CMS Hardware Upgrades Danny Noonan (Florida Institute of Technology) - PowerPoint PPT Presentation

CMS Hardware Upgrades Danny Noonan (Florida Institute of Technology) on behalf of CMS Collaboration 51st Annual Fermilab Users Meeting June 20, 2018 1

LHC Run Schedule • LHC has been performing beyond expectation • Performance has been improving year over year • Already exceeded the design instantaneous luminosity (1x10 34 cm -2 s -1 ) • High Luminosity LHC (HL-LHC) Upgrades will allow higher rates • 5-7.5x10 34 cm -2 s -1 • Total integrated luminosity of 3000 fb -1 through end of HL-LHC HL-LHC 2

Upgrade Motivations • High luminosity = more interactions per bunch crossing (pileup) • Improvements to the LHC operating conditions require upgrades in order to maintain detector 200 Pileup event performance • High pileup : kills detection efficiency • High radiation : kills detectors 3

CMS Upgrade Timeline Phase-1 Upgrades Phase-2 Upgrades Improvements to specific subsystems Upgrades of most of CMS to keep CMS running smoothly through 2023 to cope with HL-LHC running environment 4

Phase-1 Upgrades 5

Phase-1 Upgrades Hadron Calorimeter (HCAL) Pixel Detector Off detector: DAQ & Trigger 6

Phase-1 Upgrade Schedule Trigger HCAL HCAL Upgrades Forward Barrel HCAL Pixel Endcap Completed Still to come 7

Pixel Phase-1 • Original (Phase 0) pixel detector Phase-0 performance designed to operate up with 25 pileup at instantaneous luminosity of 1x10 34 cm -2 s -1 • Already surpassed by LHC • Degradation of hit efficiency observed • To cope with LHC running environment, a new pixel detector was installed winter 2016/17 Upgrade 4 barrel layers Current 3 barrel layers 8

Pixel Phase-1 Design • Improved pixel readout chip • Larger buffer to maintain hit efficiency at higher instantaneous luminosity • Additional layers: • 4 barrel layers, 3 forward disks • More channels : • 48M → 79M (barrel), • 18M → 45M (forward) Material budget comparison • Reduced material budget Pixels Upgrade Pixel Detector Current Pixel Detector radlen 0.7 Material (radiation lengths) • Two-phase CO 2 cooling 0.6 • Move more material outside 0.5 0.4 acceptance 0.3 • Detector designed to be installed mid- 0.2 run (during year end technical stop) 0.1 0 -3 -2 -1 0 1 2 3 eta η 9

Pixel Phase-1 • Forward pixels designed, produced, and integrated in the US • Module assembly and testing at university sites, final assembly at SiDet @ FNAL • Installed during 2016/17 winter shutdown • Issues with DC/DC converter ASIC discovered during operations in 2017 Pixel detector installation • Radiation effects found to cause failures upon power cycling • All DC/DC converters replaced during 2017/18 shutdown • New version of ASIC chip being developed, will be installed during long shutdown 2 (2019) 10

HCAL Phase-1 • Upgrade Motivation : Noise and radiation damage cause degradation of the detector Phase-0 Depth Segmentation • Forward (HF) : Cherenkov calorimeter, steel 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 absorber with quartz fibers feeding light into FEE 16 17 16 PMT 18 FEE 19 • Replacement of PMT’s, 20 21 0 • New front end electronics with timing 22 HCAL HB 23 information 24 HCAL 25 • Endcap (HE) / Barrel (HB) : Sampling 26 HE 27 28 calorimeter brass / plastic scintillator layers 17 0 29 v. 2017-06-A • Replacement of photodetectors Phase-1 Depth Segmentation • New front end electronics with more 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 channels; better depth segmentation FEE 16 17 16 18 • More precise calibration of depth- FEE 19 20 dependent radiation damage 21 0 22 • New front-end electronics feature QIE10 and HCAL HB 23 QIE11 ASICs, 24 HCAL 25 26 • Designed by Fermilab, tested and HE 27 28 calibrated with university partners 17 0 29 v. 2017-06-A 11

HCAL - Forward • Significant background noise from anomalous hits in the PMT’s themselves • Upgrade to the electronics and replacement of PMT’s µ • PMT’s readout in dual anode mode, thinner window • New electronics provide timing information critical for noise rejection • Installed during winter 2016/17 Installation of HF electronics CMS Preliminary 2017 13 TeV 30 6 TDC [ns] 10 ieta=40, iphi=47, depth=1, anode=1 Dual Anode PMT 25 Absorber light 5 10 B R7600U-200-M4 20 4 10 Hamamatsu A 15 3 10 10 2 10 5 Me 10 0 Early hits (noise) − 5 1 0 500 1000 1500 2000 2500 12 Charge [fC]

HCAL - Endcap • Degradation in performance due to radiation and aging observed • Damage to both photodetectors and scintillators • Phase-1 Upgrade: • Replacement of hybrid photo diodes (HPD’s) with silicon photomultipliers(SiPM’s) • New front end electronics HE Installation • Significant improvement to performance • SiPM’s eliminate HPD damage • SiPM’s have 3x higher photo detection efficiency, mitigate scintillator damage • Full installation during winter 2017/18 • Performing exactly as expected in 2018 13

HCAL - Barrel • Will be upgraded with SiPM’s and QIE11 front end in HB QIE Card long shutdown 2 (2019) • Testing of all readout electronics taking place right at FNAL this summer • Quality control and calibration of ~900 QIE cards • Testing performance of QIE • Calibrating response to input charge • Happening in 14th floor HCAL lab right now • First 20 QIE cards already being tested QIE Calibration HB QIE Cards setup 14

Phase-2 Upgrades 15

Phase-2 Upgrades • HL-LHC upgrades present entirely new challenges for CMS • Instantaneous luminosity increase by a factor of 5-7.5 over design value (between 5 and 7.5x10 34 cm -2 s -1 ) • Up to 200 pileup interactions per bunch crossing • Upgrades to nearly all of the subsystems of CMS required to operate in HL-LHC conditions • 90% of all CMS data will be taken in HL-LHC HL-LHC 16

Phase-2 Upgrades Improved Trigger Upgrade/extension & DAQ System of muon subdetector New endcap calorimeter (HGCAL) Upgrades to barrel calorimeter Addition of New Tracker MIP Timing Detector 17

Phase-2 Tracker CMS-TDR-014 New Tracker Extended coverage in η • Improved radiation hardness • 40 MHz readout for trigger (outer tracker) • 18

Tracker Upgrade Motivation CMS Preliminary Simulation 1 Tracking efficiency • Current tracker will not survive 0.9 0.8 through HL-LHC 0.7 0.6 • Radiation damage will lead to 0.5 increased leakage currents 0.4 0.3 ttbar event tracks p > 0.9 GeV, d < 3.5 cm • After 1000 fb -1 (1/3rd of HL-LHC), T 0 0.2 Phase 1, no aging, 50PU 0.1 -1 Phase 1, 1000 fb , 140PU 40% of the phase-1 tracker will be 0 -3 -2 -1 0 1 2 3 η non-functional CMS Preliminary Simulation 1 Tracking fake + duplicate rate ttbar, p > 0.9 GeV tracks T 0.9 • Substantial reduction in tracking Phase 1, no aging, 50PU 0.8 -1 Phase 1, 1000 fb , 140PU efficiency 0.7 0.6 • Improvements to the sensor design 0.5 0.4 and cooling will improve radiation 0.3 0.2 hardness 0.1 0 -3 -2 -1 0 1 2 3 η 19

Phase-2 Tracker • All-silicon tracker, split into two subsystems Tracker Material • Inner tracker Budget • Extend coverage to η < 4 Phase-1 Tracker Radiation lengths • Outer tracker • Provides input into trigger system • Reduced material budget w.r.t. Phase-1 Tracker Phase-2 Tracker Layout Radiation lengths Phase-2 Tracker TB2S Tracker Outer TEDD Flat TBPS Tilted TBPS Tracker Inner TEPX TBPX TFPX 20

Inner Tracker • Extended coverage to η < 4 0.0 0.4 0.8 1.2 1.4 1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0 r [mm] • Smaller pixel size (2500 µm 2 ) 250 3.2 200 3.4 • Nearly 2 billion channels 3.6 150 3.8 • Improves track resolution 4.0 100 η 50 • Reduces pixel occupancy to 0 per-mille level z [mm] 0 500 1000 1500 2000 2500 TEPX: • Improves track separation in jets Endcap TFPX: Pixels • New pixel readout chip being Forward developed within RD53, joint Pixels ATLAS-CMS collaboration TBPX: Barrel • Designed to survive radiation dose Pixels expected for 3000 fb -1 • Still allows possibility to extract and replace components if deemed necessary in the future 21

Outer Tracker • Inclusion of track information into trigger • Sensors made up of “p T -modules” : • Pairs of closely spaced, parallel strip sensors • On-detector correlation measurements allows discrimination Bend in track from magnetic field can between high/low momentum hits distinguish high/low momentum “track stubs” • Restrict 40 MHz trigger system readout to stubs above tunable threshold • Two types of p T -modules: • Pixel-strip ( PS ) : pairs of macro-pixel TB2S and strip sensors, 100 µm pitch, 2.4 cm in length (0.15 cm pixels) TEDD TBPS • Strip-strip ( 2S ) : pairs of parallel strip modules, 90 µm pitch, 5 cm in length Inner Tracker : Pixels 22

Phase-2 Calorimeter CMS-TDR-019 CERN European Organization for Nuclear Research CERN-LHCC-2017-023 CMS-TDR- 019� Organisation européenne pour la recherche nucléaire 9�Apr 201 8 CMS CERN-LHCC-2017-023 / CMS-TDR-019 08/04/2018 The Phase-2 Upgrade of the CMS Endcap Calorimeter Technical Design Report New Endcap Calorimeter High Granularity Calorimeter • Mix of Silicon and Scintillators • Improved radiation tolerance • 23