IEEE MIC/NSS 2012 Anaheim (Disneyland Hotel) conference summary Thibault Frisson
IEEE MIC/NSS 2012 - Anaheim (Disneyland Hotel) More than 1000 participants (guess), 54 exhibitors, etc. - Nuclear Science Symposium Technology and instrumentation and their implementation in experiments for particle physics, nuclear and space sciences, accelerators, radiation environments, and homeland security. - Medical Imaging Conference Foremost international scientific meeting on the physics, engineering and mathematical aspects of nuclear medicine based imaging - Workshop on Room-Temperature Semiconductor X-Ray and Gamma-Ray Detectors NSS : - Sessions: • 3 Plenary Sessions • 46 Oral Sessions (3-4 in parallel) • Joint sessions (MIC/NSS, RTSD/NSS, MIC/RTSD, MIC/NSS/RTSD) • 2 Poster sessions - Short and refreshed courses - Special Linear Collider Event : • 6 Sessions: Introduction, ILC/CLIC Accelerator and Detector concepts, Spin-offs, Industrial Applications, Accelerator Instrumentation • Discussion Forum about LC Perspectives Dec. 11, 2012 IEEE MIC/NSS summary - Anaheim 2012 2
IEEE MIC/NSS 2012 - Anaheim (Disneyland Hotel) Big conferences, a lot of sessions... … thankfully, I was not alone. Thanks to Véronique Puill, Vanessa Tocut, Sergey Barsuk, Christophe Beigbeder, Julien Fleury, Christophe de La Taille, Roman Poeschl, Ludovic Raux, David Sarrut, Etienne Testa, Damien Thienpont for the advices, ideas, photos.... Dec. 11, 2012 IEEE MIC/NSS summary - Anaheim 2012 3
LAL @ IEEE MIC/NSS • Session chairs : Sergey Barsuk, Christophe de La Taille • 2 Invited talks: Véronique Puill, Christophe de La Taille • 3 talks: – SCATS, a TDC for the PID of Superb Experiment (C. Beigbeder) – SPIROC: Design and Performance of a Dedicated Very Front-End for an ILC Prototype Hadronic Calorimeter with SiPM (L. Raux) – Interactions of Hadrons in the CALICE Silicon Tungsten Electromagnetic Calorimeter (ILC group) • 4 posters: – ASPIC: an Integrated Circuit for LSST CCDs Readout (V. Tocut) – Construction of a Large Scale Prototype of a SiW Electromagnetic Calorimeter for a Future Lepton Collider (ILC group) – SKIROC2, Front End Chip Designed to ReadOut the Electromagnetic Calorimeter at the ILC (S. Callier) – OMEGAPIX2: 3D Integrated Circuit Prototype Dedicated to Read Out Plannar Pixel Sensor (D. Thienpont) • Others LAL contributions: – Test of a Compton Telescope Prototype Based on Continuous LaBr3 Crystals and Silicon Photomultipliers – Towards a Sub-Millimeter PET Prototype with Continuous LYSO Crystals and SiPM Matrices – Studies for Performance Improvement of a Small Animal PET Prototype Based on Continuous LYSO Crystals and SiPM Matrices Dec. 11, 2012 IEEE MIC/NSS summary - Anaheim 2012 4
LAL @ IEEE MIC/NSS LAL @ IEEE Dec. 11, 2012 IEEE MIC/NSS summary - Anaheim 2012 5
Plan Vertex Solid state detector Trackers Gazeous detectors Calorimeters Scintillators, PET Combination of detectors pCT Software Dec. 11, 2012 IEEE MIC/NSS summary - Anaheim 2012 6
Plan Vertex Solid state detector Trackers Gazeous detectors Calorimeters Scintillators, PET Combination of detectors pCT Software Dec. 11, 2012 IEEE MIC/NSS summary - Anaheim 2012 7
Solid-State detectors 4 sessions : 2 Semiconductor Tracking and Spectroscopy Detectors 2 New Concepts in Solid-State Detectors LC detector R&D program in vertex: DEPFET, CMOS, 3D → Spinoffs in many HEP experiments: BELLE-II, superB, STAR, ALICE, CMS… Dec. 11, 2012 IEEE MIC/NSS summary - Anaheim 2012 8
CMOS Developments Excellent spatial resolution, very thin, integrated electronic, industrial process (ILC, superB, ATLAS...) Needs: reduce readout time – reduce power consumption – Ex : ILC vertex ( √ s = 500 GeV, O.35 µ m technology) Rolling shutter (power consumption) – Double side layer, correlated measurement : – • One face = highly segmented • Other face = large pixel, fast readout Increase insensitive area ==> O.18 µ m techno M. Winter Dec. 11, 2012 IEEE MIC/NSS summary - Anaheim 2012 9
CMOS Developments 0.18 µ m technology • – High speed operation inside chip – Surface reduction in digital design – Reduce power consumption In-pixel discriminator – Don't have to drive the digital signal to the column end • Gain a factor of 2 in time resolution – 2 -4 rows readout simultaneously – Multiple rolling shutters time resolution < 2 μs can be achieved More rows switched on → higher power consumption ➔ 0.18 μm process offers reduced power dissipation M. Winter Dec. 11, 2012 IEEE MIC/NSS summary - Anaheim 2012 10
Quadruple Well CMOS Technology Optimize charge collection and readout electronics S. Zucca + radiations hardness studies Dec. 11, 2012 IEEE MIC/NSS summary - Anaheim 2012 11
Silicon on insulator - SOI • No mechanical bonding. Fabricated with semiconductor process only, so high reliability, low cost are expected. • Fully depleted thick sensing region • On Pixel processing with CMOS transistors. • Can be operated in wide temperature (4K- 570K) range • Based on Industry Standard Technology. Issues : T. Miyoshi Dec. 11, 2012 IEEE MIC/NSS summary - Anaheim 2012 12
SOI But middle SOI between pixels reduces charge collection efficiency The first 3D chip in December T. Miyoshi Dec. 11, 2012 IEEE MIC/NSS summary - Anaheim 2012 13
Tipsy : single soft photon detector Spacing dynodes = 20 µ m silicon-nitride layer Efficient single photon detector Time to pass through structure ~50 ps “Will revolutionize electron detection in solid state atomic and molecular physics Time resolution to detect a single soft experiments" ??? photon is mainly determined by the time the electrons take to cross the last gap ~ps. Waiting for test results... Spatial resolution ~10 μm, in both planar directions (pixel pitch) H. van der Graaf Dec. 11, 2012 IEEE MIC/NSS summary - Anaheim 2012 14
Wireless Transfer Example @LHC: Innermost silicon layer: • Required bandwidth is 50-100Tb/s • Detector divided into 20-50K independent segments • Required bandwidth per link is then 5 Gb/s • Wireless unlicensed spectrum of 7-9 GHz bandwidth @ 60 GHz • Able to send Gigabits/s (5-10 Gbps) of information over short distances (10 m) • Largely unused today: low interference probability • 60 GHz does not penetrate (walls, silicon): security • Flexibility of placement • Allows for integration of antenna(s) 60 GHz signal cannot penetrate through the silicon layers - Send signal through the Silicon layer by a wire/vias connection Antenna: Most of the EM energy drawn into the substrate Difficult to deliver high output power (low supply and break-down voltage) H. K. Soltveit First prototype submission June 2013 Dec. 11, 2012 IEEE MIC/NSS summary - Anaheim 2012 15
Plan Vertex Solid state detector Trackers Gazeous detectors Calorimeters Scintillators, PET Combination of detectors pCT Software Dec. 11, 2012 IEEE MIC/NSS summary - Anaheim 2012 16
Gaseous detectors 3 sessions: Mainly development and results of Micro Pattern Gas Detectors Extensive R&D on TPCs carried out within the ILC → mutual benefit with others experiments: T2K, ALICE, Applications (Volcano tomography) Dec. 11, 2012 IEEE MIC/NSS summary - Anaheim 2012 17
Gaseous detectors Micro pattern detectors • Pixelized detector (allow a very precise two-dimensional spatial measurement) can replace common silicon pixel detectors (lower cost, smaller radiation length) • Drift space → information about the time component • Very good radiation hardness (gas can be renewed) • Low gain • Sparks Dec. 11, 2012 IEEE MIC/NSS summary - Anaheim 2012 18
Glass GEM Conventional GEM foil : polymer • Needs some support (soft material) • Outgas PEG3 : Higher gain • Commercially available Good uniformity • photo-etchable → precise pattern Robustness • High conductivity (avoid surface Low outgas charge accumulation) Tolerant for neutron irradiation • Hardness and self supporting 5.9 keV X-ray source (55Fe) R = 18.8% R = ~20% T. Fujiwara Y. Sekiguchi Thickness = 100 μm Thickness = 700 μm Hole diameter = 70 μm Hole diameter = 170 μm + Deuteron Pitch of the holes = 140 μm Pitch of the holes = 140 μm Dec. 11, 2012 IEEE MIC/NSS summary - Anaheim 2012 19
Test facility Aluminium strips Nd:YAG (~15 mW) Photo-electrons fake ionisation electrons made by charge particles Control measurement: K. Temming Dec. 11, 2012 IEEE MIC/NSS summary - Anaheim 2012 20
Plasma Panel Sensors • Inherits many operational and fabrication principles common to PDPs: – A dense micro-array of gas discharge cells or pixels – Pixels bias for gas electrical discharge - Geiger mode operation – Pixels are enclosed in hermetically-sealed glass panel – Uses non-reactive, radiation-hard materials: • glass substrates, refractory metal electrodes, inert gas mixtures • High gain and inherently digital device with 2D readout • Potential for: • Low power consumption • Large area & low cost • Ultra-thin (2 μm) cover plates • Conversion layers (neutrons, etc.) • < 1 ns response times • Very high granularity • Position resolution < 50 μm • Hermetic seal – long lifetimes P. Friedman Dec. 11, 2012 IEEE MIC/NSS summary - Anaheim 2012 21
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