Energy Efficient PFC Reduction Technologies and other Energy Saving Solutions Andreas Neuber Head Fab Environmental Solutions, Applied Materials AGS/EPG/FES
Executive summary • Today, carbon footprint reduction is a task that involves reducing both direct (scope 1) and indirect (scope 2) emissions in manufacturing. • This presentation shows how the following can be achieved: – Assess and subsequently reduce carbon footprint in general and GHG emissions specifically. – Provide the necessary data and easily compile reports in compliance with current EPA reporting regulations. • The focus of the presentation is to demonstrate that GHG emissions, as well as power and other resource consumption, can be substantially reduced even for existing fabs. 2
Direct and indirect emissions
Direct emissions (scope 1) in a semiconductor fab • Central boiler Stationary • VOC abatement Combustion • Local scrubber (burn type) • Emissions released during Process the manufacturing process (e.g., F-GHG, N2O, and Emissions ammonia) Fugitive • Unintentional release of GHG from sources Emissions including chillers Note: Mobile combustion is not used much in a fab 4
Process emissions: F-GHG 2014 WSC PFC CONSUMPTION AND EMISSIONS DATA (New gases include CH 2 F 2 , C 4 F 6 , C 3 F 8 , and C 4 F 8 O) Power: 1.1 kWh/cm2 Si Total semiconductor industry 8.1 GW (fabs only) Assume 0.510 kgCO2e/kWh 36.2 MMTCE (scope 2) Source: World Semiconductor Council (WSC) 5
ITRS facilities technology requirements (Table ESH5) Year of Production 2013 2014 2015 2016 2017 2018 2019 2020 2021 2022 2023 2024 2025 2026 2027 2028 FACILITIES DESIGN Meet established goal and Facilities Design Meet established goal and metrics metrics WATER Total fab* water consumption (liters/cm 2 ) [1] 7.8 300mm/450mm fabs 7.8 7.3 7.0 6.4 6.4 5.8 5.5 5.5 5.3 5.0 5.0 5.0 4.6 4.6 4.6 200mm fabs 7.6 7.6 7.0 6.4 5.8 5.8 5.0 4.8 4.8 4.3 4.1 4.1 3.9 3.5 3.5 3.5 Total UPW consumption 6.5 6.5 6.5 6.0 6.0 6.0 5.0 5.0 5.0 4.5 4.5 4.5 4.5 4.5 4.5 4.5 (liters/cm 2 ) [1] Site water recycled/reclaimed** (% 50% 50% 60% 60% 70% 70% 70% 75% 75% 75% 80% 80% 80% 90% 90% 90% of use) ENERGY (ELECTRICITY, NATURAL GAS, ETC.) 2 Total fab energy usage (kWh/cm2) 1.0 Non EUV 1.0 1.0 0.9 0.9 0.9 0.8 0.8 0.8 0.7 0.7 0.7 0.6 0.6 0.6 0.6 EUV 1.1 1.1 1.2 1.2 1.2 1.2 1.2 1.2 1.2 1.2 1.2 1.2 1.2 1.2 1.2 1.2 WASTE Hazardous waste (g per cm 2 ) [1] 8.0 7.5 7.2 7.2 7.2 7.2 6.5 6.5 6.5 6.0 6.0 6.0 AIR EMISSIONS 1 Volatile Organic Compounds (VOCs) 0.060 0.055 0.050 0.050 0.050 0.050 0.045 0.045 0.045 0.045 0.045 0.045 (g per cm 2 ) [1] Normalized emission rate (NER) <0.22 kg CO 2 equivalent/cm 2 Fluorinated greenhouse gases, Normalized emission rate Normalized emission rate (NER) to be 0.22 kg CO 2 equivalent/cm 2 by 2020 - - fluorinated heat transfer fluids, and (NER) to be 0.22 kg CO 2 equivalent/cm 2 by 2020 nitrous oxide as agreed by World Semiconductor - - as agreed by (WSC) Council (WSC) 1 Air emission: GHG, NOx, VOC Manufacturable solutions exist, being optimized 2 Energy consumption Manufacturable solutions are Manufacturable solutions known NOT known 6
Abatement for GHG: F-GHG and N2O • Reduction of GHG is very important, but it also must be energy efficient in • BKM recipe for poly etch F-GHG reduction kgCO2e/yr 102,908 Abatement consumption with idle Standard in kgCO2/yr mode control A Burn-Wet 6,645 5,440 B Burn-Wet 9,384 6,872 C Plasma-Wet 16,504 13,485 • Note: Some recipes with small F-GHG flows at low GWP can even show negative effects, i.e. consume more energy during abatement than the reduction of GHG is contributing 7
Energy and resource savings
Energy consumption: energy is wasted Fab Energy Consumption Wafer Starts Source: ISMI Energy consumption does not track fab utilization. 9
Equivalent energy consumption fabwide according to SEMI S23 Manufacturing use actually 71% of energy in a fab! CDA PCW N2 5% 6% 6% Hot UPW 4% UPW 6% Power 52% Heat 7% Exhaust 14% SEMI S23 -> equivalent power consumption 10
Pareto Analysis 50.0% Key system drivers 45.0% 40.0% 35.0% 30.0% 25.0% 20.0% 15.0% 10.0% 5.0% 12.0% 0.0% 10.0% 8.0% 6.0% 4.0% 2.0% Key component drivers 0.0% Vacuum pumps + local abatement 11
12 Actual opportunities to reduce energy use fruit Low hanging fruit High hanging opportunities Green mode opportunities Interface Ultrapure Process support systems Subfab components Infrastructure systems Dry pumps Cleanroom water Hot ultrapure Exhaust Local scrubber water treatment Nitrogen VOC Manufacturing tool Heater Compressed Chiller Local chiller air Process Cooling tower RF generator cooling water Process General waste Laser treatment exhaust Other process Remote plasma Make-up air gases clean handling Other air Process Turbo & handing chemicals cryo pumps Precursor O3 generator Life safety Specialty Non process Mechanical waste disp. pumps Mini-Env. + Others Others other blowers optimized Normally already subfab components Improvements in capabilities, Green mode CMP vs. SOG FCVD RTP Innovation optimized Normally already
Best practices – energy savings in subfab BACKGROUND SOLUTION Operating costs in the subfab have Align subfab operation to process, which been systematically reduced over the requires communication of process status to last few years. Sometimes this has subfab components, specifically dry pumps caused process issues, such as and abatement (e.g., purge can be reduced clogging , when purge flows have been without any risk to process when only inert selected as too small. gases are flowing from the process). Two modes will be distinguished (Source: SEMI S23, E167/2) 1. Idle mode (hot standby mode): idle mode — The condition where the equipment is energized and readied for process mode (all systems ready and temperatures controlled) but is not actually performing any active function such as material movement or processing. (refer to SEMI S23) 2. Sleep mode : sleep mode — the condition where the equipment is energized but it is using less energy than in idle mode. The sleep mode is primarily differentiated from idle mode in that it is initiated by a specific single command signal provided to equipment, either from an equipment actuator, from an equipment electric interface, or a message received through factory control software (e.g. SECS). Other than the possible initiation of the sleep mode by an equipment actuator, entry into the sleep mode does not require manual actions. (refer to SEMI S23) 13
Synchronizing subfab matches energy need to operation PROCESS CHAMBER Deposition Clean Deposition Clean (SiH 4 ) (NF 3 ) (SiH 4 ) (NF 3 ) VACUUM PUMP Energy Savings ENERGY Energy Savings ABATEMENT ENERGY Subfab equipment operation synchronized with process to save energy. 14
iSYS 2.0 system overview iSYS 2.0 QUAD Rack with Controllers Tool Ethernet Cable Remote IO Ethernet Cable Dry Contact Remote IO Cables Modules 24V DC Multiple Pumps Abatement(s) 15
Requirements for dry pumps • Pump purge and pump speed shall be synchronized with process. • Requirements: Idle mode – Pump shall allow for multiple (two or three) purge N2 set points depending on type of gases coming from process. – Note: VFD changes require sleep level information since frequent acceleration/decceleration cycles would even increase power consumption. • Requirements: Sleep mode – Pump shall allow for a lower N2 mode as well as one or more levels of reduced speed with a known and guaranteed wake-up time, e.g. to restabilize temperatures. • Requirements: Communication – Pump shall be able to receive idle and sleep mode signals via dry contacts or other fail safe communication, e.g. Ethernet with Heartbeat signal. – When the signal is interrupted the pump shall go automatically in a safe operating mode. – The pump shall maintain the interlock signals to the tool, but shall not send alarms to the tool, when the reason for the deviation is the idle/sleep mode itself. – Pump shall provide hand shake signals to indicate when they are in a certain saving (green) mode. This will allow accurate recording of achieved savings and several checking functions, but is not available today. 16
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