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Packaging and manufacturing approach for radar applications Thales Microelectronics Laurent PIERRE Thales Systmes Aroports Yves MANCUSO ( DMS ) 8th October 2013 A lot of microwave sensors Air to Air/ Air to Ground Radar Data


  1. Packaging and manufacturing approach for radar applications Thales Microelectronics Laurent PIERRE Thales Systèmes Aéroportés Yves MANCUSO ( DMS ) 8th October 2013

  2. A lot of microwave sensors � Air to Air/ Air to Ground Radar � Data link � Electronic warfare � Electronic attack � Electronic Support Measurement � Airborne and space SAR � Communication � UCAVs , UAV �����������������������������������������������

  3. ����������������������������� �������������������������� ������ ���������������� Business Production Competence lines & Services Centres Centres �������������������������������������������� Space Avionics Défense Secure Ground Land and Defence terrestre transportation Air systems communications Mission systems and information Systems systems

  4. Thales Microelectronics : activity �������� � �! �������� Rennes Paris ��! &' '() () & !����������"� #������������� ��! $���� "� #������� ������������� ��������� �������� �!� ����%� "�! One single site embracing ��������� the full spectrum of �������� manufacturing means and development capabilities

  5. ������ ������������������������ ����������� Supplier of development, engineering and manufacturing (micro)electronics tailored solutions. Competence Centre Full in-house package of services from designer support up to integration and support of products/equipments. ������������� Production Command of applications operating in harsh environments & services Centre (mechanical and thermal stress, radiations - T° >200° C ). 2 interlocking hubs of know-how: A technology & electronics development centre combined with a multi-technological industrial site. Thales Competence Centre for packaging, interconnections and microelectronics assemblies technologies – Expert in microwaves.

  6. ������ ������������������������ *��� $�+ �$���������+����%�� ������,-� �,����-���������������� #���������$������%�����������&������������&����������

  7. '��(�����������������&� ��������������������� Packaging roadmap X band TRMs C band space TRM wideband TRMs wideband tile TRMs X band space tile TRM 2 28 and 38 GHz telecom modules D Thick film multilayers HTCC / PCBs + SMT Silicon Tile modules ceramic LTCC assembly substrate years

  8. Key success factors: technologies at stake TARGET: MASS PRODUCTION OF SMD MICROWAVE COMPONENTS - COMPLEX RF COMPONENTS - KEY SUCCESS FACTORS KEY STAKES TO ADDRESS � Full mastery of the substrate’s � Miniaturisation of the supply chain microwave function � Expert proficiency in � High reliability microwave technology and � Mass production assembly processes repeatability � Top-level reliability and quality � Low cost

  9. Enhancing the key components (1/2) From multi-function …to full SMD microwave hybrid… self grounded complex modules Full Organic complex module Microwave Thales specific packaging Global soldering on full organic approach Mixing of material and technologies • Specific substrates: Metal, ceramic, organic RF/digital mix Wire bonding, gluing, soldering • Microwave materials • Blind, buried vias • Multisequential boards

  10. Enhancing the key components (2/2) Full mixed SMT PCBA assembly for microwave technologies A SMT rackable microwave multilayer board without metallic shielding

  11. 6 – 18 GHz T/R modules Organic BGA 6-18 GHz T/R module

  12. Wide-band space demonstrator I out IN N

  13. Manufacturing flowchart (1/2) PROCESS STAGE TECHNOLOGY KEY METRICS Laser marking Datamatrix identification Traceability Cleanroom ISO 5 to 6 Micro-components Positioning < to 10µm Die & passive components assembly on carrier automated placement Precision : 1 � m at 3 σ axis Automated wedge- Micro wire-bonding repeatability bonding Speed : up to 7 wires/sec. Lid placement Patent process Hermetic sealing

  14. Manufacturing flowchart (2/2) PROCESS STAGE TECHNOLOGY KEY METRICS Gang ball placement Balling Own design equipment Over 2000 balls in one step Cleanroom ISO 8 Balling conformity by Automated inspection laser inspection Automated cutting BGA individual split Functional testing Fully automated test Cutting precision < to 2µm bench Packaging for JEDEC carrier automated SMT placement bonding

  15. SMD microwave modules automated manufacturing line Laser marking Die auto- placement Hermetic sealing Auto wedge- bonding Functional testing SMD cutting Auto balling Ball placement inspection

  16. Metrics Some key metrics data : � Line Capacity microwave SMD Modules: 5 000 microwave modules per week ( 250 K units per year ) in continuous production including functionnal caracterisation and screening, for military applications � First pass yield : Fonctionnal and Quality > 99 %

  17. Main achievements A FULLY SMD TECHNOLOGY ENABLING: � High flexibility: repair up to unit (BGA) � High repeatability: manufacturing processes compatible of mass production and low-cost targets � A cost divided by a factor 10 for the global function ( except components cost ) an equal level of performances. A process designed for military applications compatible of automotive markets requirements

  18. THANK YOU FOR YOUR ATTENTION ANY QUESTIONS ?

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