Stevenage Circuits Group Incorporating: Stevenage Circuits Tru-Lon Printed Circuits March 2011
The Organisation � Stevenage Circuits formed 1971 � Tru-Lon integrated into the Stevenage site March 2011 � Group privately owned � £11m turnover, potential £15m turnover � £11m turnover, potential £15m turnover � 150 staff / 70,000 square feet � 24 / 7 working hours since November 2010 � ~£20m worth equipment � Dedication to investment � Full range of products including PTFE processing
Key Staff � Stuart Spink CEO � Mark Brown HR Director � Rob Brown Sales and Marketing Director � David Brown Operations Director � Jeremy Rygate Engineering Director � � Rosemary Burt Rosemary Burt Company Secretary Company Secretary � Tim Gee Operations Manager � Jonathan Calver Process Engineering Manager � Beverley Cording Quality Management Systems Manager � Lee Naylor CAM Supervisor � David Wyllie Sales Manager � David FitzGerald Area Sales Manager � John Wood Area Sales Manager � Alaistar Waddell Area Sales Manager
Key Staff Continued... Phil Firth Engineering Manager Paul Estwick Paul Estwick Quality Control Manager Quality Control Manager Neil Butler Internal Sales Marc Holloway IT Manager
Qualifications currently held � Underwriters Laboratories - UL94V0 (Rigid FR4, Flexi- Rigid, Flexible, Rigid Polyimide) � BS EN ISO 9001:2008 (Quality System Approval) � ISO14001 (Environmental) � ISO14001 (Environmental) � IPC Class 3 manufacture and test (Int. standard) � COSHH (System of controlling hazardous substances) � CECC/IECQ (BS123000) � D/S, M/L, Flexis, Flexi Rigid � FR4, Reinforced Polyimide, Flex Polyimide � Blind, buried, laser or mechanically drilled � Variety of finishes
CECC � Certificates:
CECC (cont) � Capability
Qualifications currently sought � IPC Class 3 – formal release May 2011 � AS9100 (Aerospace Approval) March 2011
Investment in 2010 / 2011 � Thin core cut sheet laminator � Loaders / unloaders (LDI, DES, pre-treat lines) � Orbotech Discovery AOI � 5 x Orbotech InCAM Front End systems � 5 x Orbotech InCAM Front End systems � New Class 10,000 clean room � ESI Laser drill upgrade � Effluent plant � Visper Automatic Final Inspection machine � Total cost ~ £1.5m
Product sectors � Military � Aerospace � Medical � Telecoms � Telecoms � Security � Entertainment � Sport � Domestic � Automotive UK, Europe and further
Product mix Rigid 12-22 Layer Miscellaneous PTH PTH Flexible Flexi-Rigid Rigid 4-10 Layer
Examples � Military � 49,500 holes � 10 levels blind / buried � Reinforced polyimide � Reinforced polyimide � Tg 260 deg C � 4 oz copper � Controlled depth rout
Examples (cont) � Aerospace � D/S Flexi � 50 micron blind laser drilled vias in 125 micron pads in 125 micron pads � Super finish (Ni / Pd / Au) � Flexible solder resist � 90 micron track / gap
Examples (cont) � Medical Implant - 2mm x 1mm laser routed 4 layer rigid, 2 x blind 4 layer rigid, 2 x blind vias Inserted into capsule, then swallowed 4 layer F/R Flexible O/L Track height 18 microns 100 micron track / gap to +/- 6 microns Adhesiveless flexi Track pitch to +/- 12 microns
All laser drilled and LDI 4 layer, 1-2, 2-3, 3-4, 1-4 drilling Examples (cont) � Telecoms Microwave - PTFE alternatives Edge plated fingers All laser drilled All laser drilled and LDI.6 layer. 1-2, 2-3, 3-4, 4-5, 5-6, 1-6 drilling
Examples (cont) � Security 25 micron PTHs in 50 micron tracks with 50 micron gaps
Examples (cont) � Entertainment Photogragh reproduced kind permission of Active Silicon www.activesilicon.co.uk who specialise in the design, manufacture and supply of specialist digital imaging products and technologies 6 layer Flexi - Rigid
Examples (cont) � Research 6 layer stepped flexible with 1-2, 2-3, 3-4, 4-5, 5-6, 1-6 drilling
Others Stepped boards Metal backed PTFE Flying leads
Special Equipment � 4 x Laser drill - UV YAG � 2 x Laser Direct Image (LDI) – 2 mil Track / Gap and Solder Resist � Auto-align outer layer & solder resist printers � Vacuum and High Temp bonding presses for PTFE � Specialist routers (Tru-Lon) for thick metal backing (Brass, Copper, Aluminium) � � Post etch punches and X-ray drill Post etch punches and X-ray drill � Permanganate and Plasma desmear / clean � Vacuum laminator � Multi-seat Perfectest for layer registration data � Ink jet printer for serialisation / legend � Resin fill machine � Polar TDR Impedance measurement � Struers microesectioning system (auto-profiling and sectioning)
Special Software � Genesis 2000 CAM stations (10 licences) � InCAM (5 licences) – latest State of the Art CAM software � Softwires PCP 2000 CIM system dedicated to PCB manufacture � Lab Wizard for chemical analysis � Lab Wizard for chemical analysis � Track Pro for calibration � Pirana for maintenance � In-house software for Capacity Planning � Polar SI 8000 (Impedance modelling) � InStack (Simultaneous Impedance and Build-up modelling) � Q-Pulse for document control
Genesis 2000 CAM
Controlled Impedance
Laser drill ESI 5200 UV YAG
Laser drill microsections � All laser drilled into reinforced polyimide Buried via Blind vias PTH
Laser drill techniques Illustrations (c) 2004 Electro Scientific Industries, www.esi.com, used with permission. Blind holes Stage 1 Stage 2 Through holes
Laser drill SEMs Photos (c) 2004 Electro Scientific Industries, www.esi.com, used with permission.
Laser direct imaging (LDI) � Orbotech
Outer Layer and Solder Resist exposure � Bacher - auto registration
Visper Automatic Final Inspection machine
Class 10,000 clean room (Feb 2011)
Materials � Woven Glass Reinforced (Rigid) � Standard FR4 (Tg 135°C) incl. Halogen free � FR4 suitable for lead-free assembly � High Tg FR4 High Tg FR4 • Withstands higher temperatures (Tg 175°C and 210ºC) � Stablcor • Low CTE in X/Y, low weight, high stiffness, high thermal conductivity � Polyimide • High Tg of 260 °C, low TCE (z), low Df
Materials � Suitable for lead-free assembly could be: � >Tg 150°C (Standard FR4 is 135°C) � >Td 330 °C (Standard FR4 is 300°C) � >Td 330 °C (Standard FR4 is 300°C) � >T260 15minutes (Standard FR4 is 4 mins) � IPC define as IPC 4101B/99, 101, 121, 124, 126, 129
Materials (IPC defined for lead-free) IPC- IPC IPC IPC - - -4101B 4101B 4101B 4101B 99 99 99 99 101 101 101 101 121 121 121 121 124 124 124 124 126 126 126 126 129 129 129 129 ANSI ANSI ANSI ANSI FR4 FR4 FR4 FR4 FR4 FR4 Fillers > 5% Fillers > 5% Yes Yes N/A N/A Yes N/A Fillers > 5% Fillers > 5% Tg Tg >150°C >110°C >110°C >150°C >170°C >170°C Tg Tg Td Td >325°C >310°C >310°C >325°C >340°C >340°C Td Td CTE 50 CTE 50- -260 260° °C C <3,5% <4% <4% <3,5% <3,0% <3,0% CTE 50 CTE 50 - - 260 260 ° ° C C T260 T260 T260 T260 >30min >30min >30min >30min >30min >30min T288 T288 >10min >5min >5min >10min >15min >15min T288 T288
Materials (cont) � Random Aramid Reinforcment (Rigid) � Epoxy or polyimide based � Easily laser ablatable � Easily laser ablatable � Improved, repeatable dimensional stability � Ideal for sequential build up (SBU) � Resin only � e.g. RCC (Resin Coated Copper) � ideal for laser drilling outer layers � must be attached to a rigid core
Materials (cont) � High frequency applications � PTFE • Optimum frequency range 1-90 GHz • Optimum frequency range 1-90 GHz • Low Dk ~ 2.3 • Low Df ~ 0.001 • Metal backed � PTFE alternatives • Optimum frequency range 100MHz - 15GHz • Dk ~ 3.38 / 3.48 • Df ~ 0.0022 / 0.004
Materials (cont) � Flexible � Polyimide (Kapton™) base and coverlays � Epoxy, acryllic, pure polyimide adhesives � Epoxy, acryllic, pure polyimide adhesives � Single, double sided and multilayer structures � Thin and low weight
Materials (cont) � Copper � 2µm - 140µm copper thickness � Can be used for electrical and thermal � Can be used for electrical and thermal conductivity � Thick copper can be used for rigidity if placed near outer layers � Copper / Invar / Copper (used for restraining purposes for TCE matching)
Materials (cont) � New generation laminates � Hole filling pre-preg with High Tg � Enhanced Epoxy for Tg > 210 deg C � Enhanced Epoxy for Tg > 210 deg C � SI glass for optimum signal integrity and precise impedance � We are constantly examining new materials with our suppliers, who are always prepared to discuss further requirements with our customers
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