2009 Revenue and Capacity • As a result of business 70.00 6.00 recovery, the utilization of KCE group (excluding 60.00 5.00 KCEI) reached 95.48% in Q4 2009 50.00 Millions of Sq.Ft 4.00 • A further increase in Millions of USD 40.00 demand in 2010 3.00 prompted KCE group to 30.00 reopen KCEI in 2.00 December 2009 20.00 • At the moment, KCEI is 1.00 operating at 85% 10.00 utilization 0.00 0.00 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 2008 2008 2008 2008 2009 2009 2009 2009 Q1 2009 Q2 2009 Q3 2009 Q4 2009 Sales(M.US$) Capacity(M.US$) Sales(M.sqft) Capacity(M.sqft) Utilization 57.36% 68.51% 90.90% 95.48%
Gross Margin • Gross profit for 4Q09 has 2,500 30.00% reached 24.65% • KCE expects its gross 25.00% 2,000 profit to remain at 23-24% for 2010 20.00% • Gross profit will vary 1,500 Millions of Baht depending on copper price 15.00% and foreign exchange rate, mainly US-Baht 1,000 • While copper price has 10.00% increased to about $7500 per ton and Baht has decreased 500 5.00% to 32.7 Baht per USD in 1Q10, KCE gross margin remains stable due to an 0 0.00% increase in efficiency and 3Q08 4Q08 1Q09 2Q09 3Q09 4Q09 cost reduction Sales(Mil Baht) Cost of Sales(Mil Baht) Gross profit (%)
Net Income and EBIT Net profit EBIT 300.0 200.0 100.0 200.0 0.0 100.0 3Q08 4Q08 1Q09 2Q09 3Q09 4Q09 -100.0 0.0 3Q08 4Q08 1Q09 2Q09 3Q09 4Q09 -200.0 -100.0 -300.0 -200.0 -400.0 -300.0 -500.0 Exchange Hedging EBIT (Operating Income)* • Net income and EBIT have been gradually increasing from its lowest point in 4Q08 • Net income in 4Q09 has increased to a 9-year high of 162.4mil Baht, while EBIT reached 188.0mil Baht • The increase in net income is a result of KCE’s cost reduction program, an increase in more complex PCBs, and improved efficiency.
Liability Structure • Short-term loan reduced to 51% from 63% • Long-term loan increased from 8% to 19%
CAPEX FY2010 35 14.00% 30 12.00% Millions of USD 25 10.00% 20 8.00% 15 6.00% 10 4.00% 5 2.00% 0 0.00% Y2007 Y2008 Y2009 FY2010 Cap Ex(Mil US$) Cap Ex/Sales(%) • KCE plans to spend US$6.1mil in CAPEX • US$3.1mil will be spent on maintenance of CAPEX while the rest will be spent on production improvements • Total CAPEX for the Y2010 equals to approximately 2.5% of revenue. This figure is an increase from Y2009 of 1.7%
KCE Market Trends
Monthly Sales Order 25.00 2.50 20.00 2.00 2008 Financial Crisis Millions of Sq.Ft Millions of USD 15.00 1.50 10.00 1.00 5.00 0.50 0.00 0.00 US Dollars SqFt • After the 2008 Financial Crisis, KCE sales dropped drastically and reached the lowest point in January 2009 • Since January 2009, KCE’s order steadily increased by more than 110% • March 2010 order of $21mil can be viewed as a full recovery of KCE business (This number excludes a backlog of $1.5mil from Jan and Feb 10)
Revenue From New Customers 140.00 8.00% 7.00% 120.00 6.00% 100.00 Millions of USD 5.00% 80.00 4.00% 60.00 3.00% 40.00 2.00% 20.00 1.00% 0.00 0.00% H1 2008 H2 2008 H1 2009 H2 2009 Current Customer New customer % of Sales from new customer • During 2008 and first half of 2009, KCE acquired 16 new customers • New customers contributed to more than 7% of KCE’s revenue in H2 2009. Revenue from new customers grew from $3mil in H1 2009 to $7mil in H2 2009 • Revenue from these customers is expected to increase to roughly 15% of KCE’s 2010 revenue
Sales by Region • Recovery in PCB business is seen mostly in Asia and Europe Millions of USD • Sales in USA is still much lower than previously seen in 2008
Product Mix (US$) • KCE has successfully increased its high 2009 layer business Heatsink • 6 Layers increased from 17% of the 2% HDI SBU 8 Layers 5% business to 20% in 2009 1% and above • On the other hand, double sided and 4 2% Double Sided layers businesses were reduced from 14% 12% 6 Layers to 12% and from 60% to 58% respectively 20% 2008 8 Layers and SBU HDI Heatsink above 4 Layers 1% 4% 2% 2% 58% Double Sided 14% 6 Layers 17% 4 Layers 60%
KCE Strategy
Strategy 2009 2010 Focus: Operation Stream-lining Focus: Build Foundation for Future Area: expansion • Cost-cutting program Area: • Scrap-reduction program • Maintain and improve KCE’s Cost • Implementation of SAP and Scrap • HR Management program • Expand KCE’s presence in Japanese Market Results: • Leverage on KCE’s experience in • Lowest scrap in 3 years automotive • Gross margin of 24.7% •Increase R&D in high-technology • Completed 70% of all SAP PCBs systems •Increase KCE high-technology • Completed company-wide KPI and PCBs other HR management programs •Reduce gearing ratio and total D/E
Japanese Market N. America 3 • Japanese Market has always been the only market that KCE cannot penetrate China 1 • Due to financial crisis and depreciation of S.Korea 1 Japanese Yen, an opportunity was opened to W. Europe 3 KCE to expand our market share in Japan Japan 0 • KCE plans to open a sales office in Tokyo in Taiwan 0 2010 Rest of the world 2 2009 (Total US$37bn) 2013 (Total US$51bn) W. W. Europe, N. ROW, Europe, 3 2935 America, N. ROW, 786 5498 434 4488 America, South 7 South 4016 Korea, Korea, 54 3683 Japan, 64 13 66 Japan, Taiwan, 6094 2272 Taiwan, 32 97 Source: BPA Consulting Ltd *Numbers for individual region on this slide vary from numbers in China China slide 10 because these numbers , 20215 , 12772 are based on production location not company location. The totals are the same.
Automotive Market KCE’s Competitive Advantages Competitors Market Trends • More than 20 years of experience in automotive PCB 1. CMK 389 • Demand for • Strong relationship to Tier 1 2. Viasystem 181 automotive PCB is suppliers 3. KCE 133 growing rapidly due • Rank #3 in the world for to increase in 4. Meiko 133 automotive PCB suppliers electronics in (Based on 2008 figures) 5. Hitachi 115 automotive and the 6. Ruwel 91 market shift to hybrid 7. AT&S 83 car KCE Strategy • Expand KCE footprint in the automotive industry, especially Japanese automotive suppliers • Technology for Automotive PCBs has shifted to more complicated PCBs –get approval for complex PCB
SemiFlex T echnology Competitors Market Situation • Only a few PCB manufacturers has the capability to build the board • Towards the end of 2008, several European Advantages/Disadvantages of Semiflex PCB makers filed for • Much lower cost than full flexible PCBs Bankruptcy, as a result, • Most SemiFlex only allows 10-15 flexes some of our customers sent inquiries to KCE Current Customer regarding SemiFlex PCBs • A few of KCE customer has already approved KCE samples. These SemiFlex parts will be • After spending roughly in mass production in 2010 6 months in R&D, KCE • A number of KCE’s large-account customers successfully built its have approved KCE for SemiFlex production first SemiFlex PCBs • More than 10 parts have been quoted while 5 parts are entering mass production in early 2010
Product Mix FY2013 (US$) • KCE will concentrate its resources in expanding high-technology PCB businesses • High layer PCBs (6 and more layers) are expected to grow from 22% to 38% Product Mix FY2013 • HDI, SemiFlex, and Sequential Build Up PCBs are expected to grow from 6% to 16% Semiflex Double and SBU Sided 9% 10% HDI 8 Layers 7% Product Mix 2009 Double and above Heatsink Sided 7% 2% SBU HDI 12% 1% 5% 8 Layers and 4 Layers above 36% 6 Layers 6 Layers 2% 20% 31% 4 Layers 58%
Debt-to-Equity Net Debt ‐ to ‐ Equity • KCE plans to reduce its 6000 3 Millions of Baht 5000 2.5 short-term and long-term 4000 2 debt from 5bn Baht to 4.3bn 3000 1.5 Baht in 2010 2000 1 1000 0.5 • The reduction in short- 0 0 term and long-term debt will Y2007 Y2008 Y2009 FY2010 result in a net debt-to-equity Net Debt Gearing ratio of 1.5 • Furthermore, KCE plans to Total Debt ‐ to ‐ Equity reduce its total debt from 8000 4 6.3bn Baht to 5.7bn baht Millions of Baht 6000 3 • The reduction in total debt will result in total debt-to- 4000 2 equity of 2.0 2000 1 0 0 Y2007 Y2008 Y2009 FY2010 TL DEBT D : E
KCE Outlook
Guidance FY 2010 • Revenue: ~US$240mil • Gross Margin: ~23% • Reduce D/E • Net D/E: <1.5 • Total D/E: <2.0 • CAPEX: ~US$6.1mil • Reduce Copper price risk and Exchange rate risk using options • Increase complex PCBs
FY2010 Product Mix (US$) • KCE forecasts its 6 layers PCB sales Product Mix FY2010 to increase from 20% to 23% while 4 Double SBU layers PCB will reduce from 58% to HDI Heatsink 8 Layers Sided 1% 56% 5% 1% and above 12% 2% • Sales from other products should remain stable 6 Layers 23% Product Mix 2009 Double SBU 4 Layers HDI 8 Layers Heatsink Sided 1% 56% 5% and above 2% 12% 2% 6 Layers 20% 4 Layers 58%
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