Flexible Electronics Integration and Supply Chain Challenges - PowerPoint PPT Presentation

Flexible Electronics Integration and Supply Chain Challenges Malcolm J Thompson PhD CEO Nano Bio Manufacturing Consortium 1

FlexTech & NBMC Business Model  20+ years as industry-led manufacturing consortium w/ government participation  Supported DARPA, AF, ARL, AFRL, SOCOM  Access to leading companies and PhD level SMEs  Industry cost-shared manufacturing development program –> 60%+ industry funding  165 projects since 1994  Demonstrated results in tools, materials, processes and demonstrators  Creative, Collaborative, Cost Effective 7/23/201 2 5

How FlexTech Works 1. Define objectives 2. Set cost share floor 3. If equal technical merit, the higher the cost share the higher the score 7/23/2015 3

Why Flex Electronics? Change the Way Electronics Are Built Printable electronics combines graphic arts printing and microelectronics technologies • Requires new devices AND new manufacturing paradigms • Potential to reduce cost at a greater rate than traditional silicon integrated circuit manufacturing • Low Cost Distributed Manufacturing • Rapid Fielding Source: Wiki Commons Conventional Silicon Electronics Printed Electronics Source: LM Corp PE Paradigm: More product flexibility, lower costs, shorter time to bring products to market, and overall innovation and new business opportunities. Rapid Fielding and Distributed Manufacturing 7/23/2015 4

NBMC Background AFRL Flexible Hybrid Electronics in Aerospace NBMC Goal Integration of Materials and Manufacturing within a common platform to Challenges and Opportunities address various flexible device applications February 2013 AFRL awarded FlexTech with a contract to set up the Nano-Bio Manufacturing Consortium A consortium of Government, Industry, and Academic Laboratories that provides R&D funding for collaborative team projects, workshops and working groups to accelerate the maturation of platform capabilities and the creation of innovative product technologies . NBMC IS A CATALYST FOR CREATING A NEW INDUSTRY 5

UNCLASSIFIED – For Official Use Only Flexible Hybrid Electronics ISR and EW Integrated Capabilities Human System and Cognition Information and tracking in contested environments (A2/AD) is Human Performance limits capability in MANY Military Missions foundational to decision making and force projection ….and New Technologies are Needed to Sense, Assess and Augment the “Man-in-the-Loop” Conformal Apertures Today Friend/Foe ID Future • Information Overload • Missed Intelligence Responsive Reporting & • Threat/Danger Threat Detection Missed Energy Autonomous 24/7 Operations Low Profile, Robust Munitions Energy limit operational capabilities and mission impact for large Precision effects with smaller, low profile munitions pressing Issues: time and distances scenarios requirement for current and future platform effectiveness • Cost & Weight • Scale-up • Durability Integrated Power • Structure integrated harvesting, storage, electronics and management • Print energetic Expected 1.5X – 3X • Conformal comm increase in flight • Shock resistant devices endurance. 6 UNCLASSIFIED – DISTRIBUTION STATEMENT D (DoD and U.S. DoD Contractors) – Critical Technology – FOUO – ITAR/NOFORN

World of Wearables

Health Monitoring – Target Population ? Health Conscious & Chronically ill Fitness focused Require Gadget Oriented Monitoring Seeking some measure of control over a potentially serious health risk or condition that is difficult to manage Willing but underserved population Huge emerging market for wearable electronics Source: IBM Global

Flexible Hybrid Electronics More product flexibility, Rapid Fielding and lower costs, shorter time to Distributed bring products to market, Manufacturing and overall innovation and new business opportunities. Flexible Hybrid Electronics Flexible substrates Flexible thin high Nanomaterials performance Low cost sensors, batteries chips hybrid interconnect etc integration Processors, Low cost and wireless manufacturing assembly communication e.g., R2R, printing 9

Additive Printing of Sensors, TFTs and interconne ct FHE Eco-System Flexible Nano Bio- Substrates Recognition – plastic, Elements glass, Microfluidics metal FHE MII Automated Preproduct ion Advanced Materials: Assembly line at Testing, Functional Inks Thin Si Chips, Institute Reliability, pick & place, bonding,pads, Nanomaterials Possible Components of an FHE Standards, adhesives, die TRL/MRL attaach, self assessment, Graphene Device: assembly metrology Batch Adhesives and roll to roll Encapsulants processi ng Substrate Materials Bio-recognition Elements Applications: Human health Manufacturing Considerations: Monitorings Integration Strategies Structural Health Modeling & Simulation Monitoring Prototype Development Wearables Moving to Pilot line Smart Packaging Roll-to-Roll Web Processing Solar/PV Packaging & Pick-Place Solidstate Lighting New Tools Smart Sensor Material Handling Systems Test & Reliability

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Flexible Substrates • Polymer Substrates • Glass • Excellent Clarity • FlexTech Project with Corning • Low CTE • Metal • Solvent Resistance • Ceramics • Low moisture pick up • Flextech Project with ENrG • Mechanical Strength • Stretchable Substrates • Fibers and Fabrics

PET & PEN Properties

Substrates

Metrology – Substrate roughness and defect measurement • 4D is a leading developer of vibration-immune 3D metrology solutions • Vitriflex is a leading developer of high-performance transparent ultrabarrier films for displays & flexible electronics using an R2R process • In 2012 Vitriflex and 4D Technology partnered to receive a FlexTech Alliance grant to design a 3D metrology module that: – Deploys in-line on R2R systems – Scales from single sensor to an array for full areal coverage – Continually monitors roughness at the nm-level – Quantifies heights, slopes, volumes and areas of micron-level defects – Handles back-side reflection effects from transparent substrates 7/23/2015 15

4D Technology Project Final Results • FlexCam enables real-time monitoring and control of roughness to less than 0.5nm rms • FlexCam metrology module released Feb 2015 • Met or exceeded all technical goals 7/23/2015 16

4D’s FlexCam Commercial Opportunity • Strong reception at launch at FLEX 2015 • More than 9 quotations outstanding, including to large OEM customers • Estimate FlexCam will have sales > 100 units in in 2016, growing rapidly • Have ID’d follow on product to serve even larger flexible electronics market 7/23/2015 17

Additive Processes P LOTTING A EROSOL J ET I NKJET P RINTING M ICRO D ISPENSING S LOT -D IE C OATING S IIMPLE P RINTING R APID H IGH V ISCOSITY L ARGE A REA H IGH R ESOLUTION  Optomec M 3 D Aerosol Jet  Graphtec FC2250 Plotter  Microfab JetLab 4-xlA  nScrypt 3Dn Series Micro  nTact nRad Extrusion Deposition System Dispensing Tool Coating System  Easy to use & inexpensive  Piezo based  Expensive  Servo-controlled pump  20 nm to 100 µm Coating  Vector graphics  Drop-on-Demand  Great repeatability  Volumetric control to 20 Thickness  Plots, cuts, creases  Single nozzle, 4-head  10 µm to 5 cm line widths pL  Coating uniformity of ± 3%  Up to 1000 g force  Vector graphics  0.7 – 5000 cP ink viscosity  1 to 1,000,000 cP ink for films over 150 nm,  5 µm mechanical  Low waste  High material loading (vs. viscosity otherwise ± 5% Inkjet)  Dynamic flow control resolution  ~10 µm minimum line  1 to 70 cP viscosity  Inherently clog resistant  25 µm programmable  3-part ink mixing width  Minimum 10 mL of  Substrate Heating  Laser sensor for resolution  < 40 cP ink viscosity material  Standoff / working distance conformal mapping  140 µm minimum line  Scalable  Ink pH range of 2 – 11 of 1 – 5 mm  Vector graphics width (so far)  Adjustable lip slot die  Heated platen, nozzles  Path planning  Selected area coating capable 7/23/2015 18

Properties of R2R Printing Platforms

Properties of R2R Printing Platforms

Functional Inks Conductor • Metal, organic based • Sub-micron particulates Resistive • Transparency • Organic, metal, or inorganic • Bulk conductivity > 104 S/m • Resistance (10 - 100K Ω / □ )? ? • Low processing temperature (< 200 °C) • ± 10 % Nominal resistance tolerance Dielectric Light emitting • Polymeric or nano particulate based • Luminous efficiency (cd/A) • Electrical resistivity > 1014 Ω -cm • Radiant efficiency (W/A) • Film thickness < 5 μm • External quantum efficiency (%) • Permittivity (2-20), low loss • Lifetime(T 50 ) • Transparency • Semiconductor compatible band gap Photovoltaic • Low processing temperature (< 200 °C) • Power conversion efficiency (%) • Open circuit voltage (Voc) Semiconductor • Lifetime • Organic, inorganic, organic/inorganic blends • Electron mobility 100 - 102 cm2/V s • Transparency • Low processing temperature (< 200 °C)