scintillator CAL for Linear Collider Tohru Takeshita (Shinshu) for - PowerPoint PPT Presentation

LC physics requires a fine granular CAL. Scintillator strip detector make it possible with good timing resolution. Shinshu University scintillator CAL for Linear Collider Tohru Takeshita (Shinshu) for CALICE-ASIA

scintillator strip for calorimeter sensor granularity channel rather reduced (than pad/pixel type) dynamic range as a calorimeter 45x5x2mm 3 2.45x1.9x0.85mm 3 n scintillator is robust, reliable and stable n to meet PFA requirement which is fine n perpendicular strips make it possible, n while keeping the number of readout n with novel silicon-photo-detector n issue: uniformity, light yield and

strip uniformity n measured in lab. by beta rays with reflector light yield present design naked key : air gap and reflector Tsuzuki 5mm 45mm n in front of the sensor, too much direct lights

strip uniformity n Geant4 simulation (not optimized) slc : parameter of reflection direct light Tsuzuki

uniformity & yield air gap scintillator surface n we need reflector & n if we spatter Al on the Al spattering present des

light yield n measured by beta rays n different thickness 1 ~ 2 mm n well separated from noise Hamasaki

~10000 pixel if 7p.e./MIP generate maximum shower energy light yield and max. n ECAL will have Bhabha events which n simulation of 250GeV electrons energy / sc-strip (5x45mm2) Emax(MIP) strip scintillator energy deposit (MIP) 2000 1500 1700 MIP Emax(MIP) 1000 500 dE /strip (GeV) 0 0 50 100 150 200 250 300 Egamma(GeV)

of pixels in of arrival photons dynamic range of PPD n Pixelated PD response is limited by its number n to measure BhaBha EM shower n max. pixel needed ~ 10000, when a mip ~7 p.e. n slow saturation is seen due to time structure Comparison of RC MPPC output [p.e.] 4000 10k n metal register 3500 3000 n 10kpix./1mm 2 2500 2000 1.6k 10um 1500 10000pix_75.084V 4400pix_69.522V 1000 1600pix_67.031V old_1600pix_72.117V 500 0 0 2000 4000 6000 8000 10000 Incident Photon Intensity [photoelectrons on MPPC]

scintillator area should collect lights, how ? design of a layer n PPD has dead volume in the n to avoid it, surface mounted PPD simulation

wedge shape strip meas. normal wedge tapered wedge present sensor n by beta rays location n normal n tapered wedge n wedge by S.Ieki(Tokyo)

wedge strip simulation n optimize PPD location and size 1mmx1mm PPD 0.25mmx4mm PPD square wider PPD x 1.5mm x PPD simulation distance form end of wedge simulation distance form end of wedge x x strip center strip center width direction[mm] width direction[mm]

180x180mm 2 board terminal EBU thick middle x18cm 180 mm embedded 180 mm EBU 144 strips on a EBU combined layer n current status n strip: 5mm x 45mm x 2mm n 144 ch./layer of 18cm n front end electronics n 4 SPIROCs (4x36ch) n EBU (Ecal Base Unit)

by Omega gains validation bit SPIROC2B n 36ch/ASIC chip made n bias V control n 12bit ADC with dual n auto-trigger mode n external trigger and n 12bit TDC with < 1ns

196 193 hole for each strip 195 194 LED calib. n LED lights go through a n 92% success Forward layer result @DESY ChipID==132&&ChannelNumber==18&&Trigger==13 ChipID==132&&ChannelNumber==18&&Trigger==13 h1 Entries 7000 Entries Mean 304.6 RMS 37.62 100 2 / ndf 57.12 / 48 � Prob 0.1724 ampliGaus0 78.1 3.0 ± 80 meanGaus0 264 ± 0.3 sigmaGaus 5.738 0.127 ± ampliGaus1 99.18 3.50 ± distanceGaus 19.2 0.2 ± 60 ampliGaus2 98.84 3.24 ± 40 20 0 200 250 300 350 400 450 500 550 600 ADC cont can be carried out at lab.

稲吉 信州 反応しない イカレタ信号 肩 分離は難 source test at lob. n by Sr90 e-source, with auto-trig. mode Source 90 Sr Test 129 130 good for mass test MPPC への InPut DAC を変更

beam test n at DESY Middle EBU Terminal EBU n two EBU types: M & T n synchronized DAQ with Sc layer beam AHCal layer n AHCAL (SPIROC) n SiECAL (SKYROC) Sc layer beam n Si layer

8 p.e. external validation mode 0.5 mip threshold e-MIP calib. Entries 1200 1000 n 3GeV electrons 800 n auto-trigger mode + 600 400 200 n pedestal subtracted well 0 300 400 500 600 700 800 900 ADC counts forward backward n success 98% & 96% Run_208 ChipID_196 Ch_14 ADC/MIP = 131.7 ± 2.38 200 � 2 = 1.15 Entry = 5323 180 226 160 140 calibrated well 120 100 80 60 227 40 195 196 20 0 0 100 200 300 400 500 600 MIP distribution MIP distribution Entries 180 is difficult to separate. ChipID_196 Ch_35 160 MPV = 322.17 ± 7.66 140 reduced 2 = 0.8774 � But get the MPV. 120 100 80 ch5 60 40 225 228 20 0 300 400 500 600 700 800 MIP deposit energy (ADC cont) 194 193 strange signal (noisy) No signal.

ch. の each channel information for ＊＊＊＊＊＊＊＊＊＊＊＊＊＊＊＊＊＊＊＊＊＊＊＊＊＊＊＊＊＊＊＊＊＊＊＊＊＊＊＊＊＊＊＊＊＊＊＊＊＊＊＊＊＊＊＊＊＊＊＊＊＊＊＊＊＊ が違う 差の の による、 上二つの図では： １層と２層の差を見れば、形は色々あります １層だけみれば、形はほぼ同じ。 で： ありの TDC results R488-Layer1Ch2&Layer2Ch32coincidence n timing Max.TDC_Dif: TDC_dif 1739 TDC_Dif TDC_Dif Entries Entries 481 481 50 Mean Mean 285.3 285.3 di fg . RMS RMS 355.5 355.5 L1 TDC_Chip194 TDC_Chip194 40 Entries Entries 481 481 Mean Mean 1334 1334 RMS RMS 450 450 n difference ~0 TDC_Chip225 TDC_Chip225 Entries Entries 481 481 Mean Mean 1620 1620 30 RMS RMS 577.7 577.7 n resolution ~2ns/ L2 20 10 0 -4000 -3000 -2000 -1000 0 1000 2000 3000 4000

5mm x 5mm resolution stand alone test strip uniformity with SSA n with simple SSA, we have Position scan with beam n almost consistent with lab. MPPCs Section0 Section8 Forward layer Np.e. Backward layer Np.e. Uniformity Uniformity 12 12 N_P.E. N_P.E. 10 10 Np.e. Np.e. 8 8 6 6 Chip226Ch23 Chip194Ch23 Chip226Ch24 Chip194Ch24 4 4 Chip226Ch25 Chip194Ch25 Chip226Ch26 Chip194Ch26 2 2 Scintillator Scintillator 0 0 0 2 4 6 8 10 0 2 4 6 8 10 Section Point Section Point Section Section

shower event EBU layers covered by sheet n simple SSA applied Tungsten plates backward layer ••••• forward layer 3Wplates 7Wplates Cell Energy 180 0.1 180 0.1 Y Axis Y Axis 0.09 0.09 160 160 0.08 0.08 140 140 0.07 0.07 120 120 0.06 0.06 100 100 0.05 0.05 80 80 0.04 0.04 60 60 0.03 0.03 40 40 0.02 0.02 20 20 0.01 0.01 0 0 0 0 0 20 40 60 80 100 120 140 160 180 0 20 40 60 80 100 120 140 160 180 X Axis X Axis

combined with AHCAL correlation AHCAL n diagonal settings in H it M ap o f H BU X Axis 350 300 250 200 150 100 50 0 n similar but finer 0 0 9 9 5 1 50 7 8 1 100 High 1 8 12 18 21 H it M ap o f EBU Threshold 100 200 1 7 5 7 7 1 HitRateDisplay_EBU_with_twoLayers 180 Y Axis 100 3 6 3 12 34 105 160 150 300 High High 800 140 3 4 24 255 6989 Threshold Threshold 120 1 10 4473 4 17 200 1 600 400 100 18cm 1 3 3 1010 3 6 2 1 3 2 2 2 1 1 1 3 2 7 9 10 5 3 2 5 3 3 1 1 2 80 High 1 1 3 16 6 6 10 3 5 3 2 2 2 2 High 9 11112843291110 8 3 1 5 2 2 2 1 400 6 1316233913101110 4 7 2 1 2 2 1 18cm 60 4 2232579365242820 8 10 3 4 4 3 1 1 250 Threshold 175685 166 234 123574431131711 7 1 2 1 500 1386 187 325 475 253918775231513 3 5 3 3 Threshold 3 12 7 10 1 1781 199 372 559 308 1179861161410 2 3 1 2 40 37 145 356 693 876 541 324 319 25342622613 3 1 1 2 2 42 169 423 793 1022 710 405 390 2993566342114 2 4 4 4 200 High 32 105 218 471 584 591 707 622 36365 128391513 2 6 1 2 2046 112 204 254 450 720 653 53683 1634514 6 4 1 2 2 183762 104 124 240 394 350 28055924012 2 1 5 1 2 20 2 7 2 2 3 5 12395463 134 197 171 12226502212 6 2 1 2 Threshold 10 7 19213958666162152217 3 5 2 3 1 300 1 5 16102937272528152317 4 4 3 1 7 3 Y Axis 6 17 5 3 1 2 600 0 0 0 20 40 60 80 100 120 140 160 180 6 8 5 High X Axis Threshold 18cm 1 13 1 1 350 HitRateDisplay_HBU_with_twoLayers 18cm

developing with good timing resolution without dead space by PPD source calibration capability in lab. by auto- trigger summary & outlook n fine segmented scintillator strip ECAL is under n strip has become homogeneous enough, n 1mm thick scintillator is under consideration n embedded FEE is developing with LED & n power pulsing test n combined DAQ with silicon ECAL/AHCAL

homogeneous structure scintillator sensors a Dream n a calorimeter with n tungsten absorbers and

ILD ECAL n need long slav construction and test EBU

Thinner EBU can reduce thickness of ECAL ▶ Developed by AHCAL group 1.8 mm ▶ 1.2-1.3 mm req. ASIC package Total Compress 0.6 mm, ex Ball grid array w/ naked ASIC Further optimization (1) :thickness of EBU Ecal Base board Unit (EBU) Small radius of magnet ▶ Lowcost 25