF POWER DEVICES ON ALUMINUM HEAT SINKS ON ALUMINUM HEAT SINKS

NOTE: Thermal resistance is junction-to-sink. � Anatech measurement taken at steady-state. � PCB secured to heat sink on PCB edges only � (50-100 psi?). Thermal via + pad thermal resistance is about � 7 o C thru the power device+PCB and 4 o C/W thru the insulation pad. SURFACE- SURFACE -MOUNTING OF POWER DEVICES MOUNTING OF POWER DEVICES ON ALUMINUM HEAT SINKS ON ALUMINUM HEAT SINKS

Pressure dependency not a factor with PowerVias Pressure dependency not a factor with PowerVias Thermal Impedance vs Pressure Conventional thermal vias require insulation pads… 1 … insulations pads require Thermal Impedance (oC-in2/W) 0.9 Insulated pad high-pressure to optimize 0.8 Phase-change thermal transfer to the heat 0.7 sink. Thermal grease 0.6 0.5 Isolated 0.4 0.3 PowerVias use non-isolating 0.2 thermal grease or phase-change 0.1 Non-isolated material… 0 0 50 100 150 200 …. these thermal compounds Pressure (psi) have little pressure dependency (and very high thermal transfer). SURFACE- SURFACE -MOUNTING OF POWER DEVICES MOUNTING OF POWER DEVICES ON ALUMINUM HEAT SINKS ON ALUMINUM HEAT SINKS

TM thermal durability PowerSite TM thermal durability PowerSite ALL-POLYIMIDE: • 200 o C continuous • 300 o C exposure • No-lead solder, no problem NOTE: PowerFlex and PowerVias use same TPI bond film, and have same thermal durability. SURFACE- SURFACE -MOUNTING OF POWER DEVICES MOUNTING OF POWER DEVICES ON ALUMINUM HEAT SINKS ON ALUMINUM HEAT SINKS

PowerSite technical challenges PowerSite technical challenges . • Technology inertia • Heat-seal processing • Compatible PCB materials, configurations • Heat sink surface • Heat sink size and shape • Volume drives cost SURFACE- SURFACE -MOUNTING OF POWER DEVICES MOUNTING OF POWER DEVICES ON ALUMINUM HEAT SINKS ON ALUMINUM HEAT SINKS

PowerSite applications PowerSite applications . • Telcom power supplies • Portable devices • Automotive controls • Multi-chip modules • Thermally-demanding applications, where cost and reliability are critical SURFACE- SURFACE -MOUNTING OF POWER DEVICES MOUNTING OF POWER DEVICES ON ALUMINUM HEAT SINKS ON ALUMINUM HEAT SINKS

PowerSite worldwide supply PowerSite worldwide supply . Fraivillig Technologies – developed PowerSites, PowerFlex and PowerVias www.Fraivillig.com EIS Fabrico – U.S. technology licensee www.Fabrico.com Union Bridge – Asian licensee www.Union-Bridge.com SURFACE- SURFACE -MOUNTING OF POWER DEVICES MOUNTING OF POWER DEVICES ON ALUMINUM HEAT SINKS ON ALUMINUM HEAT SINKS