National High Reliability Electronics Virtual Center (HiREV) Program Update June 18 th , 2014 Daniel Marrujo HiREV Liaison The Defense Microelectronics Integrity Service Excellence Activity/MECA 1 Distribution A – Approved for Public Release
USG and Electronics Reliability Wafer Level Reliability - 35% 1950’s Robert Lusser 2000’s Dielectric states 60% of failures are Other topics* - 65% failures are due to proving to be electronic parts in the leading 1980's IRPS 1960’s Failure of Army missile cause for aluminum systems transistor electrolytic 1990’s 1970’s E.M. Pohilofsky failures in 1990’s The 3 top field- The Army capacitors start finds that gold smaller node failures in the launches the to appear in and aluminum sizes Air Force were Electronic military are leading the result of Equipment systems. 2009 cause of field HSC on gold Physics-of-Failure failures in 60’s orbit embrittlement Project and 70’s failure 1950’s 2000’s NBTI degradation not permanent! 1980’s Space shuttle NBTI is proving to J.R. Black flight is aborted 1960’s be one of the publishes first due to IC most important 2010 paper on reliability failure reliability issue in electromigration scaling electronics. 1970’s 1990's IRPS The Minuteman System First evidence of cost is $30,000,000 for hot electrons parts improvement by Wafer Level Reliability - 42% improving processing methods and for Other topics - 58% 1960’s reliability testing . *Note: Other topics include packaging, design for reliability and process RDT&E annual budget is G.H. Ebel, “Reliability Physics in electronics: A Historical View”, only $16,000,000 for IEEE Transactions on Reliability, Vol. 47, NO. 3-SP 1998, pp379-389 2 electronic components. Distribution A – Approved for Public Release
National High Reliability Electronics Virtual Center (HiREV) MOTIVATION • Recent costly electronics failures in DoD and Space programs Materials highlighted need for government led quantitative risk degradation assessments and lifetime prediction capability rates quantified Understanding • NSS acquisition community forced to use highly-accelerated built-up from tests that are unlikely to correlate with operational use atomic scale • Customers: USG, US Space Programs and others inserting emerging electronics Assured mission • Gov. organizations in current economic climate can not operation afford to duplicate efforts and are limited by time and resources. • “Close collaborations" are essential to maximize success TECHNICAL IDEAS HiREV PAYOFF • Near-term – Validated government owned lifetime • Physics-based approach to replace current practice analysis for acquisition decisions of statistics-driven projections • Mid-term - Updated practices (standards, guides, • Characterization of atomistic and interfacial specs and methods) phenomena in electronics –– identify degradation • Long-term -Decreased anomalies due to poorly mechanisms and rate of change understood electronics • Develop and apply multi-scale materials models – • Risks – Difficult problem – Requires discovery model and simulate degradation rates • Costs – Function of device technologies 3 Distribution A – Approved for Public Release
How HiREV Influences Mission Success Ensuring Mission Success Semiconductor reliability An atomistic 1 . 10 7 influences everything from understanding of 1 . 10 6 design best practices (i.e. 1 . 10 5 how electronic median life (hr) 1 . 10 4 current density) to devices operate in 1 . 10 3 100 fabrication modifications their intended 10 120 140 160 180 200 220 240 260 280 300 320 Temp (C) (i.e. doping concentration) To be integrated into proper part qualification environment is critical to the HiREV Program Allows for proper design, fab and packaging decisions Understanding the physics and chemistry of electronic degradation 4 Distribution A – Approved for Public Release
Physics and Chemistry of Electronics Approach Device Foundry Device Stress Test Reliability Mathematics 1 . 10 7 1 . 10 6 1 . 10 5 median life (hr) 1 . 10 4 1 . 10 3 100 10 120 140 160 180 200 220 240 260 280 300 320 Temp (C) Device Thermography & Thermometry CLOSING THE LOOP Electrothermal Modeling Structural Analysis Packaging Integrity J.L. Jimenez & U. Chowdhury Proceedings, JEDEC ROCS Workshop, p. 57 Greensboro, NC Oct. 11, 2009 5 Distribution A – Approved for Public Release
How NEPP and HiREV Compliment Each Other NEPP HiREV • Body of Knowledge (BOK) documents on • Technology forecasting (US Government new technologies needs) • Guideline on testing/qualification of • POF tools for Si and III-V electronics FPGAs, memories, BME capacitors • Pre-qualification efforts on • Evaluation of commercial products – Base Metal Electrode (BME) Capacitors – BME capacitors – Class Y packages – GaN/SiC devices 45 and 90nm CMOS trusted foundry – – FPGAs technology – Automotive-grade electronics • Reliability science • Reliable Electronics – GaN technology – Applying PoF to qualification/usage guidance • Reliable Electronics • Radiation Reliability – Electronic technology Physics of Failure – Testing for PoF on new Technologies (PoF) – Support modeling/tools on new • Radiation Reliability of Electronics technologies – Modeling PoF in new technologies Qualification/usage guidance – HiREV utilizes test structures for detailed knowledge (model first) NEPP utilizes commercial product for general knowledge (test first) HiREV PoF on early TRL’s feeds NEPP focus on insertion/qualification 6 Distribution A – Approved for Public Release
Inputs/Outputs to HiREV Inputs Semiconductor End-Use by Worldwide Total •Technology Insertion roadmaps of: C ommunications Consumer 22% 19% NSS, MDA, NASA & Services G overnment Auto (Americas) •Research Outputs 7% .4% G overnment from: Academia, Source: World Semiconductor (Other) Government and .2% Trade Statistics (WSTS) - 2009 Industry Industrial Computer 10% 42% Military/Aerospace (Mil/Aero) Grade Electronics less than 0.1% of the total commercial electronics market NEPAG is a subset of the NEPP focused on electronics currently in use in space systems •Qualification Guidelines •Integrated Technology Roadmaps Focused on electronics next generation space applications •Technology Specific Expertise •Updates to Specs & Standards •Lower Technology Insertion Risk •Pre-Qual Data (Reliability, Radiation) Outputs 7 Distribution A – Approved for Public Release
HiREV Reliability Science Engagements ON Semiconductor Pocatello Purdue University MITRE Corporation Aeroflex Colorado Springs Iowa State University The Boeing Company Aetrium AFIT AFRL RX & RY CNSE, SUNY Penn State Raytheon Telefunken Semiconductor America Aeroflex Plainview, Inc. DMEA Silicon Turnkey Solutions NIST Lockheed Martin EAG Naval Postgraduate School DfR Solutions DARPA Aerospace Corporation NASA Aerospace Corporation Orbital Sciences SMC Betrokor Teledyne Microelectronic Technologies USC-ISI MOSIS Vanderbilt University Ridgetop Group, Inc. Georgia Institute of Technology AFRL RV Harris Corporation Sandia Technologies Arizona State University With a VIRTUAL foundation this concept allows for the government to leverage off of each others capabilities as well as industry to provide a low cost solution to an expensive problem 8 Distribution A – Approved for Public Release
Growth of the HiREV program Signed NDA’s 20 15 2014 HiREV Program Engagement 2013 10 Distrabution 2012 2011 5 Industry 28% 42% 0 Government FFRDC 8% Academia 22% Government led reliability effort has proven to be needed based on both Industry and Academia’s interaction with HiREV 9 Distribution A – Approved for Public Release
2013 – 2014 Selected Success Stories • DARPA IRIS – Government teams value to DARPA • CALM 90 development – Industry/HiREV Interaction on EM tool – Development of models for HCI, TDDB and NBTI – Break Out Session • Technology Forecast TOR – Radiation Test Infrastructure Study • Key Note Speech at GOMACTech – Al Shaffer • BME Capacitors • NPS/DMEA/AFRL PhD support • Quid Pro Quo Utilization – Ridgetop Group – Boeing SSED – Aerospace Corporation 10 Distribution A – Approved for Public Release
Closing Remarks • HiREV continues to build success – Has overcame government funding cut restrictions • R&D Communities looking for ways to collaborate • Wrap up of DARPA IRIS Program • Continued Development of CALM 90nm tool • Continued evaluation of emerging technologies 11 Distribution A – Approved for Public Release
Back Ups 12 Distribution A – Approved for Public Release
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