Affinity 2.0 Electroless Nickel Immersion Gold HIGH PERFORMANCE LOW - PowerPoint PPT Presentation

Affinity 2.0 Electroless Nickel – Immersion Gold HIGH PERFORMANCE LOW VARIATION FINAL FINISH Global Final Finish Team April 2017

MacDermid Enthone Electronics Solutions Leading Chemical Process Supplier in Global Electronics Markets 2 A Platform Specialty Products Company.

GLOBAL PRESENCE 3 A Platform Specialty Products Company.

Our Product Offerings ADVANCED ELECTRONICS METALLIZATION FINAL FINISHES  Direct Metallization  Organic Solderability  Damascene Copper  Wafer Level Packaging • Rigid PCBs Preservative  Immersion Tin • Flex Circuitry • Bump Plating  Electroless Copper  Immersion Silver • Copper Pillars  Electrolytic Coppers  ENEPIG • Redistribution Layers  ENIG • High Throw DC • Periodic Pulse Reverse • Via Fill / Through Hole Fill MEMORY DISK ELECTRONICS MATERIALS ELECTRONICS SPECIALTIES  Preclean and Zincate  Leadframe Adhesion  Specialty Treatments for Copper  Dryfilm Solutions for AI substrate Promotion  High Quality EN  Component Termination  Copper Etchant Solderability • High Corrosion Resistance  Resist Strippers  Molded Interconnect Devices • Low Particle Inclusion (PDI)  Solder Strippers  Light Emitting Diodes • Low Pit Count  Connector Finishing  Solar Cell Metallization  Oxide and Oxide Alternatives • High RF Applications 4 A Platform Specialty Products Company.

Our Product Offerings ADVANCED ELECTRONICS METALLIZATION FINAL FINISHES  Direct Metallization  Organic Solderability  Damascene Copper  Wafer Level Packaging • Rigid PCBs Preservative  Immersion Tin • Flex Circuitry • Bump Plating  Electroless Copper  Immersion Silver • Copper Pillars  Electrolytic Coppers  ENEPIG • Redistribution Layers  Affinity ENIG 2.0 • High Throw DC • Periodic Pulse Reverse • Via Fill / Through Hole Fill MEMORY DISK ELECTRONICS MATERIALS ELECTRONICS SPECIALTIES  Preclean and Zincate  Leadframe Adhesion  Specialty Treatments for Copper  Dryfilm Solutions for AI substrate Promotion  High Quality EN  Component Termination  Copper Etchant Solderability • High Corrosion Resistance  Resist Strippers  Molded Interconnect Devices • Low Particle Inclusion (PDI)  Solder Strippers  Light Emitting Diodes • Low Pit Count  Connector Finishing  Solar Cell Metallization  Oxide and Oxide Alternatives • High RF Applications 5 A Platform Specialty Products Company.

ENIG Popularity Strength and Weakness Analysis Advantages…… • Long Shelf Life • No Tarnish • No Whiskers HASL OSP Imm Silver Imm Tin ENIG ENEPIG • Consistent Solderability (multiple reflows). Planarity No Yes Yes Yes Yes Yes • Aluminum Wirebondable. • Solderjoint Cu-Sn Cu-Sn Cu-Sn Cu-Sn Ni-Sn Ni-Sn Surface Contact (Keypads) • High Solderspread Relative Cost $ $ $$ $$ $$$ $$$ • No Issues with Paste Misprints IPC Shelf Life No Specification No Specification 12 months 12 months 12 months 12 months Reflows 6 4 6 2 6 6 Contact E-Test, ICT Difficult E-Test, ICT, Keypad E-Test E-Test, ICT, Keypad E-Test, ICT, Keypad Disadvantages…… Press Fit Good Good Good Good Good Good Au Wirebond No No No No No Yes • More Expensive (CEM/OEM) Al Wirebond No No Yes No Yes Yes • High Temperature Process (PCB Fab) • Complex Process (PCB Fab) • Not Re-workable (PCB Fab) • Ni-Sn Solderjoint (Cu-Sn is preferred) • Blackpad “Hangover” from the 90’s 6 A Platform Specialty Products Company.

Affinity ENIG 2.0 Reduced Variation - Higher Yield – Lower Operating Cost ENIG  Affinity ENIG 2.0 has been developed from the lead ENIG technologies from our newly integrated companies combining new innovations from our collective expertise.  EN Corrosion • EN corrosion has been engineered out of the process eliminating concern and discussion with end users and OEM’s.  Six Sigma Development • Defects and wastes driven out during development and process variation minimized in production – giving increased uniformity of product, compliance to OEM and End User specifications and unrivaled reliability.  The Lowest Gold Metal Operating Cost • Low gold thickness variation over time and between feature sizes provides excellent control of gold consumption and significant opportunity for operating cost reduction. 7 A Platform Specialty Products Company.

Affinity ENIG 2.0 Technology Benefits – Six Sigma Development What is Six Sigma and why is it important to your business? “The Six Sigma strategy is a systematic, data driven approach to problem solving. Six Sigma tools are widely recognized in a variety of industries for their proficiency at reducing defects and driving process improvement. A six sigma process produces only 3.4 defects per million opportunities! We already have a 99% ENIG yield, why would we care about Six Sigma ? (1) During 2016 Hong Kong International Airport operated an average of 1,100 flights per day! • 99% take-off success would mean 11 air disasters every day!!! 8 A Platform Specialty Products Company.

Affinity ENIG 2.0 Technology Benefits – Six Sigma Development What is Six Sigma and why is it important to your business? “The Six Sigma strategy is a systematic, data driven approach to problem solving. Six Sigma tools are widely recognized in a variety of industries for their proficiency at reducing defects and driving process improvement. A six sigma process produces only 3.4 defects per million opportunities! We already have a 99% ENIG yield, why would we care about Six Sigma ? (1) During 2016 Hong Kong International Airport operated an average of 1,100 flights per day! • 99% success would mean 11 air disasters every day!!! (2) A PCB Fabricator produces 5,000 panels per day with a 99% ENIG yield ! • 99% yield would mean 14,500 scrap panels per year (based on 290 working days per year). 9 A Platform Specialty Products Company.

Affinity ENIG 2.0 Technology Benefits – Six Sigma Development What is Six Sigma and why is it important to your business? “The Six Sigma strategy is a systematic, data driven approach to problem solving. Six Sigma tools are widely recognized in a variety of industries for their proficiency at reducing defects and driving process improvement. A six sigma process produces only 3.4 defects per million opportunities! We already have a 99% ENIG yield, why would we care about Six Sigma ? (1) During 2016 Hong Kong International Airport operated an average of 1,100 flights per day! • 99% success would mean 11 air disasters every day!!! (2) A PCB Fabricator produces 5,000 panels per day with a 99% ENIG yield ! • 99% yield would mean 14,500 scrap panels per year (based on 290 working days per year). Six Sigma’s vast tool kit was used throughout research, alpha and beta test phases of Affinity ENIG 2.0. MacDermid- Enthone’s Six Sigma green and black belts will bring these benefits to your factory. 10 A Platform Specialty Products Company.

Affinity ENIG 2.0 Technology Benefits – Six Sigma Development Importance EN1 - IG 1 EN1 - IG 2 EN2 - IG 1 EN 2 - IG 2 Quality Deployment Function ENIG Customer Requiements Notes EN %P Control (8-10% wt/wt) 1 9 9 1 1 EDS and XRF Analysis EN Plating Rate Control 1 9 9 3 3 IMR Charts IG Plating Rate Control 2 9 3 1 3 IMR Charts Functional Soldering (3 Operations) 1 9 9 9 9 LF Solderspread, Ballshear and PTH FILL Within Panel Au Thickness Distribution 5 9 3 1 3 XRF Analysis • Used to compare ENIG chemistries during development process. IG Chemistry - Low Au Concentration 2 3 9 3 9 TDS Operating Parameters IPC 4552 EN Corrosion Spec Conformance 1 9 9 9 9 X-Section SEM Corrosion Evaluation 5 9 9 3 3 SEM Analysis MEES Internal X-Section Corrosion Spec 5 3 3 3 9 X-Section/ SEM Analysis Cosmetic Appearance 1 9 9 1 1 Visual Evaluation Process Control Simplicity 1 9 3 1 1 IMR Chart and Process Capability Analysis Electroless Nickel Coverage 1 9 9 3 3 X-Section Electroless Nickel Resolution 1 9 9 3 3 Visual / X-Section Evaluation • Created a focus to improve EN %P control and corrosion. Absolute Weight 105 93 41 57 Correlation Key Releative Weight 201 165 75 129 Strong Performance 9 Overall Ranking 1st 2nd 4th 3rd • Acceptable Performance 3 Created a focus to eliminate cost. Weak Performance 1 Measurement System Analysis • Used to understand Au thickness and EN%P measurement errors. • Improved measurement of gold thickness and EN %P. • Improved control of gold thickness and cost. Statistical Process Control Xbar-S Chart of Affinity 2.0 EN %P XRF %P measurement over two Electroless Nickel solution lives UCL=9.2270 9.2 Sample Mean _ _ 9.0 X=8.9642 • Used to ensure “Critical to Quality” process variables are under control. 8.8 LCL=8.7014 - O MTO MTO - 2 MTO - 3 MTO - 4 MTO - 4.8 MTO EN2 - 0 MTO MTO EN2 - 2 MTO EN3 - 3 MTO EN2 - 4 MTO EN2 - 4.6 MTO - 1 EN2 - 1 EN 1 EN1 EN1 EN1 EN1 EN1 • UCL=0.4625 Same product every shift and every day. 0.4 Sample StDev _ 0.3 S=0.2695 0.2 0.1 LCL=0.0764 - O MTO MTO - 2 MTO - 3 MTO - 4 MTO - 4.8 MTO EN2 - 0 MTO MTO EN2 - 2 MTO EN3 - 3 MTO EN2 - 4 MTO EN2 - 4.6 MTO - 1 EN2 - 1 EN1 EN1 EN1 EN1 EN 1 EN1 11 A Platform Specialty Products Company.