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THE CMS PIXEL DETECTOR Danek Kotlinski Paul Scherrer Institut, - PDF document

Pixel2000, Genova, 5 th June 2000 THE CMS PIXEL DETECTOR Danek Kotlinski Paul Scherrer Institut, Switzerland OUTLINE : Detector design, mechanics. Data rates, readout architecture. Simulation of the readout efficiency. Sensor


  1. Pixel2000, Genova, 5 th June 2000 THE CMS PIXEL DETECTOR Danek Kotlinski Paul Scherrer Institut, Switzerland OUTLINE : • Detector design, mechanics. • Data rates, readout architecture. • Simulation of the readout efficiency. • Sensor development. • Performance, possible pixel 2 nd /3 rd level triggers. • Summary.

  2. = = = = = = = = CMS PIXEL SYSTEM • 3D - tracking points • σ ( z) ~ σ ( r ϕ ϕ ) ~ 15 µ µ m for precise impact parameter in r ϕ = z σ = = ( σ = = ( ϕ = & = = & σ σ ( ( σ σ ( ( ϕ ϕ µ µ ϕ ϕ & & • LAYERS: r= 4.3cm 7.2cm 11.0cm Low Lumi high Lumi • replace layers after 6 x 10 14 /cm 2 • all 3 layers compatible

  3. CMS PIXEL BARREL Mech. & Cooling 0.6% X 0 separate for insertion • Layer 1 & 2 & 3 mech. compatible

  4. BARREL PIXEL MODULE • Silicon sensor 16 x 64mm 2 , 250 µ µ m thick, 150 µ µ m square pixels µ µ µ µ • 16 Readout chips (52 x 53 pixel) ---> ~ 44k pixel ---> 2.4 Watt • ~ 1 % X O butting chips !

  5. BARREL & FORWARD PIXEL T able 1: P arameters of CMS Pixel Barrel Con�guration Radius F aces full/half Chips Pixels Area 2 [mm] ( � ) Mo dules [m ] 6 La y er 1 lo w lumi 41 - 45 18 128/32 2304 6 : 35 10 0.15 � 6 La y er 2 lo w & high lumi 70 - 74 30 224/32 3840 10 : 6 10 0.25 � 6 La y er 3 high lumi 107 - 112 46 352/32 5888 16 : 2 10 0.38 � ( � ) Tw o half faces are coun ted as one face T able 2: P arameters of CMS Pixel End Disks z Radius Blades Sensor Chips Pixels Area 2 cm mm Mo dules m 6 32.5 60 - 150 24 7 1080 3 : 0 10 0.07 � � 6 46.5 60 - 150 24 7 1080 3 : 0 10 0.07 � �

  6. = = = = CMS PIXEL SENSOR • Charge sharing by Lorentz effect ---> position interpolation • n + - pixel on n-silicon (initial) • Operate partial depleted up to 6 x 10 14 /cm 2 n + - pixel implants B - Field ( 4 T ) electrons Silicon depleted E > 0 (p-type) holes undepleted E = ∼ = 0 ionizing particle track p + - implant ( - 300 V) • natural r ϕ = - pixel size ~ 150 µ µ m µ µ • position interpolation by analog readout ---> σ ( r ϕ ϕ ) ~ 10 µ µ m σ = = ( σ σ ( ( ϕ ϕ µ µ • need ~ 20000 µ m 2 pixel area for pixel circuit ( #transistors) • defines z- pixel size ~ 150 µ µ m ---> good σ ( z) ~ 17 µ µ m µ µ σ σ σ = ( = ( ( µ µ

  7. PIXEL DATA RATES LHC high luminosity 1. Tracks : 800 ( η≤ 2 ), ≤ 100 (pT > 1 GeV). 2. Pixels : 4.6 + 3.3 + 2.5 + 1. + 1. = 13 k pixels/event; e.g. @ 7 cm occupancy ≈ 3.3 × 10 -4 ; pixels/module ≈ 15 (1 from noise); pixels/ROC ≈ 1; single pixel rate ≈ 10 kHz. 3. Data volume : 13 k pixels * 3 Bytes ≈ 39 kB/event; 13 k pixels * 100 kHz ≈ 1.3 G pixels/s * 3(10) Bytes ≈ 3.9(13) GB/s 4. Double column occupancy ≈ 1.5% ; 0.6 MHz column rate; 2 pixels/column. 5. Optical readout links ≈ 3000.

  8. Pixel Readout 4/2/00 Frontend Clock,T1 FES CCU Data Clock &T1 Clock, T1, Reset TTCvi Crate FED FEC Control VME 64x 9U VME Data Monitor WS RU Local Network DCS TTS

  9. READOUT OF TRIGGERED DATA Token Bit Manager Chip • Zero-suppression ----> data dependent readout time Readout Time Radius /cm/ 4 7 11 ROCs/link 8 16 16 <pixels>/link 16±11 15±9 8±6 <readout-time> /µs/ 4 5 4 max. time /µs/ 14 13 10 <wait-time> /µs/ 1.4 2.4 1.1 (High luminosity, 40MHz link, 100kHz L1T rate)

  10. PIXEL READOUT CHIP Data flow of pixel hits in Column Drain Architecture 8.00 mm 10.45 mm Column Periphery Time-stamp & Readout Bus Readout Amplifier Control & Interface Block 2 I C - DAC's Tranmsmission Power supply & Clock Pads Line Driver

  11. COLUMN PERIPHERY Token return Col. Token Pixel hit Data valid Col. OR Clock Data A0 A8 Write BC 8 w Timestamp w/r Contr Column Time Stamps Readout Data Buffer write/read Control Control Data Buffer 8 B Search BC clear A=B 8 A r read out T1 Trigger # 3 3 Chip Readout Control DAC DAC Chip Token IN Chip Token OUT Analog Multiplexer Signal Out • Dual-ported hit buffer ( Column Drain <--> Chip Readout) • Time-stamp verification with T1 trigger • Data formatting and readout of T1-verified hits with analog coded pixel address header • Prototype circuit : DM_PSI35 (DMILL) Dec. 98

  12. READOUT TIME r=7cm, 100kHz, 40MHz, 16-chips, hi/low-lumi Number of pixels per data packet and the packet readout time for the 7cm pixel layer at high and low LHC luminosities. Number of ROCs/link = 16, link speed = 40MHz, L1T rate = 100kHz.

  13. TBM Chip Stack Counter The Token-Bit-Manager (TBM) chip has to queue the incoming 1 st level triggers. Trigger stack for the pixel barrel at 4cm and 7cm, LHC high luminosity: The TBM stack counter occupancy. The solid line is for 100kHz 1LT rate, the dashed line is for 30kHz.

  14. Data loss for the pixel barrel at 7 cm Barrel at 7cm 0.06 0.05 100/20/hl 100/40/hl 0.04 30/20/hl Data loass 30/40/hl 0.03 100/20/ll 100/40/ll 0.02 30/20/ll 30/40/ll 0.01 0 4 8 16 ROCs/link BLUE : high-lumi, 1LT 100kHz, 40/20MHz link. RED : high-lumi, 1LT 30kHz, 40/20MHz link. GREEN : low-lumi, 1LT 100kHz, 40/20MHz. BLACK : low-lumi, 1LT 30kHz, 40/20MHz.

  15. READOUT DATA LOSS Pixel Barrel Layer at 7cm, full LHC luminosity R=7cm, tt+25mb 0.04 0.035 0.03 Column rd. Data Loss 0.025 2clock int. 0.02 1-Buffer 0.015 Reset/Block 0.01 0.005 0 0 20 40 60 80 100 120 Trigger rate in kHz Sources of data loss : 1. Column readout losses e.g. pixels overwritten, column busy, time-stamp and data buffers full. 2. Readout data buffer overflow, a column can store only one 1LT trigger confirmed time stamp. 3. After readout the column is reset, all time stamps are lost. 4. Dead time of 1 clock (25ns) to setup the column readout mechanism after this column was hit.

  16. SEONSOR DEVELOPMENT Status at the time of the CMS Tracker TDR : • Si sensors irradiated up to 6 * 10 14 pion/cm 2 , • After some annealing time (~1 year) can be depleted to 200 µm at -300V bias voltage (14 ke signal). Recent progress, future plans : • Test new sensors received from CSEM and SINTEF, low and high resistivity wafers, standard and oxygen enriched. • Variations in: p-stop rings, n implant size, # of p-stop rings, guard-rings, …. • Irradiation (April 2000 at CERN). • Beam tests with bump-bonded detectors (fall 2000), overall optimization program. • Summer-Fall 2001 selection of the final design.

  17. SILICON SENSOR PERFORMANCE after 6 x 10 14 / cm 2 300 MeV/c pions at PSI Depletion Depth [ µ m] at -300 V MIP Signal [electrons] at -300 V 20000 250 15000 200 10000 150 100 5000 0 80 160 240 320 400 0 80 160 240 320 400 days after irradiation days after irradiation • expect at least 14000 electrons signal up to 6x10 14 /cm 3 • need 2000 - 3000 e pixel threshold for analog interpolation Goal: • run with 2500 e pixel threshold • 5 σ σ noise threshold ----> noise < 500 e σ σ also after irradiation !

  18. SENSOR TESTS I pix [µA] pixel @ -0.2V 2.0 pixel @ GND 1.0 Bump Pad 0.0 + n -pixel -1.0 + p -stops 150µm -2.0 0 50 100 150 200 V bias [V] Inter-pixel current as a function of bias voltage.

  19. SOME COMMENTS ABOUT THE PERFORMANCE Despite the somewhat different designs both detectors Atlas and CMS show very similar simulated performance. → See the LHC physics yellow report, e.g. Bs → J/ Ψ (µµ) Φ (KK) ATLAS CMS Events 300000 300000 0.063 fs 0.063 fs Time resolution Background 15% 10% How could the pixel detector be used in triggering? • 3 rd level CMS trigger involves full event reconstruction and the pixel detector is fully included; • Can one do something at the 2 nd level with a "standalone" pixel detector information?

  20. PIXEL HIT RESOLUTION Pixel Barrel Layer at 7cm Hits from 100 GeV µ µ tracks. µ µ ϕ direction r ϕ ϕ ϕ 200-125 300-150 15 [µ m] 300-125 Resolution [µ [µ [µ 10 150-125 250-150 5 200-150 0 250-125 0 0.5 1 1.5 2 2.5 Rapidity z direction 200-150 40 200-125 µ m] Resolution [ µ µ µ 30 300-150 20 300-125 150-125 10 250-150 0 250-125 0 0.5 1 1.5 2 2.5 Rapidity

  21. PIXEL HIGH LEVEL TRIGGERS THE ALGORITHM • Correlate hits in two pixel layers which point in ϕ and z to the interaction region. • Match hits in ϕ and z in the 3 rd pixel layer. • Find the PV (histogramming the z impact parameter) and eliminate track candidates which do not point to it.

  22. PIXEL TRACK FINDER h500 2tau-jets, Pixel Track Efficiency Efficiency for track finding using the 3 pixel layers only.

  23. PV Finding using Pixel Hits qcd 60, high/low lumi, 3/2 layers The difference (in cm) between the z position of the Monte Carlo primary vertex and the reconstructed primary vertex. Only pixel hits are used in the vertex reconstruction. The upper plot is for qcd-jet events at high luminosity with the 3 layer pixel barrel. The lower plot is for same events at low luminosity and with a 2 layer pixel barrel. The dashed line shows all found vertices and the solid line is the main "signal" primary vertex as found by the algorithm.

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