Company Presentation Where quickturn and small volume PCB orders are all done in-house. Jun 10, 2014
Outline Outline ★ Our Milestones ★ Organization Chart ★ Revenue by Year ★ Business Strategies ★ Fabrication Capabilities ★ Technology Roadmap ★ Main Production Facilities ★ Quality Assurance ★ QA Systems & Final Inspections
Our Milestones Our Milestones
Milestones Milestones 1996 Established Speedy Circuits as a “quickturn” prototype PCB 1996 Established Speedy Circuits as a “quickturn” prototype PCB fabrication shop with 50 employees. fabrication shop with 50 employees. 1997 Successfully created metal core (aluminum) boards. 1997 Successfully created metal core (aluminum) boards. 1998 Adopted microwave materials (PTFE), such as Rogers, Polyimide, 1998 Adopted microwave materials (PTFE), such as Rogers, Polyimide, Nelco, and Taconic, in production. Nelco, and Taconic, in production. 1999 1999 Granted UL certificate of registration. 2000 2000 Given approval by UL for heavy copper of up to 6 oz for internal layers. 2001 Successfully applied sequential blind/buried vias in production. 2001 Successfully applied sequential blind/buried vias in production. 2002 Successfully created vias in pads. 2002 Successfully created vias in pads. 2003 Awarded ISO9001 (2000 version) NSF-ISR Certification. 2003 Awarded ISO9001 (2000 version) NSF-ISR Certification. 2004 Successfully applied two-build-up implement to create 2+N+2 HDI 2004 Successfully applied two-build-up implement to create 2+N+2 HDI boards. boards.
2005 Achieved high aspect ratio hole of ^15:1 in place of ^12:1. 2005 Achieved high aspect ratio hole of ^15:1 in place of ^12:1. 2006 Moved into a new and bigger facility and increased our workforce to 250. 2006 Moved into a new and bigger facility and increased our workforce to 250. 2007 Successfully adopted manufacturing techniques to create flexible and rigid-flex PCBs. 2007 Successfully adopted manufacturing techniques to create flexible and rigid-flex PCBs. 2008 Acquired additional equipment, including two drilling machines, two NC routing 2008 Acquired additional equipment, including two drilling machines, two NC routing machines and two flying probe type testers, resulting in increased production capacity. machines and two flying probe type testers, resulting in increased production capacity. 2009 Granted ISO9001 (2008 version) NSF-ISR Certification. 2009 Granted ISO9001 (2008 version) NSF-ISR Certification. 2010 Successfully created stacked vias/HDI-SBU via-fill copper plating and blind microvias 2010 Successfully created stacked vias/HDI-SBU via-fill copper plating and blind microvias 4+N+4. 4+N+4. 2011 Acquired a new gold plating line (ImmAu, hard gold, soft bondable gold) and LDI for 2011 Acquired a new gold plating line (ImmAu, hard gold, soft bondable gold) and LDI for fine line/space of 2 mils. fine line/space of 2 mils.
2012 Acquired new Orbotech InCAM systems to enhance our CAM capability for HDI design 2012 Acquired new Orbotech InCAM systems to enhance our CAM capability for HDI design boards. boards. 2013 In April, we started offering fabrication services for multilayer flexible PCBs at our shop. 2013 In April, we started offering fabrication services for multilayer flexible PCBs at our shop. In May, direct laser drill superseded the opening copper window laser drill In May, direct laser drill superseded the opening copper window laser drill method, thus achieving Any-Layer Interstitial Via Hole (ALIVH) in HDI fabrication. method, thus achieving Any-Layer Interstitial Via Hole (ALIVH) in HDI fabrication. 2014 Applied laser micro-via filled copper plate and thru-hole copper plate at the same time, 2014 Applied laser micro-via filled copper plate and thru-hole copper plate at the same time, thus significantly reducing lead times for HDI PCB manufacturing, and effectively thus significantly reducing lead times for HDI PCB manufacturing, and effectively meeting market demand for quickturn HDI-SBUs. meeting market demand for quickturn HDI-SBUs.
Organization Chart Organization Chart
Chairman of the Board General Manager Paul Lien Sales Finance Production Control & Administration & Production II QA & Production III ENG & CAM Dept. Production I Jacky Chen Jeremy Chuang Dilys Huang Ivy Song Yc Chang HugKuo Wang Administration CAM Dept. Oversea Sales Accounting QA Dept. C.C Lee QA Aaron Chao Human Resources Front-End QC Engineering Dept. Local Sales Finance Production Control Eric Lee Purchasing FQC Maintenance OQC Production Control Project General Affairs AOI Shipping Dept. Security & Environmental Production I Protection MIS Solder Mask Production III E-Test Material warehouse Mass Lamination NC Routing & V-Score Dry Film Drill Production II CU Plating Gold Effective June 11, 2014
Revenue by Year Revenue by Year
Revenue Revenue
Revenue by Type of PCB Revenue by Type of PCB 12/L↑ 10/L 2/L 8/L 6/L 4/L
Revenue by Sales Regions Revenue by Sales Regions Europe 5% Others 5% Aust r alia 5% USA 50% Asia 40%
Business Strategies Business Strategies
Main Focus Main Focus Quickturn prototype & small volume production Quickturn prototype & small volume production - - Engineering samples & prototypes. Engineering samples & prototypes. - Single-sided up to 42-layer count. - Single-sided up to 42-layer count. - Operating 24 hours a day, 7 days a week. - Operating 24 hours a day, 7 days a week. Diversified products and services Diversified products and services - Providing a variety of materials (i.e., PTFE, Teflon, etc.) for microwave - Providing a variety of materials (i.e., PTFE, Teflon, etc.) for microwave applications, metal core, rigid-flex, etc. Achieving more than you can applications, metal core, rigid-flex, etc. Achieving more than you can imagine. imagine. Highest quality & reliable products Highest quality & reliable products - Impeccable quality system support - Impeccable quality system support - Delivering high reliability PCBs - Delivering high reliability PCBs On-time delivery - Speedy Circuits: All that the name implies is quickness - Speedy Circuits: All that the name implies is quickness . .
Fabrication Capabilities Fabrication Capabilities
Process Capability Process Capability Capability Specifications 2010 2011 2012 2013 2014 FR 4 FR 4 FR 4 FR 4 FR 4 PTFE PTFE PTFE PTFE PTFE Material Polyimide Polyimide Polyimide Polyimide Polyimide PI PI PI PI PI Min. dielectric thickness 2 mil 2 mil 2 mil 2 mil 2 mil Max. layer count 40 42 42 46 50 Max. working panel size 20“x30” 21“x31” 21“x31” 21“x31” 21“x31” Max. board thickness .250“ .250“ .280“ .280“ .280“ Min. board thickness .016“(6L) .016“(6L) .016“(6L) .016“(6L) .016“(6L) 2/2 Mil 2/1.5 Mil 2/1.5 Mil I/L 3/2.5 Mil 2.5/2.5 Mil Min. line/space 2.5/2 Mil 2/2 Mil 2/2 Mil O/L 3/2.5 Mil 2.5/2.5 Mil Warp 0.001“/in. 0.0008“/in. 0.0008“/in. 0.001“/in. 0.001“/in.
Capability Specifications 2010 2011 2012 2013 2014 0.35mm 0.30mm 0.25mm 0.2mm 0.2mm BGA pitch 3 mil 3 mil 3 mil 3 mil Layer-to-layer registration 4 mil Finish hole size Mechanical drill .004“ .004“ .004“ .003“ .003“ Laser drill .004“ .003“ .003“ .0025“ .002 “ (min.) True-hole position +/-.002“ +/-.002“ +/-.002“ +/-.0015“ +/-.0015“ PTH +/-.002“ +/-.002“ +/-.002“ +/-.0015“ +/-.0015“ Finish hole size Tolerance +/-.001” +/-.001” +/-.001” +/-.001” Non-PTH +/-.001” Aspect ratio (board thickness/FHS) 20 20 20 24 30 Inner layer 6 OZ 6 OZ 6 OZ 6 OZ 10 OZ Heavy copper Outer layer 10 OZ 10 OZ 12 OZ 16 OZ 16 OZ
Capability Specifications 2011 2012 2013 2014 Buried/blind via Yes 4+N+4 Yes 9+N+9 Yes 9+N+9 Yes 10+N+10 Plasma desmear Yes Yes Yes Yes Outline tolerance +/-.004“ +/-.004“ +/-.004“ +/-.004“ Surface finish HASL HASL HASL HASL ENIG ENIG ENIG ENIG Immersion silver Immersion silver Immersion silver Immersion silver OSP(ENTEK) OSP(ENTEK) OSP(ENTEK) OSP(ENTEK) Carbon Carbon Carbon Carbon Immersion tin Immersion tin Immersion tin Immersion tin Electrolytic gold Electrolytic gold Electrolytic gold Electrolytic gold Impedance control +/-5% +/-5% +/-5% +/-5% RoHS compliant Yes Yes Yes Yes
HDI-SBU Microvias Capability formed using laser drill with via filled copper plating. Plated filled blind microvia advantage. • Reduces capture pad size of fine pitch BGA. By reducing the via hole size, it significantly helps the designer to obtain more routing spaces. • Reduces board real estate for slimming and portability purposes. By reducing the board size and weight of the product, it improves the electrical performance of the system. • Increases reliability Providing stacked vias allows stronger interconnections and obtains better thermal management. This also significantly increases board reliability at more severe operation circumstances. Plated Copper Filled Resin Conventional Plating A plated filled blind microvia
Technology Roadmap Technology Roadmap
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