Signal/noise in 1 pixel (small diode) Events 0.07 R&D for High energy physics experiments 0.06 0.05 RECFA review 0.04 - 0.03 0.02 0.01 0 0 20 40 60 80 100 120 Signal/Noise Overview of R&D Activities for H.E.P. at IN2P3 & DAPNIA Marc Winter (for IN2P3 & DAPNIA) contributors: R.Barbier, S.Katsanevas, V.Lepeltier, S.Marnieros, A.Savoy-Navarro, ... OUTLINE • R&D for ILC detectors: � Vertex detector � Tracking detectors � Calorimetres • R&D for non-collider experiments: � Photosensitive detectors (GIS) � Bolometres � Distributed Intelligence � High precision mirrors • Summary 12/05/06, –1–
Signal/noise in 1 pixel (small diode) 0.07 Events 0.06 0.05 RECFA review 0.04 - 0.03 0.02 0.01 0 0 20 40 60 80 100 120 Signal/Noise Part 1: R&D for ILC Experiments � Vertex Detector - Tracking Devices - Calorimeters � All developments are part of EUDET (FP-6) Project � > 100 physicists, engineers, PhD students, ... involved 12/05/06, –2–
Signal/noise in 1 pixel (small diode) Events 0.07 ILC: Goals of R&D for Vertexing & Tracking 0.06 0.05 RECFA review 0.04 - 0.03 0.02 0.01 0 0 20 40 60 80 100 120 Signal/Noise ⊲⊲ Accuracy = Key towards Understanding �→ 1–2 orders of mag. beyond LHC sensitivity � Overriding challenges for vertexing: ⊸ δ ( IP r φ, z ) = 5 ⊕ 10 / p · sin 3 / 2 θ µ m ( SLD : 8 ⊕ 33 / p · sin 3 / 2 θ µ m ) ⊸ occupancy induced by beam background (O(10 3 ) e ± /BX) ֒ → w.r.t. LHC: 1/5 R b.pipe , 1/30 pixel size, 1/30 material budget ֒ → � CCD: too slow & rad. soft � Hybrid Pixels: not granular and thin enough � Overriding challenges for charged particle tracking: ⊸ momentum resolution: σ ( 1 / p T ) ∼ few 10 − 5 (GeV/c) − 1 − → → 1 order of magnitude improvement w.r.t. existing set-ups ֒ ⊸ multi-track separation (e.g. inside jets) and extrapolation to ECAL: essential for particle flow ! ⊸ precise and efficient track reconstruction at small polar angles: ⋗ WW & ZZ production (esp. at V.H.E. → collimated jets) ⋗ luminosity determination (acolinearity of Bhabha-scattered e ± to ∼ 0.01 mrad) 12/05/06, –3–
Signal/noise in 1 pixel (small diode) Events 0.07 ILC: Goals of R&D on Calorimetry 0.06 0.05 RECFA review 0.04 - 0.03 0.02 0.01 0 0 20 40 60 80 100 120 Signal/Noise � Goal: Reconstruct accurately ∼ all jet four-momenta (combining Vx det., tracker, calo. & muon syst. info) σ Ejet 0 . 3 � Need for highly accurate Energy/Particle flow: E jet � √ E jet → w.r.t. LEP: twice better σ E jet w.r.t. LHC: 1/200 calorimeter granularity ֒ e.g.: separation of WW final states from ZZ final states in e + e − → ννW + W − , ννZZ, where W, Z → 2 jets � Together with: Hermeticity → missing (E, p) Low material budget → ∆ p/p, conversions and 12/05/06, –4–
Signal/noise in 1 pixel (small diode) Events 0.07 ILC: CMOS Sensors to equip the Vertex Detector 0.06 0.05 RECFA review 0.04 - 0.03 0.02 0.01 0 0 20 40 60 80 100 120 Signal/Noise ⊲⊲ R&D for Vertex Detector : IPHC (Strasbourg), DAPNIA (Saclay), LPSC (Grenoble), LPCC (Clermont) ֒ → relies on ∼ 17 FTE: 3 physicists, 8 engineers, 2 Post-docs, 4 PhD � CMOS sensors expected to provide an attractive trade-off between granularity, material budget, radiation tolerance, speed and power dissipation � Main R&D directions: • High r.o. speed, low noise, low power dissipation, compact signal processing µ circuits integrated inside the sensor (System–on–Chip) • Optimal fabrication processes (epitaxy thickness, doping profile, etc.) • Tolerance to non-ionising (and ionising) radiation • Room temperature operation : avoid active cooling • Thinning procedure : yield, minimal thickness, rigidity, ... � Collaboration with � 10 labs (Germany, Italy, UK, Switzerland, USA) 12/05/06, –5–
Signal/noise in 1 pixel (small diode) Events 0.07 ILC Vx Detector : CMOS Sensor Achievements 0.06 0.05 RECFA review 0.04 - 0.03 0.02 0.01 0 0 20 40 60 80 100 120 Signal/Noise � ∼ 15 (MIMOSA) prototypes designed, fabricated and characterised since 1999 � Most chips tested on H.E. beams (SPS, DESY) �→ well established performances : • N ∼ 10 e − �→ S/N � 20 – 30 �→ ǫ det � 99.5 % • σ sp ∼ 1.5 µm • Thinning to 50 µm �→ next : 35 µm • Rad. tolerance � 1 MRad, 10 12 n eq /cm 2 �→ next : � 10 13 n eq /cm 2 • T oper. � 40 ◦ C • Architecture with integrated discri. validated ( ǫ det � 99.3 % ; fake � 10 − 3 ) �→ next : integrated ADC & ∅ hsn1 hsn1 Mimosa 9: resolution vs pitch Signal/noise in 1 pixels Efficency vs Temperature Small Diode Entries Entries 6067 6067 100.2 3.5 Events Efficency % Resolution (microns) 180 Mean Mean 41.07 41.07 160 RMS RMS 23.57 23.57 100 3 0 0 140 Underflow Underflow 202 202 99.8 Overflow Overflow 120 χ χ 2 2 2.5 / ndf / ndf 199.8 / 131 199.8 / 131 100 ± ± 99.6 Constant Constant 930.5 930.5 18.14 18.14 pitch 20 small diode chip 1 80 ± ± pitch 30 small diode chip 1 MPV MPV 26.27 26.27 0.188 0.188 2 pitch 40 small diode chip 1 ± ± 99.4 6.521 6.521 0.1017 0.1017 60 Sigma Sigma pitch 20 small diode chip 3 40 pitch 30 small diode chip 3 1.5 99.2 pitch 40 small diode chip 3 20 0 99 1 0 0 20 20 40 40 60 60 80 80 100 100 120 120 140 140 -20 -10 0 10 20 30 40 15 20 25 30 35 40 45 o Pitch (microns) Temp ( C) Signal/Noise Signal/Noise � MIMOSA sensors will equip : � STAR Heavy Flavour Tagger: 1) 2008 (analog) 2) 2011 (digital) � EUDET beam telescope: 1) 2007 (analog) 2) 2008 (digital) and are further developed (rad.tol.) for CBM Vertex Detector (FAIR/GSI � 2012) � Spin-off: bio-medical imaging (SUCIMA/FP5 ; GIS with Photonis-Dep) 12/05/06, –6–
Signal/noise in 1 pixel (small diode) Events 0.07 ILC: R&D for Tracking Devices 0.06 0.05 RECFA review 0.04 - 0.03 0.02 0.01 0 0 20 40 60 80 100 120 Signal/Noise ⊲⊲ R&D for Central (TPC, Si strips) and Intermediate tracking (Si strips) � R&D goals for µ pattern gas detectors (DAPNIA - LAL : ∼ 5 FTE) ⊸ investigate potential of µ MEGAS : � combine with µ pads � minimise TPC dead zones, ⊸ investigate optimal gas mixture: � avoid H (neutron bg) �→ new quencher (CF4) � alleviated ⊥ diffusion � fast at low E drift ⊸ design highly integrated r.o. electronics with minimal P diss �→ material budget � R&D goals for Si-strip detectors (LPNHE - LAPP � 10 FTE: 4 phys., 6 engineers) ≎ Sensor R&D: module thickness ( ց ), length ( ր ), pitch ( ց ), yield ( ր ) ≎ FEE R&D: � shaping time (0.5 �→ 5 µ s) � low noise preAmp. � analog sampling � low P diss (pulsed powering) � highly compact (integrated) FEE chip � minimal mat. budget ≎ Development in Mechanics : mat. budget and integration related issues ≎ SiLC collaboration (coord. A.Savoy-Navarro) : > 20 labs (Europe, Asia, USA) ≎ New generation of Si strip detectors �→ synergy with evolution/trends of (S)LHC trackers 12/05/06, –7–
Signal/noise in 1 pixel (small diode) Events 0.07 - ILC: Major R&D Achievements for TPC Read-Out 0.06 0.05 RECFA review 0.04 0.03 0.02 0.01 0 0 20 40 60 80 100 120 Signal/Noise B e r k e le y S a c l a y L A L - O r s a y 4 G e V /c π + b e a m θ ~ 0 ° , φ ~ 0 ° , B = 1 T d i a m e te r 5 0 c m people involved le n g th 5 0 c m at DAPNIA-IN2P3 ~ 5 FTE spatial resolution � 0 = (52±1) µ m ⊲⊲ TPC equipped with µ MEGAS installed on KEK π − beam ⇛ ∼ 50 µm intrinsic accuracy achieved (resistive plate) � TPC equipped with µ MEGAS coupled to Medipix r.o. pads → aim for resolution < 100 µm ֒ ⊲⊲ Cosmic rays observed ! 12/05/06, –8–
Signal/noise in 1 pixel (small diode) Events 0.07 ILC: Major R&D Achievements in Si Strip Devices 0.06 0.05 RECFA review 0.04 - 0.03 0.02 0.01 0 0 20 40 60 80 100 120 Signal/Noise � 1st FE chip prototype (UMC 0.180 µm ) made of 16 channels, fabricated and tested in 2005 ⇛ satisfactory results (noise, pick-up time, gain, a.s.o.) � 2nd FE chip prototype (UMC 0.130 µm ) includes : � 128 channels, � analog sampling, � shared ADC, � power cycling ֒ → sent for fabrication in March ’06 � Illustration of strong involment of French laboratories in µ circuit designs ֒ → ... several r.o. chips for ILC, LHC, ... detectors designed by IN2P3-DAPNIA groups ( ∼ 40 – 50 designers) 12/05/06, –9–
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