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Sensors and packages based on LTCC and thick-film technology for severe conditions P. Ryser, Th. Maeder, C. Jacq, Y. Fournier & G. Corradini Laboratoire de Production Microtechnique Ecole Polytechnique Fdrale de Lausanne EPFL - LPM,


  1. Sensors and packages based on LTCC and thick-film technology for severe conditions P. Ryser, Th. Maeder, C. Jacq, Y. Fournier & G. Corradini Laboratoire de Production Microtechnique Ecole Polytechnique Fédérale de Lausanne EPFL - LPM, Station 17, CH-1015 Lausanne, Switzerland thomas.maeder@epfl.ch, lpm.epfl.ch/tf ICAM 2007 8-13.10.2007 Bangalore

  2. Outline 1. Introduction - thick-film technology & LTCC 2. Liquid level sensor - “flip-chip” thick-film technology 3. Jet engine AMB sensor - thick-film @ high temperature 4. Hydrostatic high-pressure sensor - immersed LTCC 5. Chemical liquid microreactor - LTCC fluidic modules 6. Gas viscosity sensor - LTCC membranes & � -channels 7. Conclusions & outlook Outline ICAM 2007 8-13.10.2007 Bangalore

  3. 1. Introduction 1. Introduction - thick-film technology & LTCC 2. Liquid level sensor - “flip-chip” thick-film technology 3. Jet engine AMB sensor - thick-film @ high temperature 4. Hydrostatic high-pressure sensor - immersed LTCC 5. Chemical liquid microreactor - LTCC fluidic modules 6. Gas viscosity sensor - LTCC membranes & � -channels 7. Conclusions & outlook Introduction ICAM 2007 8-13.10.2007 Bangalore

  4. 1. Introduction - thick films � Thick-film circuit : series of layers � Screen-printing of layers with a mask � Direct dispensing (prototypes) � Each layer comes as a paste: � Functional material (as powder) � Organic vehicle: binder + solvent � Materials (usually mineral) � Conductors � Resistors : mechanical & thermal sensors � Dielectrics � … and more! Introduction ICAM 2007 8-13.10.2007 Bangalore

  5. 1. Thick-film process Introduction ICAM 2007 8-13.10.2007 Bangalore

  6. 1. Thick-film process Introduction ICAM 2007 8-13.10.2007 Bangalore

  7. 1. Thick-film process Introduction ICAM 2007 8-13.10.2007 Bangalore

  8. 1. Thick-film process Introduction ICAM 2007 8-13.10.2007 Bangalore

  9. 1. Introduction - LTCC What is LTCC? • LTCC stands for « Low-Temperature Co-fired Ceramic ». • It is an evolution of standard thick-film technology. • The ceramic is a silicate material + Al 2 O 3 with outstanding chemical and thermal stability. How is it made? • LTCC comes as unfired « green » sheet (tape) of various thicknesses (ceramic powder with polymer binder). • Each sheet is shaped & screen-printed with conductive, resistive, or other pastes. • Finally, the sheets are pressed & fired together. Introduction ICAM 2007 8-13.10.2007 Bangalore

  10. 1. LTCC application examples Introduction ICAM 2007 8-13.10.2007 Bangalore

  11. 1. 3-D structuration of LTCC Introduction ICAM 2007 8-13.10.2007 Bangalore

  12. 1. LTCC manufacturing process Introduction ICAM 2007 8-13.10.2007 Bangalore

  13. 1. LTCC manufacturing process Introduction ICAM 2007 8-13.10.2007 Bangalore

  14. 1. LTCC manufacturing process Introduction ICAM 2007 8-13.10.2007 Bangalore

  15. 1. LTCC manufacturing process Introduction ICAM 2007 8-13.10.2007 Bangalore

  16. 1. LTCC manufacturing process Introduction ICAM 2007 8-13.10.2007 Bangalore

  17. 1. LTCC advantages T firing < 900°C --> allows use of silver conductors High-density packaging 3-D structuration Hermetic structures Reliable mechanical, thermal and electrical performance High volume, low cost fabrication Introduction ICAM 2007 8-13.10.2007 Bangalore

  18. 1. LTCC vs. alumina for sensors > Thermal, low-range mechanical sensors Introduction ICAM 2007 8-13.10.2007 Bangalore

  19. 2. Thick-film liquid level sensor 1. Introduction - thick-film technology & LTCC 2. Liquid level sensor - “flip-chip” thick-film technology 3. Jet engine AMB sensor - thick-film @ high temperature 4. Hydrostatic high-pressure sensor - immersed LTCC 5. Chemical liquid microreactor - LTCC fluidic modules 6. Gas viscosity sensor - LTCC membranes & � -channels 7. Conclusions & outlook Level sensor ICAM 2007 8-13.10.2007 Bangalore

  20. 2. Thick-film liquid level sensor Features: • Absolute piezoresistive pressure sensor for continuous immersion in water & fluids • 3 thick-film circuits 1. Base 2. Membrane 3. Electronics • Membrane side in fluid • Electronics & cable protected by epoxy potting compound Level sensor ICAM 2007 8-13.10.2007 Bangalore

  21. 2. Level sensor - module Enclosure Epoxy potting Cable Membrane Electronics Membrane free-standing to avoid stress induced by packaging Level sensor ICAM 2007 8-13.10.2007 Bangalore

  22. 2. Level sensor - membrane Piezoresistors Conductive sealing glass (Insulating) Cut sealing glass Coarse offset adjustment Level sensor ICAM 2007 8-13.10.2007 Bangalore

  23. 2. Level sensor - seal Level sensor ICAM 2007 8-13.10.2007 Bangalore

  24. 2. Level sensor - seal Epoxy Fluid potting Level sensor ICAM 2007 8-13.10.2007 Bangalore

  25. 2. Level sensor - conclusions • Full media separation achieved • Compatibility with fuels & mildly aggressive aqueous solutions (critical points : sealing glass & potting compound) • Absolute sensor for lower cost & increased reliability • Reference cavity through hermetic glass seal • Batch production processes Level sensor ICAM 2007 8-13.10.2007 Bangalore

  26. 3. Jet engine AMB sensor 1. Introduction - thick-film technology & LTCC 2. Liquid level sensor - “flip-chip” thick-film technology 3. Jet engine AMB sensor - thick-film @ high temperature 4. Hydrostatic high-pressure sensor - immersed LTCC 5. Chemical liquid microreactor - LTCC fluidic modules 6. Gas viscosity sensor - LTCC membranes & � -channels 7. Conclusions & outlook Jet engine AMB sensor ICAM 2007 8-13.10.2007 Bangalore

  27. 3. Jet engine AMB sensor (L. Burdet) • A ctive M agnetic B earing (AMB) XY position sensor for jet engines • Magnetic position sensor - eddy currents in rotor • No mechanical bearings (oil, wear, cooling,…) • Increased reliability • Decreased maintenance costs • Operation @ 550…600°C in aggressive gases • Thick-film circuit Jet engine AMB sensor ICAM 2007 8-13.10.2007 Bangalore

  28. 3. AMB sensor principle Jet engine AMB sensor ICAM 2007 8-13.10.2007 Bangalore

  29. 3. AMB sensor circuit build-up Inductor build-up Windings Pads Jet engine AMB sensor ICAM 2007 8-13.10.2007 Bangalore

  30. 3. Kirkendall effect @ high temp. Result of long-term stability (>2’000 hours) Au pads Ag pads Ag:Pd pads (c3) (c3) (c3) Au lines OK X X (c1 & c2) Ag lines X OK X (c1 & c2) • Only (quasi) identical metals may be in contact! • Silver selected for cost & high conductivity Jet engine AMB sensor ICAM 2007 8-13.10.2007 Bangalore

  31. 3. Ag electromigration @ high temp. • Shorting of windings Pad after long-term operation at high temperature • Degradation only observed if voltage Short applied • Creation of Ag conductive paths identified at pads • High-temperature Pad Ag electromigration! • No problems if covered Jet engine AMB sensor ICAM 2007 8-13.10.2007 Bangalore

  32. 3. Ag electromigration - mitigation • Need modern migration- resistant cristallising dielectric! • Use of resistive guard pad or ring to cancel electric field around pad glassy dielectric cristallising diel. also possible • Extensive long-term qualification of these solutions still needed! Resistive guard pad / ring Jet engine AMB sensor ICAM 2007 8-13.10.2007 Bangalore

  33. 3. Jet engine AMB - conclusions • Control of AMB (Active Magnetic Bearing) achieved • Operation of thick-film circuit demonstrated @ 600°C ! • Electromigration of silver & Kirkendall effect problematic • Electromigration stopped with • dielectric • resistor (conductive) guard ring • Kirkendall effect avoided by using only pure Ag for conductors & cables Jet engine AMB sensor ICAM 2007 8-13.10.2007 Bangalore

  34. 4. LTCC hydrostatic high-pressure sensor 1. Introduction - thick-film technology & LTCC 2. Liquid level sensor - “flip-chip” thick-film technology 3. Jet engine AMB sensor - thick-film @ high temperature 4. Hydrostatic high-pressure sensor - immersed LTCC 5. Chemical liquid microreactor - LTCC fluidic modules 6. Gas viscosity sensor - LTCC membranes & � -channels 7. Conclusions & outlook LTCC hydrostatic high-pressure sensor ICAM 2007 8-13.10.2007 Bangalore

  35. 4. LTCC hydrostatic high-pressure sensor • Ceramics: limitations for tensile stresses • In principle “unlimited” pressure allowed � LTCC “hydrostatic” sensor concept: Ambient High pressure pressure LTCC hydrostatic high-pressure sensor ICAM 2007 8-13.10.2007 Bangalore

  36. 4. LTCC hydrostatic sensor module Ambient pressure High pressure • Principle : LTCC “stick” (reference) resistors (active) resistors • Circuit: 4 LTCC layers (DP 951 & DP 2041) Lids Core layers: measurement bridge • Resulting module LTCC hydrostatic high-pressure sensor ICAM 2007 8-13.10.2007 Bangalore

  37. 4. Hydrostatic sensor packaging & test jig • Epoxy adhesive feed-through • Sensor test jig: O-ring Tightening Carrier Sensor Complete assembly seal nut LTCC hydrostatic high-pressure sensor ICAM 2007 8-13.10.2007 Bangalore

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