Metallizer for BD-R/RE Production and Beyond Oerlikon Systems R. Bieri Head of Metallizer Balzers, March 2011
Layer Stack done on Oerlikon Metallizer Page 2 15/03/2011 Media Tech 2011 R. Bieri SYOM
Oerlikon Metallizer: more then 20 Years in the OD Industry MO Disc CD-RW, DVD+/-RW, DVD-RAM, BD-R/RE BDXL SDS 100 SDS 131 BIG SPRINTER SPRINTER-8 SPRINTER-9/13 SPRINTER-5 ..2011.. 90 . . . . 93 . . . . 94 . . . . 95 . . . . 96 . . . . 97 . . . . 98 . . . . 99 . . . . 00 . . . . 01 . . . . 02 . . . . 03 . . . . 04 . . . . 05 . . . . CDI 901 CDI 915 SWIVEL98 TWISTER CUBE SPEED & SWIVEL2000 SWIVEL & Cube Star & CUBE LITE RF 2003 Page 3 15/03/2011 Media Tech 2011 R. Bieri SYOM
BD Recordable Media Layers, the „Heart“ of the Recordable Disc It„s all about the layers! done on Oerlikon Metallizer Page 4 15/03/2011 Media Tech 2011 R. Bieri SYOM
The right Metallizer for your Process HtL, LtH, Pre-Recorded “Sprinter” Metallizer Recordable HtL (-R, -RE, -XL) Swivel & Cube Star Metallizer Recordable LtH & Pre-Recorded Pre-Recorded & Recordable LtH Page 5 15/03/2011 Media Tech 2011 R. Bieri SYOM
Sprinter Family: The Industry Standard Sprinter-5 Sprinter-9 Sprinter-13 BD-R BD-R/RE BD-RE, BDXL Page 6 15/03/2011 Media Tech 2011 R. Bieri SYOM
The Complete Layer Stack in one System Page 7 15/03/2011 Media Tech 2011 R. Bieri SYOM
The Complete Layer Stack in one System Reflective Layer Protective Layer Recording Layer Protective Layer Page 8 15/03/2011 Media Tech 2011 R. Bieri SYOM
Sprinter Advantages Speed: Highest Throughput Reflective Layer Protective Layer Uniformity: Excellent Layer Uniformity Recording Layer Flexible Configuration: the right sputter source for your process Protective Layer Page 9 15/03/2011 Media Tech 2011 R. Bieri SYOM
Sprinter Advantages: Speed Speed: Highest Throughput Dry Cycle Time 2.8 sec > 1200 discs/h fast target change high uptime Uniformity: Excellent Layer Uniformity Flexible Configuration: the right sputter source for your process Page 10 15/03/2011 Media Tech 2011 R. Bieri SYOM
Speed: “Indicat” for ARQ21 DC & RF and Disc Loader Dry Cycle Time: Disc Loader Sprinter-5: < 2.8 sec Sprinter-9: < 2.8 sec * Sprinter-13: < 2.8 sec (* incl. process time < 1.7 sec) “Indicat” Fast Target Change Time < 30 sec Indirect cooling plate fixed cooling membrane Page 11 15/03/2011 Media Tech 2011 R. Bieri SYOM
Sprinter Advantages: Uniformity Speed: Highest Throughput Dry Cycle Time 2.8 sec Reflective Layer Protective Layer > 1200 discs/h Uniformity: Excellent Layer Uniformity < +/- 2.5 % for most sputter materials Disc rotation during sputtering Recording stable production condition Layer Flexible Configuration: the right sputter source for your process Protective Layer Page 12 15/03/2011 Media Tech 2011 R. Bieri SYOM
Uniformity: Layer Uniformity for your Process ± 2.5 % within a disc Magnet system tuning to reach film thickness uniformity: (for most sputter materials) Thickness Uniformity 48.00 Thickness Uniformity 47.00 Thickness [nm] 46.00 40.00 39.50 45.00 39.00 44.00 38.50 Thickness [nm] 38.00 43.00 37.50 37.00 42.00 -60.00 -40.00 -20.00 0.00 20.00 40.00 60.00 36.50 36.00 Radius [mm] 35.50 35.00 top-down +2.5% -2.5% left-right -60.00 -40.00 -20.00 0.00 20.00 40.00 60.00 Radius [mm] top-down +2.0% -2.0% left-right Page 13 15/03/2011 Media Tech 2011 R. Bieri SYOM
Sprinter Advantages: Flexibility for any Process Speed: Highest Throughput BD-R BD-RE BD-R Dry Cycle Time 2.8 sec SL SL DL > 1200 discs/h Uniformity: Excellent Layer Uniformity < +/- 2.5 % for most sputter materials Disc rotation during sputtering Flexible Configuration: DC, DC pulsed, DC Flexicat RF, RF Flexicat Cooling Station CS21 MSQ Multi Source 4th Gen BD-RE BDXL OD DL Page 14 15/03/2011 Media Tech 2011 R. Bieri SYOM
Flexible Configuration: Process Station Selection Disc Loader ARQ21 DC ARQ21 RF ARQ21 RF Flexicat ARQ21 DC Flexicat MSQ MCIS CS21 HS21 Window Page 15 15/03/2011 Media Tech 2011 R. Bieri SYOM
Selected Sputter Rates for ARQ21DC and ARQ21RF Al-alloy 33 nm/sec ARQ21 DC Ag-alloy 33 nm/sec TeGeSb 10 nm/sec Cu-alloy 30 nm/sec SiN 3 nm/sec ZnS-SiO2 12 nm/sec ARQ21 RF GeCrN 2.5 nm/sec GeN 2.5 nm/sec Page 16 15/03/2011 Media Tech 2011 R. Bieri SYOM
MSQ (4 x ARQ81) MSQ - Multi Source Quattro One to four DC /RF sputter cathodes in one process chamber Alloy sputtering (with individual power supply for each cathode) Serial sputtering to reduce investment costs (less process chambers and power supplies) Optimized geometry for superior radial composition uniformity when mixing different target materials Ideal for sputtering thin layers (<10nm) Ideal for low power sputtering Page 17 15/03/2011 Media Tech 2011 R. Bieri SYOM
ARQ21RF & DC Flexicat Cathode Movable Magnet Array for Uniformity Change Page 18 15/03/2011 Media Tech 2011 R. Bieri SYOM
ARQ21RF & DC Flexicat Cathode Mode a.) Layer Uniformity depending on magnet position Thickness Uniformity (new Ag Target) 45.00 44.00 Thickness [nm] 43.00 42.00 41.00 40.00 20.00 25.00 30.00 35.00 40.00 45.00 50.00 55.00 60.00 Radius [mm] 0% 10% 20% 30% 40% 50% Page 19 15/03/2011 Media Tech 2011 R. Bieri SYOM
ARQ21RF & DC Flexicat Cathode Mode b.) Constant layer uniformity over target life Less than 2% thickness uniformity over whole target life! Uniformity ZnS-SiO2 Flexicat 21 cathode Thickness 2kWh Flexicat 21 (new target) 130kWh Flexicat 21 (old target) 20 25 30 35 40 45 50 55 60 Radius [mm] Page 20 15/03/2011 Media Tech 2011 R. Bieri SYOM
The right Metallizer for your Process HtL, LtH, Pre-Recorded “Sprinter” Metallizer Recordable HtL (-R, -RE, -XL) Swivel & Cube Star Metallizer Recordable LtH & Pre-Recorded Pre-Recorded & Recordable LtH Page 21 15/03/2011 Media Tech 2011 R. Bieri SYOM
Single Layer Sputter System Overview Swivel, Cube Lite & Cube Star Single & Dual Cathode Metallizer for : Aluminum Silver, Ag-Alloys Silicon Gold, CD-Gold Reactive Sputtering (SiN, etc) RF sputtering SWIVEL & CUBE STAR & Cube Lite CUBE STAR FLEX Page 22 15/03/2011 Media Tech 2011 R. Bieri SYOM
Swivel & Cube Lite for DC & RF Sputtering Single Cathode System Same base design for Swivel & Cube Lite Focus target cathode or flat target cathode Fixed or moving inner mask DC, DC reactive or RF sputtering Lowest running costs & smallest footprint Excellent service accessibility “Task oriented” touch screen panel, error tracking Large installed base Page 23 15/03/2011 Media Tech 2011 R. Bieri SYOM
Cube Star Dual Cathode System Flexible cathode and pivot arm configuration for DC and DC reactive sputtering Dual cathode design enables sputtering of very thick layers Flip Unit for front and back side metallization Smallest footprint, everything integrated “Task oriented” touch screen panel Error tracking / service support / analysis tool Large installed base
The Right Cathode for every Material Swivel, Cube Lite, Cube Star Cathode Name Main Sputter Application Remarks Material Ag, Ag-Alloy, Al, DVD9 L1 & L0, Focus Target ARQ 931S Swivel, Cube Lite, Cube Star Si, Au BD L0 ARQ931SiN Si reactive for BD Backside Focus Target SiN Coating SiN Ag/Ag-Alloy DVD R DL Focus Target ARQ 950 BD-ROM DL L1 Conductive Flat Target w ARQ 941 Material center hole ARQ 21 Conductive & Barrier Layer Flat Target w/o Cube Lite Dielectric BD-R LtH center hole DC & RF Material Highest flexibility Excellent uniformity Outstanding target utilization -> longest target life Fastest target changes Page 25 15/03/2011 Media Tech 2011 R. Bieri SYOM
Swivel ARQ931: best Target Utilization Weight new target 4.5 kg Weight used target 2.1 kg Target utilization > 52% (Silver) = 1 mio shots @ 10nm Page 26 15/03/2011 Media Tech 2011 R. Bieri SYOM
Wrap-Up: Metallizer for today's and tomorrows OD Media “Sprinter” Recordable Media (-R, -RE, -XL) Swivel & Cube Star Recordable LtH & Pre-Recorded Pre-Recorded & Recordable LtH Page 27 15/03/2011 Media Tech 2011 R. Bieri SYOM
Thank you for your attention Please visit us at booth A29 Page 28 15/03/2011 Media Tech 2011 R. Bieri SYOM rudolf.bieri@oerlikon.com
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