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PD front-end electronics Josh Spitz, University of Michigan 30% - PowerPoint PPT Presentation

PD front-end electronics Josh Spitz, University of Michigan 30% DUNE Design Review, 11/12/2018 with: Dave Warner, Jon Ameel, Gustavo Cancelo, Rory Fitzpatrick, Chris Barnes, Matt Toups, Sten Hansen, Dante Totani, Joel Mousseau, Alex Himmel, and


  1. PD front-end electronics Josh Spitz, University of Michigan 30% DUNE Design Review, 11/12/2018 with: Dave Warner, Jon Ameel, Gustavo Cancelo, Rory Fitzpatrick, Chris Barnes, Matt Toups, Sten Hansen, Dante Totani, Joel Mousseau, Alex Himmel, and others

  2. Introduction • Commercial ADCs used in ultrasonic transducers (Texas Instruments) are being used for digitization in the SiPM- based mu2e cosmic ray veto scintillator. • Low noise, high gain, high dynamic range. • 80 Megasamples per second, 12 bit • Low cost ($50/channel) and capable of handling the envisioned DUNE MPPC (SiPM) warm-side PD signals. ! 2

  3. Warm-side electronics elements • Warm-side FEB • 64 channels of 80 MS/s, 12 bit ADCs • Bias generator (for SiPMs; 80 V max) • Current measurement (100pA resolution) for IV curves of SiPMs • Power-over-ethernet power (600 mA) for entire board’s power. One Cat6-cable for data and power. • 1 GB DRAM data bu ff er, divided in 4 places (256 MB each) on the board, corresponding to the 4 FPGAs • Parallel flash ROM for fast FPGA re-load (50 ms) • Low cost, high bandwidth HDMI used to connect to cold-side • Readout controller • 24 FEB link ports. Supplies timing, trigger, and power to FEBs • Can produce (e.g. TPC) triggers and also accept external (e.g. accelerator) triggers Adapted from Sten Hansen ! 3

  4. Front-end board (64 channels, 80 MS/s, 12 bit) Aux +48 Local Trigger, Gate Ethernet USB Isolated 48 DC-DC Supply LV DC-DC Link to TCP/IP Supplies Chip Controller 64 Meg Bias Generator Arm uC Flash 2Gb LPDDR Spartan 6 FPGA Ultrasound Chips HDMI Connecters to CMB boards 20 Courtesy of Sten Hansen � 4

  5. Front-end board (64 channels, 80 MS/s, 12 bit) 1 of 4 SiPMs Bias Bus SiPM Bias Bias Trim Bias Bus Generator DAC Cvt Clk One of 8 Timing/ FR Clk 12 bit 80msps Trigger S Dat ADCs/chip RJ-45 Counter 48V One of 64 Controller Mother Link Channels Board 3.3v Data LV DC-DC 2.5v Octal 256MB Converters 1.8v UltraSound LPDDR FPGA 1.2v RAM Processor Octal UltraSound Ethernet Microcontroller Processor with ECC RAM PHY Chan0..15 ARM Chan16..31 USB Chan32..47 Parallel FLASH Chan48..63 CFG ROM Courtesy of Sten Hansen ! 5

  6. Commercial ultrasound ADC Eight channels of: low noise preamp, variable gain amp, Eight channels of: low noise preamp, variable gain amp, programmable gain amp, programmable low pass filter, 80 MS/s, 12 bit ADC, $8 per channel, 120 mW per channel. Can adjust gain so that 1pe=10 ADC Adapted from Sten Hansen ! 6

  7. Back view Ethernet in / out 2 TTL outputs Fiber in / out Controller 2 TTL inputs 48 V Bulk Supply +5V Local Supply Front view Courtesy of Sten Hansen ! 7

  8. Controller w/ one FEB Front End Board and Controller FEB Controller • ! 8

  9. Controller w/ two FEBs FEB FEB Controller ! 9

  10. Readout Controller Block Diagram Courtesy of Sten Hansen ! 10

  11. Power and Data Link Arrangement Isolated 48V Supply 48V Power Supply 700W POE+ Is IEEE Isolation Isolation Feedback 802.3at Feedback standard Primary Secondary Primary Secondary Transformer + + 120 VAC Transformer To POL 48VDC 48VDC Converters - - Cat 6 Board Cable ~20K Ground Chassis CRV Front POE Signal POE Signal Transformer Transformer End Board POE + PSE POE + PD Controller Controller PSE – power One chip Controls Single 8 PD – powered sourcing pin chip four ports device equipment POE Signal POE Signal Transformer Transformer One of 24 Ports POE Signal POE Signal Transformer Transformer CRV Controller POE Signal POE Signal Transformer Transformer Courtesy of Sten Hansen ! 11

  12. DAQ concept • 12 FEBs referenced to a single chassis, each FEB communicates over copper to a master controller (DC isolated on both sides). • Each controller can take digital inputs from 24 FEBs (64 channels each->1536 channels, or in the case of 40 channels each->960 channels). • Controller provides power (48 V supply) to FEBs. • Controller connects to a DAQ PC either over fiber optic or ethernet (copper). • Pulses (timestamp and pulse height) are sent from FEBs to controller. Controller issues global trigger to FEBs. ! 12

  13. Can the FEB work with the active summing board? (yes) ! 13

  14. Bench-top tests MPPC Tests OpAmp SiPM Power Power Supply Supply Laptop for DAQ Op-amp output is di ff erentiated, (in cold) while the FEB has a single-ended op-amp. Bias for op-amp and MPPCs provided Need to “undi ff erentiate” signal with balun by external DC power supply ! 14

  15. 72 MPPC array test each of 12 rows has 6 of 6mm 2 MPPCs in parallel total capacitance of 7.8 nF per row MPPC=Hamamatsu S13360-6050VE ! 15

  16. Successfully demonstrated Comparisons to SSPs single photon resolution! Mu2e FEB S/N = 4 SSP , S/N = 5 courtesy of Gustavo and Dante • Comparable resolution measured as peak to width ratio. Comparable resolution measured as peak-to-width ratio ! 16

  17. Average waveforms 1 tick = 12.55 ns • Rise time: 125 ns • Fall time: 350 ns • Recovery time: O(2us) — what’s shown on the right is as wide a window as the FEB allows ! 17

  18. Zero-suppression • Zero suppression: Time tick is saved to the board’s RAM if the tick is above a pre-set pedestal value. • mu2e and SBND will use the FEB+controller to take zero- suppressed data. • FEB+controller zero suppression interface work is ongoing. • Work towards fully understanding the zero-suppression (suppression factor) requirements is ongoing. • Dependent on readout window and overall trigger rate. ! 18

  19. Bandwidth and rates • Bottleneck is 10MB/s FEB to controller rate (per FEB). • Currently considering 40 readout channels per board. • 80 MHz, 12 bit ADC; 5.5 us waveforms=5.3 kbit/waveform • Consistent with longest waveforms (including late-light) expected • DC rate: 250 Hz/channel; 53 Mbps/APA (1 APA=40 channels) • 6.6 MB/s FEB to controller DC rate (compare to 10 MB/s FEB-controller bottleneck) • Can develop multi-channel coincidence+threshold requirement at the FEB firmware level to mitigate (study ongoing). • DAQ interface spec: 8Gbps per connection. DAQ takes 24 FEB signals (10 Mbps each)=240 Mbps. Ok! • Maximum instantaneous rate: 6000 channels fire at once • 32 Mbits (4 MB) at once. • The controller can handle all 24 boards firing at once. Write speed for 24 boards is 150 MB/s and could likely be increased to 400 MB/s with some work (according to Sten Hansen). ! 19

  20. Firmware development om the Synthesis, the first step, checks the syntax ultrasound chips to the FEB and (2) deliver es operly spaced intervals ciently ou can run a behavioral simulation, one that is run without timing information, Source: “FPGA Design Flow Overview”, Xilinx Website. Xilinx ISE: This is a design environment used to design firmware written in VHDL for use in Field-Programmable Gate Arrays (FPGAs). The ISE (“Integrated Synthesis Environment”) version, 14.7, is the last available version that works with a Spartan 6 FPGA. ModelSim: This is a simulation environment for VHDL and other hardware description languages, distributed by Mentor Graphics. The version, 10.2c, is the version that works with the ModelSim license at Fermilab. ! 20

  21. Structure of the Firmware The firmware is written in VHDL, called “Very High Speed Integrated Circuit Hardware Description Language”. The firmware is separated into three components: 1. Main Firmware File (extension “vhd”): contains the logic for piping data into the FEB and out to the controller. 2. Test Bench (extension “tb”): contains the timing structure for each of the signals that the logic in #1 handles. 3. Constraints File (extension “ucf”): contains the associations between the ports on the FEB and the signals within #1. 4. Project Definitions File (extension “vhd”): defines iterators and constants that are used within #1. The remainder of the firmware consists of the functional models of components that are called within #1. Initially written for mu2e->adapting it for DUNE (ongoing work) ! 21

  22. Power considerations • In addition to digitizing the SiPM signals, the FEB is nominally designed to bias the SiPMS. • Can the power be used for the active summing board as well? • No, it does not provide a stable enough voltage. The on-board Cockroft- Walton should not be used to bias the di ff erential amplifier of the summing board. • How to handle this? • Redesign on-FEB power supply? • Include another cable/wire in design? • We are working to address this. ! 22

  23. Rack space and power consumptions • 6000 channels total; assume 40 channels/FEB • 12 FEB/chassis, 13 chassis (6u each) required for FEBs. • 7 controllers (controlling 24 FEB each), 1 u each. • ~85u required. Assuming 42u/rack, we will need just over 2 racks. • Power supply on a controller is 700 W, each FEB takes 20 W. ! 23

  24. Grounding scheme Cat 6, twisted pair (x12) Controller Cat6: 26 Cat 6a, twisted pair AWG, 2.2 A (shielded) (x192) 48 V 48 V max, 5 V FEB 700 mA 700 W Supply (x12) Supply fuse POE (DC) 80 V max, Card Cat6a: 26 Cat 6, twisted 3 mA trip AWG, 2.2 A pair (x12) Controller Chassis (x7) FEB Chassis (x12) RJ 45 connector: 100 VAC, 1.5 A Detector DAQ PC (x1) Ground Feedthrough Building Ground LEGEND PCB Chassis LV Power (< 80 V) Analog Signal Power Supply Solid lines denote Cu Digital Signal Dashed lines Denote optical 1 ! 24

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