ATLAS Inner Detector MO_B 2013 to-date status 2014 approve budget - PowerPoint PPT Presentation

ATLAS Inner Detector MO_B 2013 to-date status 2014 approve budget H. Pernegger / Pixel PL & ID Resource Coordinator D. Robinson / SCT PL and ID PL A. Romaniouk / TRT PL 31/10/2013 1

2013 Budget 31/10/2013 H. Pernegger / CERN ID IB Oct 2013 2 2

Mid-year spending • So-far spent about xx% of the budget • Pixel L2 and SCT TX still to come • Expenses to-date include much of 2013 manpower commitments Balance 2013 ID Pixel SCT TRT Total Budget (kCHF) Budget carry- 42 10 -94 192 over from 2012 149 673 610 637 545 2013 Budget 2465 Spent (31Oct 674 493 353 556 2076 2013) 39 101 152 38 330 Open Remaining 2 26 38 143 208 31/10/2013 H. Pernegger / CERN ID IB Oct 2013 3 3

Main Cost Drivers and LS1 activities • LS1 scheduled work: • Pixel : Integration of IBL and Pixel detector new Service Quarter Panel replacement and nSQP off-detector items (cables, power) • ID: Installation of the new thermo-siphon C3F8 cooling system • TRT : Address leak issue and consolidate gas system • Consolidation of SCT readout : Order of new TX plug-ins and production of new BOC card. • This consolidation of SCT readout is carried out with the current budget during the shutdown. • The overall budget of the SCT is maintained at 637 kCHF 31/10/2013 H. Pernegger / CERN ID IB Oct 2013 4 4

Pixel nSQP and Connection • All nSQPs are installed • Sequence is – each nSQP is tested before and after installation – Connection of pipes and type 0 cables at PP0 – Testing of the full supply and readout chain  row by row verification of the functionality of the Pixel Package before it will be brought to the Pit • From pit operation we had 92 /1744 modules that had issues • Failures cleared by nSQP or type-0 cable repairs 31/10/2013 H. Pernegger / CERN ID IB Oct 2013 5

Pixel nSQP mounting 31/10/2013 H. Pernegger / CERN ID IB Oct 2013 6

Pixel today 31/10/2013 H. Pernegger / CERN ID IB Oct 2013 7

Pixel status on surface after refurbishment as of 2013/10/17 • 1725 of 1744 modules are working , i.e. 99% • B-layer impressive recovery 31/10/2013 H. Pernegger / CERN ID IB Oct 2013 8

IBL Status • IBL Module production is completed – Produced mainly from beginning of this year to September since the move to Panasonic flip chip – Total number 412 DC and 263 SC modules built in 12 batches • IBL staves: 12 staves built so far – 9 staves are in SR1 – 3 staves in Geneva – Have material to built up to 18 staves (incl. reworked modules) – Produced staves essentially from ~May to now at rate of 50 DC fully accepted and 30 SC fully accepted modules/month – Test results in general good – However recently identified a problem with wire bonds (see later slide) 31/10/2013 H. Pernegger / CERN ID IB Oct 2013 9

IBL Module test results Noise distribution Breakdown voltage distribution • Performance very good Bad pixels/chip (batch 4-12) • Noise ~120e- for planar and 125-140e- for 3D • Dead channels 0.23% (3D-CNM), 0.47% (3D- FBK) and 0.32% (Planar CiS) 31/10/2013 H. Pernegger / CERN ID IB Oct 2013 10 10

Module loading to staves • Bare staves prepared with stave flex and tested • Staves assembled with 12 DC and 8 SC modules per stave 7/10/2013 H. Pernegger Atlas week 11 29/10/213 H. Pernegger Pixel week 11

Observations • Observe clear signs of corrosions on Wire bonds wing area and FE- bonds caused by water+catalyst (halogene) – White remanants, which are likely Al(OH)3 – Detected corroded Al bond wires directly on stave – confirmed through high-resolution images • Detailed analysis of remnants and wires was carried out to understand cause of corrosion together with detailed dedicated tests on many samples • IBL Stave task force investigates causes and remedies 31/10/2013 H. Pernegger / CERN ID IB Oct 2013 12 12

Corrosion • Based on the current understanding we deal with – Corrosion on bond wires (~1%-level distributed over ¼ to ½ of all chips) – Corrosion caused by condensation on stave with accelerating component somewhere on module (find significant amounts Cl, F, of yet unknown origin) • Recovery plan – Build 8 more staves using existing, repaired or class-2 type components on the last staves – Clean and repair the existing affected staves (priority on less affected ones) – Consider to buy more components as backup (to be ordered now so that we can get them in-time) 31/10/2013 H. Pernegger / CERN ID IB Oct 2013 13

SCT DAQ Expansion Maximum sustainable L1 rate as a function of pileup, 14TeV, 25ns FE  ROD ROD  ROS 8176 data links Existing 90 Slinks ✗ 100kHz at m ~33  100kHz at m ~87 SCT adapt the existing DAQ system to ROD  ROS cope with the high pileup conditions in Run2 With 128 Slinks • 90  128 RODs and BOCs and data compression • Improved data compression on ROD Both FE and ROD bandwidth compatible with pileup close to 90 at 100kHz  100kHz at m ~87 31/10/2013 H. Pernegger / CERN ID IB Oct 2013 14

SCT New Optical Transmitters (TX) Currently installed VCSELs were operationally robust during 2012, but two significant issues developed which impact on future operation: 1. 10% drop in optical power 2. Small but significant death rate 10 9 8 7 6 5 4 3 2 1 0 1 2 3 4 5 6 7 8 9 10 11 Number of deaths vs channel number Optical power (IPIN data) vs Date SCT will move to commercially packaged optical array assemblies, back engineered to match the mechanical and connectivity constraints of the existing BOC hardware and fibres Installation scheduled for Spring/Summer 2014 31/10/2013 H. Pernegger / CERN ID IB Oct 2013 15

Consolidation of Pixel readout • Pixel readout : • During next run LHC will reach “beyond - design luminosity” which will lead to data rates for which the Pixel readout was not built. • The beyond-design peak luminosity leads to saturation on backend electronics • This caused pixel detector inefficiency already in Layer 2 and will later cause inefficiency on Layer 1 • The saturation and resulting inefficiency is a function of Luminosity, L1A rate, hit rate per double column, error rate and number of FE- chip with hits 31/10/2013 H. Pernegger / CERN ID IB Oct 2013 16 16

Pixel Readout Col pairs ..9.. 16 x 40 Mb/s EOC buffer FE/MCC links and logic . MCC ROD . 40, 80 or 160 Mb/s . 16 FE MCC/ROD links ..16.. . . MCC buffers ROD buffers The bandwidth between module and ROD depends on the layer: • 160 Mb/s (2x80Mb/s) on two optical fibers for the B-layer • 80 Mb/s on one fiber for layer 1 and disks • 40 Mb/s on one fiber for layer 2 31/10/2013 H. Pernegger / CERN ID IB Oct 2013 17 17

Link occupancy at future luminosities • Pixel readout link Link Occupancy for different luminosities : 7x10 33 at 50ns 1x10 34 , 2x10 34 and 3x10 34 at 25ns MCC  ROD link occupancy at 75 and 100 KHz LVL1 rate: • Link occupancy at 75 kHz L1 Trigger µ B-Layer Layer 1 Layer 2 Disks 50 ns 37 39% 34% 52% 30% 25 35% 31% 48% 27% 25 ns; 13 TeV 51 53% 59% 66% 39% 76 71% 73% 111% 64% Link occupancy at 100 kHz L1 Trigger µ B-Layer Layer 1 Layer 2 Disks 50 ns 37 51% 45% 69% 40% 25 47% 42% 65% 37% 25 ns; 13 TeV 51 71% 67% 88% 52% 76 95% 97% 148% 75% • At and above 2x10 34 first Layer 2 will saturate, then followed by Layer 1 Run 1 limitations at start of fill and due to ROD computing power limits when m >> design – • Priority for consolidation: Fix now Layer 2, followed later by Layer 1 31/10/2013 H. Pernegger / CERN ID IB Oct 2013 18 18

Layer 2 limitations already in 2012 • Observed already limitations during Run 1 at start of fill – Observe high number of desynchronized modules in Layer at start of fill. Decrease follows luminosity decrease 31/10/2013 H. Pernegger / CERN ID IB Oct 2013 19

Consolidation of Pixel readout • Consolidation of Pixel Layer 2 readout system by using IBL ROD/BOC for Layer 2/1. – Bandwidth increase : – L2: from 40 Mb/s to 80 Mb/s on a single fibre – L1: from 80 Mb/s to 160 (2x 80) Mb/s on two fibres • Usage of IBL boards for Pixel readout consolidation – Boards provide bandwidth and computing power safety margin also at high pileup – Adoption to Pixel can be done in firmware • B-Layer and disks shall remain with present ROD/BOC – opto packages will need replacements • Cost estimate based on IBL production number is 315 kCHF for Layer 2 consolidation • 120kCHF included in 2013 MO_B budget • Requested additional 70kCHF for 2014 and 100kCHF for 2015 which was approved in Oct RRB 31/10/2013 H. Pernegger / CERN ID IB Oct 2013 20 20

TRT Gas system Pictures from inside of the PEEK pipes taken with Endoscope. This pipe should be repaired. Access outside is blocked. The only way to repair is from inside of the pipe. A special tool was developed and All active pipes at the exit of the TRT ECs were replaced (including not leaking ones). However some leaks were in inaccessible areas. and only way to keep leaks under control is a modification of the TRT Active Gas System. 31/10/2013 H. Pernegger / CERN ID IB Oct 2013 21