its M ult lti- P rojets C ir ircuit MEMS Prototyping MPW Services Center for IC / MEMS Prototyping http://cmp.imag.fr Grenoble - France CMP annual users meeting, 4 Feb. 2016, PARIS
MEMS Processes at CMP Bulk Micromachining MUMPs from MEMSCAP Teledyne DALSA MIDIS Micralyne MicraGEM-Si 2 CMP annual users meeting, 4 Feb. 2016, PARIS
Bulk lk mic icromachinin ing on CMOS • Compatible with electronics • Front side bulk micromachining • ams 0.35µ CMOS, SiGe, High Voltage Suspended passive device MPW run turnaround : 8/10 Weeks Post process turnaround : 5 weeks 3 CMP annual users meeting, 4 Feb. 2016, PARIS
Bulk lk mic icromachinin ing on BiC iCMOS • Compatible with electronics • Front side bulk micromachining • ams 0.8µ BiCMOS • Anisotropic Etching without additional mask Suspended passive device Cross section Suspended beams 4 CMP annual users meeting, 4 Feb. 2016, PARIS
Bulk lk mic icromachinin ing desig igns • Front-end electronics close to MEMS sensor for better signal to noise ratio Test sensor structures Thermal inertial sensor Fondazione Bruno Kessler MEMs accelerometer and signal LIRMM – MPW A35C11_6 MPW A35C11_5 conditioning MPW A35C14_5 5 CMP annual users meeting, 4 Feb. 2016, PARIS
Backside bulk lk mic icromachining Backside bulk micromachining Integration of MEMS sensor and front-end electronics A CMOS Compatible Ultrasonic Transducer Fabricated With Deep Reactive Ion Etching Libor Rufer, Christian C. Domingues, Salvador Mir, Valérie Petrini, Jean-Claude Jeannot, and Patrick Delobelle JOURNAL OF MICROELECTROMECHANICAL SYSTEMS, VOL. 15, NO. 6, DECEMBER 2006 Membrane and suspend structure on top of cavity • Applications : piezoresistive devices, pressure sensors, transducers • Discussions ongoing to provide such MEMS process along with ams 0.35 µ CMOS 6 CMP annual users meeting, 4 Feb. 2016, PARIS
Access to bulk lk mic icromachin inin ing Design Kit • Standard DK for the 0.35µ CMOS process C35B4C3 from ams • Design Rule Manual and technology files provided for MEMS structures • MEMS DK for : Fabrication schedule • ams C35B4C3 : next run starts on June 13th Price list • 650 € /mm² (4 mm² mini) + 3700 € for 10 chips 7 CMP annual users meeting, 4 Feb. 2016, PARIS
MEMSCAP • Company created in 1997, technology available through CMP since 1998 • 4 different processes : PolyMUMPs SOIMUMPs MetalMUMPs PiezoMUMPs 8 CMP annual users meeting, 4 Feb. 2016, PARIS
Poly lyMUMPs Features Applications • • 2 mechanical and 1 electrical layer of polysilicon Acoustics • 2 sacrificial layers (microphones) • • 1 electrical conduction layer Accelerometers • • 1 electrical isolation layer Micro-fluidics • • Optional post process : etching/release, CO2 Display Technologies drying, sawing POLY 2 9 CMP annual users meeting, 4 Feb. 2016, PARIS
SOIM IMUMPs SOIMUMPs Features Applications • Silicon On Insulator substrate • Gyros • Reactive-Ion Etching (RIE) • Optical devices • 10 to 25 µm structural layer • Display technology • 2 Metal layers METAL Si OXYDE Substrate Cross section of RIE etching 10 CMP annual users meeting, 4 Feb. 2016, PARIS
MetalMUMPs Features Applications • • Thick metal layers : electroplating Nickel Relays (18-22 µm) • Microfluidics • Surface and Bulk Micromachining • Magnetic Switches • Metallization on the walls • RF Devices Substrate 11 CMP annual users meeting, 4 Feb. 2016, PARIS
Pie iezoMUMPs Features Applications • • Based on SOIMUMPs process Energy harvesting • • 0.5 µm Aluminium Nitride Ultrasonic piezoelectric layer transducers • • Active piezoelectric device Microphones • • 2 Metal layers Actuators 12 CMP annual users meeting, 4 Feb. 2016, PARIS
Access to MUMPs Design kits and CAD tools • Physical design, DRC : • Specific MEMS CAD tools : Fabrication Schedule • PolyMUMPs : 4 runs in 2016 • SOIMUMPs : 3 runs in 2016 • MetalMUMPs : 1 runs in 2016 • PiezoMUMPs : 3 runs in 2016 Price list 1 PolyMUMPs : 3700 $ 2 /4600 $ 3 (added cost for optional post-process) • • SOIMUMPs : 3700 $ 2 /4600 $ 3 • MetalMUMPs : 3700 $ 2 /4600 $ 3 • PiezoMUMPs : 3700 $ 2 /4600 $ 3 1: for 15 identical chips 1cmx1cm fixed size except for SOIMUMPs 0,9x0,9cm 2: price for Educational Institutions and Research Laboratories 3: price for Industrial Companies 13 CMP annual users meeting, 4 Feb. 2016, PARIS
Tele ledyne DALSA MID IDIS pla latform MEMS Integrated Design for Inertial Sensors (MIDIS™) Features • Getter-free high-vacuum sealing allows resonator Q factors > 20,000 • Efficient wafer-level packaging minimizes overall die size • 1.5 μ m feature size in a 30 μ m thick membrane • Comb height control allows out-of-plane sensing • TSV allows compact design ready for co-packaging Applications • Accelerometers • Gyroscopes • Resonators Inertial sensor • Inertial sensor combos (Sensor fusion) Courtesy of CMC 14 CMP annual users meeting, 4 Feb. 2016, PARIS
Tele ledyne DALSA MID IDIS pla latform 15 CMP annual users meeting, 4 Feb. 2016, PARIS
Tele ledyne DALSA MID IDIS pla latform Cross section of Typical MIDIS process 16 CMP annual users meeting, 4 Feb. 2016, PARIS
Access to MID IDIS Process Design Kit from Teledyne DALSA • Process parameters specifications • Design rules • DRC deck • Technology files for solid model generation • MIDIS solid model generation • Offers a truly representative 3D view of your design • Ready for design review • Multi-physics simulations Fabrication schedule • 2 runs scheduled for 2016 (1st run March 10th/devices shipment 31st July) Price list • 9830 $ per 4x4mm minimum for 40 chips 17 CMP annual users meeting, 4 Feb. 2016, PARIS
Mic icralyne Mic icraGEM-Si i process MicraGEM-Si Platform MicraGEM‐SiTM technology based on a Silicon‐on‐insulator (SOI) MEMS process features two thick SOI structure layers and gold metallization on the top surface, enabling the design of vertical comb drive actuators along with optically flat silicon surface. Target applications include variable optical attenuators (VOA) and wavelength selective switch (WSS) modules as well as resonators and bio sensors. Horizontal comb drives can also be created for use in inertial sensors. Academic Price : $4,800 (4mm x 4mm) Fixed size Price for Industry : $6,000 (4mm x 4mm) Fixed size 18 CMP annual users meeting, 4 Feb. 2016, PARIS
MEMS offer overview 19 CMP annual users meeting, 4 Feb. 2016, PARIS
rd of February Webinar MEMS 23 rd Leveraging MEMS prototyping platforms for research and commercialization Tuesday, February 23, 2016 9:00am and 2:00pm EST Webinar offered at different times for your convenience Webinar organized by CMC Microsystems Presentations: • Development and fabrication of micro-electrostatic actuators using a piston-tube configuration leading to large force generation • Ultra-clean wafer-level vacuum encapsulation of MEMS devices Registration : http://www.cmc.ca/NewsAndEvents/Webinars/MEMSWebinar.aspx 20 CMP annual users meeting, 4 Feb. 2016, PARIS
Thank you ! CMP annual users meeting, 4 Feb. 2016, PARIS
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