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Low Energy Ion Irradiation and Its Applicability to Mimic Materials Irradiation Damage from High Energy Protons Weilin Jiang, David Senor Pacific Northwest National Laboratory HPT R&D Roadmap Workshop May 31 - June 1, 2017, Fermilab


  1. Low Energy Ion Irradiation and Its Applicability to Mimic Materials Irradiation Damage from High Energy Protons Weilin Jiang, David Senor Pacific Northwest National Laboratory HPT R&D Roadmap Workshop May 31 - June 1, 2017, Fermilab

  2. Driving Force for Microstructural Changes Induced by MeV Ion Irradiation in Solids 1. Nuclear energy deposition: Elastic collision, damage cascades 2. Electronic energy deposition: Electron excitation, ionization 3. Electron-phonon coupling: Heat production, temperature increase 2

  3. Emulation of Microstructural Features Using MeV Ion Irradiation and Thermal Annealing Benefits:  Accurate dose for emulation of material age  Accurate temperature for emulation of the location inside the material with a temperature gradient  Minimum or no radiological activation for immediate release and characterization of irradiated materials.  Implantation of impurity species into a pre-existing structure without thermal constraints.  Fast emulation of structural features within hours to days  Low cost Limitations:  High dose rate  Possible temperature shift 3

  4. MeV Ion Irradiation to Emulate High Energy Proton Irradiated High Power Target Materials  Irradiation damage in HPT materials starts from production of point defects, followed by their accumulation and interactions, leading to formation of defect clusters up to full amorphization.  Point defects are produced mainly by irradiation of spallation neutrons and ions, especially at low energies, which may be emulated by low energy ion irradiation.  The effects of temperature and its possible gradient in HPT materials may be emulated through post-irradiation thermal annealing at high temperatures, which may lead to formation of fractures and cracks.  Gas bubbles and solid state precipitates in HPT materials may be emulated by implanting the species.  Each contributor may be emulated separately or in a combined way to some extent. 4

  5. Proposed Procedure to Emulate High Energy Proton Irradiated High Power Target Materials  To simplify data interpretation, start with highly oriented pyrolytic graphite (HOPG), pure light metals or model alloys without grain boundaries, pores or high-level impurities, followed by polycrystalline materials with increasing levels of material complexities.  Perform in-situ damage accumulation study of HOPG irradiated, for example, with H + ions and self-ions (C + ) as a function of dose and temperature.  Perform in-situ and ex-situ thermal annealing study of defect recovery and clustering.  Perform in-situ HIM irradiation study of microstructural evolution in polycrystalline graphite.  Perform microscopy study of HOPG and polycrystalline graphite implanted with H, He and non-gaseous spallation/transmutation species (e.g., Li) and annealed at high temperatures to emulate microstructures for study of various features, including polycrystallization, amorphization, shrinking/swelling, creep, Mrozowski cracks, gas bubbles, and precipitates.  Measure physical properties, including thermal conductivity, electrical conductivity, and mechanical strength.  Compare the emulated microstructures and properties with those of high energy proton irradiated graphite and develop a fundamental understanding of the structure-property relationships, which may help assess and predict material performance. 5

  6. Fundamental Processes of Ion-Solid Interactions in the MeV Energy Range Rutherford Backscattering Product of Nuclear Reaction (RBS) (NRA) Damage Peak INCIDENT BEAM Ion Implantation TARGET  -Ray Recoil Target Atom X-Ray (PIGE) (ERDA) (PIXE) 6

  7. Ion Channeling and RBS/C From L. C. Feldman, et al., RBS/C and random spectra for 6H-SiC “Materials Analysis by Ion Channeling” 7

  8. Disorder Accumulation in  -LiAlO 2 at 573 K Al Depth (nm) 1000 500 0 + /cm 2 LiAlO 2 (001) H 17 0.6 LiAlO 2 (001) + 3x10 80 keV H 2 17 + 2x10 80 keV H 2 300 60° off, 573 K Relative Al Disorder 17 1x10 60° off, 573 K 16 8x10 O Scattering Yield 16 0.4 6x10 16 200 4x10 16 2x10 Al Random 0.2 100 <001>-aligned Unimplanted 0.0 0 0.0 0.2 0.4 0.6 0.8 1.0 200 300 400 500 Dose (dpa) Channel Number • Disorder on the Al sublattice saturates at levels of 0.3 and 0.5. • No full amorphization occurs at the highest applied dose of 1 dpa. 8

  9. Effect of Irradiation Temperature on Disordering Rate 6H-SiC 1.0 2 MeV Au 2+ 150 K 0.8 Relative Si Disorder 170 K 250 K 300 K 0.6 370 K 410 K 0.4 450 K 500 K 550 K 0.2 0.0 0.01 0.1 1 10 Dose (dpa) Disordering rate decreases with increasing irradiation temperature due to simultaneous recovery 9

  10. Thermal Recovery of Defects on Both Si and C Sublattices in Irradiated SiC 20-min Isochronal Anneals 6H-SiC, 2 MeV Au 2+ , 170 K 28 Si(d,d) 28 Si 12 C(d,p) 13 C 1.0 1.0 Relative Si Disorder Relative C Disorder 0.8 0.8 Au 2+ /nm 2 0.40 0.20 0.6 0.6 I 0.15 0.10 I II 0.4 0.4 0.06 II III 0.2 III 0.2 0.0 900 0.0 300 600 900 300 600 Annealing Temperature (K) Similar recovery stages (I, II, III) on both Si and C sublattices 10

  11. Li and H Out-diffusion in H + Irradiated  -LiAlO 2 During H + Implantation During Thermal Annealing Polycrystalline  -LiAlO 2 773 K 6 Polycrystalline  -LiAlO 2 + , 300 K 10 80 keV H 2 673 K + 573 K 60° off, 10 17 H + /cm 2 80 keV H 2 Normalized Li Yield Normalized H Yield 473 K 60° off, 10 17 H + /cm 2 300 K 300 K impl 4 Unimpl 573 K ann, 6h 673 K ann, 6h 5 773 K ann, 6h 2 0 0 0 100 200 300 400 500 600 0 100 200 300 400 500 600 Depth (nm) Depth (nm) • Material decomposition, Li diffusion and loss during irradiation • H diffusion and release during thermal annealing 11

  12. Amorphization and Precipitate Formation  -LiAlO 2 implanted to 10 17 H + /cm 2 at 773 K • The precipitate in rectangular shape is identified as cubic LiAl 5 O 8 with zone axis [211] that is parallel to  -LiAlO 2 [100]. • Precipitates also show in triangular shape, which has a zone axis [111]. • Amorphization and gas bubbles near the surface are observed. 12

  13. STEM-EELS Mapping of Precipitates in 3C-SiC 3C-SiC implanted to 9.6 × 10 16 25 Mg + /cm 2 at 673 K and annealed at 1573 K for 12 h Formation of cubic Mg 2 Si and tetragonal MgC 2 tetrahedra in Mg + implanted 3C-SiC. 13

  14. Helium Ion Microscope (HIM) at PNNL/EMSL Specifications and Capabilities Source Tip Trimer  Small beam size: < 0.1 nm  High resolution: ≤ 0.35 nm  Magnification: 100 – 1,000,000  Field of view: 1 mm – 100 nm  Depth of field: 5-7 times SEM  RBS spatial resolution: ~10 nm  Variable voltage: 5 – 30 kV  Beam current: 1 fA – 25 pA  No conductive coatings needed  High surface sensitivity The Column  High image contrast  Low Z imaging  Backscattered ion imaging As an advanced instrument, HIM was Examples of Applications developed and commercialized in 2007,  Nanostructures in nuclear providing cutting-edge imaging and materials  Precipitates, gas bubbles, grain chemical analysis with a sub-nanometer boundaries, cracks, interfaces, probe. One of the unique capabilities is etc. the in-situ study of microstructural  Irradiation modification of material evolution in bulk material at a microscopic structures using sub-nanometer site of choice under He + ion irradiation. He + ion probe 14

  15. He Bubble Formation in  -LiAlO 2  -LiAlO 2 irradiated with 25 keV He + at RT under HIM (He + ion projected range: 236 nm; max. 62.3 at.% He) 15

  16. He Bubble Formation in a  -LiAlO 2 Grain under HIM 16

  17. Microstructural Evolution of Amorphous SiO 2 Nanoparticles and LiAlO 2 at a Void under HIM 17

  18. Mg + and H + Irradiated HOPG 1360 1580 Graphite A A C C Raman Intensity (a.u.) A: Mg + and H + irradiated B: H + irradiated 0.78 MeV H + C: Mg + irradiated 10 µm Al foil B B D D D: Non-irradiated DLC HOPG A D G C B A C D 400 800 1200 1600 Raman Shift (cm -1 ) B D Graphite peak at 1580 cm -1 G: Disorder peak at 1360 cm -1 D: DLC: Broad diamond like carbon peak ranging from 1100 to 1700 cm -1 18

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