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Internal Memory Patrick Happ Raul Queiroz Feitosa Objective To present a survey of semiconductor main memory technology. 2 Internal Memory Outline Semiconductor Main Memory Flash Memory Random Access Memories RAMs


  1. Internal Memory Patrick Happ Raul Queiroz Feitosa

  2. Objective To present a survey of semiconductor main memory technology. 2 Internal Memory

  3. Outline  Semiconductor Main Memory  Flash Memory  Random Access Memories – RAMs  Advanced DRAM Organization  Error Detection/Correction 3 Internal Memory

  4. Semiconductor Memory Types Memory Type Category Erasure Write Mechanism Volatility Random-access Read-write Electrically, byte- Electrically Volatile memory (RAM) memory level Read-only Masks memory (ROM) Read-only Not possible memory Programmable ROM (PROM) Erasable PROM UV light, chip- (EPROM) level Nonvolatile Electrically Read-mostly Electrically, byte- (EEPROM) memory level Electrically, block- Flash memory level 4 Internal Memory 17/09/2020

  5. Semiconductor Memory Types RAM PROM ROM EPROM FLASH EEPROM E2PROM 5 Internal Memory 17/09/2020

  6. Memory Cell Operation 6 Internal Memory 17/09/2020

  7. Read Only Memory (ROM)  Permanent storage  Nonvolatile  Microprogramming (see later)  Library subroutines  Systems programs (BIOS)  Function tables 7 Internal Memory 17/09/2020

  8. Types of ROM Written during manufacture  Very expensive for small runs Programmable (once)  PROM  Needs special equipment to program Read “mostly”  Erasable Programmable (EPROM)  Erased by UV  Electrically Erasable (EEPROM)  Takes much longer to write than read  Flash memory  Erase whole memory electrically 8 Internal Memory 17/09/2020

  9. Outline  Semiconductor Main Memory  Flash Memory  Random Access Memories – RAMs  Advanced DRAM Organization  Error Detection/Correction 9 Internal Memory

  10. How a flash memory works A flash cell is a npn MOSFET with two gates: control and floating, separated by an isolating oxide layer. 10 Internal Memory 17/09/2020 Source: https://www.explainthatstuff.com/flashmemory.html

  11. How a flash memory works To switch it “on”, a positive voltage is applied to the bit line and the word line. Electrons flow from the source to the drain. Some also bypass the oxide layer by a process called tunneling and get stuck in the floating gate. 11 Internal Memory 17/09/2020 Source: https://www.explainthatstuff.com/flashmemory.html

  12. How a flash memory works To switch it back “off”, a negative voltage on the wordline, repels the electrons back the way they came, clearing the floating gate and making the transistorstore a zero again. An in-circuit wiring is used to apply the electric field either to the entire chip or to predetermined sections known as blocs. 12 Internal Memory 17/09/2020 Source: https://www.explainthatstuff.com/flashmemory.html

  13. Outline  Semiconductor Main Memory  Flash Memory  Random Access Memories – RAMs  Advanced DRAM Organization  Error Detection/Correction 13 Internal Memory

  14. Random Access Memory RAM  Misnamed as all semiconductor memory is random access  Read/Write  Volatile  Temporary storage  Static or dynamic 14 Internal Memory 17/09/2020

  15. Static RAM  Bits stored as on/off switches  No charges to leak  No refreshing needed when powered  More complex construction  Larger per bit  More expensive  Faster  Used to implement cache memory (seen in a later chapter)  Digital → Uses flip-flops 15 Internal Memory 17/09/2020

  16. Static RAM Structure state 1 state 1 state 0 on off off on high low Read low high Write applies value is on line B value to B and off on compliment to B on off 16 Internal Memory 17/09/2020

  17. Dynamic RAM  Bits stored as charge in capacitors  Charges leak  Need refreshing even when powered  Simpler construction  Smaller per bit  Less expensive  Need refresh circuits  Slower  Used to implement main memory  Essentially analogue → Level of charge determines value 17 Internal Memory 17/09/2020

  18. Dynamic RAM Structure Write Read charge fed charge through transfered line to to capacitor sensor 0/1 0/1 on on 18 Internal Memory 17/09/2020

  19. Refreshing  Refresh circuit included on chip  Disable chip  Count through rows  Read & Write back  Takes time  Slows down apparent performance 19 Internal Memory 17/09/2020

  20. SRAM vs. DRAM Both volatile  Power needed to preserve data Dynamic cell  Simpler to build, smaller  More dense  Less expensive  Needs refresh  Larger memory units Static  Faster  Cache 20 Internal Memory 17/09/2020

  21. Typical 16 Mb DRAM (4M x 4) 21 Internal Memory 17/09/2020

  22. Simplified DRAM Read Timing 22 Internal Memory 17/09/2020

  23. Packaging 23 Internal Memory 17/09/2020

  24. Module Organization Example 1: a 256K 8 bit word organization 24 Internal Memory 17/09/2020

  25. Module Organization Example 1: a 1M 8 bit word organization 25 Internal Memory 17/09/2020

  26. Outline  Semiconductor Main Memory  Flash Memory  Random Access Memories – RAMs  Advanced DRAM Organization  Error Detection/Correction 26 Internal Memory

  27. Advanced DRAM Organization  Basic DRAM same since 70’s.  Enhanced DRAM  Contains small SRAM as well  SRAM holds last line read (c.f. Cache!) 27 Internal Memory 17/09/2020

  28. Synchronous DRAM (SDRAM)  Access is synchronized with an external clock  Address is presented to RAM  RAM finds data (CPU waits in conventional DRAM)  Since SDRAM moves data in time with system clock, CPU knows when data will be ready  CPU does not have to wait, it can do something else  Burst mode allows SDRAM to set up stream of data and fire it out in block  DDR-SDRAM sends data twice per clock cycle (leading & trailing edge) 28 Internal Memory 17/09/2020

  29. SDRAM Read Timing valid valid valid valid data data data data 29 Internal Memory 17/09/2020

  30. DDR SDRAM  SDRAM can only send data once per clock  Double-data-rate SDRAM can send data twice per clock cycle  Rising edge and falling edge 30 Internal Memory 17/09/2020

  31. DDR SDRAM - Read Timing 31 Internal Memory 17/09/2020

  32. DDR Generations By increasing the operational frequency and the prefetch buffer from 2 to 4 and to 8 bits higher data rates were achieved DDR SDRAM Bus clock Internal rate Prefetch Transfer Rate First Standard (MHz) (MHz) (min burst) (MT/s) release DDR 100 – 200 100 – 200 2n 200 – 400 2000 200 – 533 100 – 266 4n 400 – 1066 2004 DDR2 DDR3 400 – 1066 100 – 266 8n 800 – 2133 2007 DDR4 1066 – 2133 133 – 266 8n 2133 – 4266 2011 ? DDR5 Specifications released in July 2020 32

  33. Outline  Semiconductor Main Memory  Flash Memory  Random Access Memories – RAMs  Advanced DRAM Organization  Error Detection/Correction 33 Internal Memory

  34. Error Correction  Hard Failure  Permanent defect  Soft Error  Random, non-destructive  No permanent damage to memory  Detected using Hamming error correcting code 34 Internal Memory 17/09/2020

  35. Error Correcting Code Function 35 Internal Memory 17/09/2020

  36. Text Book References Stallings 11 th edition, chapter 6 36 Internal Memory 17/09/2020

  37. Internal Memory END 37 Internal Memory 17/09/2020

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