IC Obsolescence Solutions Tuesday, October 03, 2017 Company - PowerPoint PPT Presentation

IC Obsolescence Solutions Tuesday, October 03, 2017 Company Overview – March 12, 2015

IC FOOTPRINT CONVERSION ADAPTERS REPLACE OBSOLETE ICs WITHOUT RE-SPINNING YOUR PCB An IC Adapter is a small PCB designed that: • Has a circuit and components to emulate the original IC • Has interconnect/IO that matches the original IC • Is designed to be assembled to your existing PCB using standard SMT assembly process Also Known As: • Interposers • Footprint conversion adapters • Modules • Daughter card • Mezzanine card IC Obsolescence Solutions

WARNING: OBSOLESCENCE CAN HAPPEN AT ANY TIME WHY RESPIN… WHEN YOU CAN ADAPT! Utilize latest generation silicon in your system Purchase product you need, when you need it Quick turn development / minimize legacy engineering Qualify by similarity – form, fit & function IC Obsolescence Solutions

WARNING: OBSOLESCENCE CAN HAPPEN AT ANY TIME WHY RESPIN… WHEN YOU CAN ADAPT! Outdated IC Package Bare PCB in Tact Updated IC Package System Updated with Matched to Footprint Latest IC Technology IC Obsolescence Solutions

WHY USE AN IC ADAPTER? Production-Worthy Solution for IC Obsolescence or Shortages: • Without the cost or effort of redesigning a motherboard • Without expensive last-time buy purchases • Without risky gray-market purchases • With minimal product requalification and test requirements (component change vs. new board design) ie. Quicker Time to Market Unit Cost Reduction: New device with adapter is often less expensive than existing device Fan-Out: Adapters can ‘fan-out’ fine pitch components to a larger pitch to avoid increasing motherboard layer count and eliminating microvias and blind/buried vias Multi IC to QFP TSOP to SOJ BGA Fan-Out Adapter IC Obsolescence Solutions

ISI CAN ADAPT TO ANY FOOTPRINT ISI adapters can be made to replace any standard IC package LQFP PQFP CQFP QFN SIP PDIP CDIP TQFP SDIP HTSSOP PLCC TSOP QFP HSOP SQFP HBGA BGA CSP/WLP PGA SOIC SOJ SOC SSOP VSO DIP PMFP IC Obsolescence Solutions

BGA ADAPTERS IC Obsolescence Solutions

LEADFRAME ADAPTERS IC Obsolescence Solutions

PGA/DIP/SIP ADAPTERS IC Obsolescence Solutions

FOOTPRINT CONVERSION ADAPTERS OVERVIEW OF ADAPTER DESIGN PROCESS 1. Customer provides project information • Mechanical drawings of ICs and target footprint • Net list or schematic • Routing requirements; matched/maximum signal lengths, differential pair, controlled impedance, ground planes, etc. • X, Y, Z dimensional requirements • Any specific reliability requirements • Quantities required for prototypes and production 2. ISI provides quotation for NRE, prototypes and production 3. Customer orders NRE & prototypes 4. ISI designs module/adapter and submits design to customer for approval 5. Customer approves design 6. ISI builds prototypes 7. Customer verifies function and in some cases reliability of module/adapter solution, places order for production requirements 8. ISI builds turn-key solution to production schedule IC Obsolescence Solutions

FOOTPRINT CONVERSION ADAPTERS In many cases, more than one component is necessary to replace the ADAPTER DESIGN original IC. For example, many adapters require bypass capacitors and/or EXAMPLES voltage regulators. ISI has come up with many innovative solutions to allow multiple components to fit into the available x,y and z space. Example A: The new device(s) will fit into the same area as the original chip. Adapter has new device(s) on top side, and I/O to the motherboard on the bottom side Example B: The new device and components will not fit into the same area as the original chip. I/O to the motherboard is lengthened to allow placement of devices on both sides of the adapter. Example C: Adapter must extend above surrounding components to accommodate all components. I/O to the motherboard is lengthened and components can be placed on both sides IC Obsolescence Solutions

INTERPOSER DESIGN PROCESS Interposer is designed to fit in available space: Keep Out Area Min Air Gap: Max Bottom Side 0.020” Height: 0.095” *Height: 0.095” Max Height: 0.085” (*Except Where Specified) Max Max Overall Top Side Height: Height: Interposer PCB 0.580” 0.312” Max PCB Thickness: 0.068” Board Separation Height: 0.200” Motherboard PGA Pins & Socket used to add ‘z-height’ IC Obsolescence Solutions

INTERPOSER MANUFACTURING PROCESS Interposer assembly is typically done in multi-up panels DIP PGA SOIC / SOJ 3 x 5 Interposer Panel When possible, we pre-manufacture the ‘connector’ and use it as a sub-component. • Carriers are plastic (injection molded) or laminate (multi-head high speed drillers/routers) • Pins are parallel loaded and pressed for coplanarity. • Leads are formed for QFP / SOIC style packages MicroPGA QFP / PLCC IC Obsolescence Solutions

INTERPOSER MANUFACTURING PROCESS Step 1: SMT Bottom Side Populate interconnect Individual QFP FlexFrame Screen Solder Placement Reflow MPM - SPM Fuji CP-732 & QP-351 Heller 1800, 1809 Step 2: SMT Top Side Populate QFPs IC Obsolescence Solutions

INTERPOSER MANUFACTURING PROCESS Step 3: Singulate with Router Inspection  Visual to IPC A-610 Class III Testing (as required)  Mechanical / Dimensional to Packaging / Labeling Drawing (including leads)  Functional  JEDEC Tray  X-Ray of hidden solder joints  Boundary Scan / JTAG (as required)  Tape & Reel  DC Parametric  Inspection templates (as  Custom (MacGyver) required)  Test patterns  Nikon Nexiv Automated Optical/Laser CMMs for lead flatness, coplanarity & true position as required IC Obsolescence Solutions

WHY CHOOSE ISI FOR IC ADAPTERS? ISI is quickly approaching 30 years experience and currently designs and  manufactures more than 100 new designs each year ISI has our own high volume manufacturing facility allowing us to be cost  competitive for high volume applications ISI has developed and manufactures our own unique interconnect to  accommodate any IC footprint (FlexFrame, BGA, PGA, etc.) ISI Adapters are designed for to be used in high-volume automated SMT  manufacturing lines using standard SMT processes ISI Adapters have been tested and qualified for use in the most  demanding applications, including military and commercial aircraft, automotive, ruggedized embedded computing systems IC Obsolescence Solutions

THANK YOU! Address: 741 Flynn Road / Camarillo, California 93012 Phone: (805) 482-2870 Contact ISI to engage on your next project: Website: www.ISIPKG.com » Brian Witzen » Dave Gagnon » Bob Garon Eastern USA Western USA Midwest USA Office: (714) 993-9618 Cell: (630) 707-0991 Cell: (919) 633-0798 Cell: (714) 261-3733 Email: bob.garon@molex.com Email: brian.witzen@molex.com Email: dave.gagnon@molex.com