Advacam Advacam semiconductor semiconductor company company pr - PowerPoint PPT Presentation

Advacam Advacam semiconductor semiconductor company company pr presentat esentation ion 18/08/17 Advacam Oy | Company presentation | Espoo, Finland 1

Advacam Advacam Oy Oy • Advacam is one-stop shop for pixel sensor assemblies • Office in Micronova building www.micronova.fi • Access to all process tools in VTT’s clean room • Expertise in fabrication of the state-of-the-art silicon sensors and in flip chip technology • Planar and edgeless Si sensors • Wafer-level solder micro-bumping • Single and multi-chip flip chip bonding (Si, GaAs & Cd(Zn)Te) • Short delivery time and guarantee of quality is given for the services • Advacam Oy employees 8 people full time • Visit www.advacam.com Edgeless Si sensor modules 18/08/17 Advacam Oy | Company presentation | Espoo, Finland 2

Service concept Service concept • Commercialization of long term research done by VTT • Advacam Oy founded by former VTT researchers • PhD Juha Kalliopuska (CEO) • M.Sc. Sami Vähänen (CTO) • Unique radiation pixel detector fabrication + flip chip service • Full value chain covered within the same company • From prototyping to production • We are the “garage” of very challenging fabrication services within radiation pixel detectors • Utilization of complete sensor fabrication and flip chip lines • Looking for regular production work with emphasis in gathering more statistics of the process steps, for maintaining quality and investing in new equipment 18/08/17 Advacam Oy | Company presentation | Espoo, Finland 3

Facility - Micronova Facility - Micronova Micronova is Finland's National Research Infrastructure for micro- and • nanotechnology, jointly run by VTT Technical Research Centre of Finland and Aalto University Great variety of tools for thin film processing • • Renting of equipment time – no capital cost Cleanroom 2611 m 2 • class 10 550 m 2 • class 100-1000 875 m 2 150 mm baseline Other lab areas 2619 m 2 Par5al 200 mm compa5bility Office space 8038 m 2 18/08/17 Advacam Oy | Company presentation | Espoo, Finland 4

Planar sensors Planar sensors • Advacam has experience in manufacturing customized pixel sensor on 6” (8” R&D) wafers ranging from thickness of 300um to 1mm. 500 μm planar pixel sensor 18/08/17 Advacam Oy | Company presentation | Espoo, Finland 5

Edgeless and special sensors Edgeless and special sensors • Advacam has experience in manufacturing edgeless and ultra thin sensor 6” wafers ranging from thickness of 5um to 675um. Sensi've volume up to silicon edge 300 μm edgeless pixel sensor � � � � 18/08/17 Advacam Oy | Company presentation | Espoo, Finland 6 � � � � � � � � � � � � � � � � � � � �

Micr Micro-packaging of hybrid modules o-packaging of hybrid modules 18/08/17 Advacam Oy | Company presentation | Espoo, Finland 7

Advacam’s Advacam’s Bumping Bumping Toolbox Toolbox • Typical bumps are Typical bumps are: • ~20 μ m high SnPb bumps on Cu pillars edgeless sensor • Placed with 50 μ m – 110 μ m pitch (can be larger) • Available solder alloys: Available solder alloys: InSn bumps on ASIC 25 μ m pitch solder bumps • Eutectic SnPb wafers • Cu-pillar (CuSn / CuSnPb) • InSn (melting point ~ 120 °C) • Thin film UBM pads: Thin film UBM pads: • Different metal stacks available Thin film UBM pads • Under development: Under development: Plated UBM with a on edgeless sensor solder cap • Bumping with finer pitches (18 μ m – 35 μ m) 18/08/17 Advacam Oy | Company presentation | Espoo, Finland 8

Capacity Capacity 18/08/17 Advacam Oy | Company presentation | Espoo, Finland 9

Manufacturing capacity Manufacturing capacity • Sensor production: • Current production: ~200 wafer per year • Full capacity: 5,000 wafers per year • Wafer solder bumping: • Current production: 50-100 wafers per year • With the current electroplating tools it is possible to process up to 500 wafers per year • Flip chip bonding: • Current production: 1,500 flip chip placements per year • With the current bonding tools it is possible to make up to 10,000 flip chip bonding placements per year 18/08/17 Advacam Oy | Company presentation | Espoo, Finland 10

Quality Quality 18/08/17 Advacam Oy | Company presentation | Espoo, Finland 11

Quality management Quality management Sensor' ASIC' PCB'' Preassembled*chip* Fabrica'on* Visual*inspec'on* ROC’s*classified* Wafer* process* board*recived* Defects*recorded* probing* wafer*mapped* follow*up* Power* Chip*board* regulator* acceptance* probing* Incoming* IV9curve*recorded* Visual*inspec'on* Electrical* wafer* measurement* and*wafer*mapped* Defects*recorded* inspec'on* Assembly*gluing*to*chip*board* and*wire*bonding* Wafer*dicing* Visual*defects*and** Bumping* Tes'ng*and* Op'cal*bump*height** process* Report*and*log*file*of* equaliza'on* follow*up* Data*recorded* the*assembly* Final*visual* on*chip*board* Sensors*classified* inspec'on* Wafer*dicing* Energy* Report*and*log*file*of* calibra'on*of* the*energy*calibra'on* threshold* Final*visual* ROCs*classified* inspec'on* A B C D E F G H I J K L M Report*and*log*file* F E B F E Energy* 11 F F F A A A B B B F F F A A A 0.00 0.25 1.00 0.00 0.41 A B B B E A A B F of*the*per*pixel* 10 calibra'on*on* A A A B B B B B B B B B A F F A A A A A A B C B F F F 1.00 0.99 0.99 1.00 0.44 1.00 1.00 1.00 0.00 E A A A A A F F B B F 9 A A A A A A A A A A A A A A A A A A F F F F F F B B B B B B F F F 0.00 1.00 1.00 1.00 1.00 0.99 0.00 0.00 1.00 1.00 0.00 chip*board* energy*calibra'on* A B A A A A A B B A B 8 A A A B B B A A A A A A A A A A A A A A A B B B B B B A A A B B B 1.00 1.00 1.00 1.00 0.99 1.00 1.00 1.00 1.00 1.00 1.00 F F A C F F D F B A D E E Chip*and*sensor*cleaning* 7 F F F F F F A A A C C C F F F F F F D D D F F F B B B A A A D D D D F F B B B 0.00 0.00 1.00 0.99 0.00 0.00 0.95 0.00 0.74 1.00 0.99 0.00 0.00 F F A C A B A A F B B A F 6 F F F F F F A A A C C C A A A A A A A B A A B B F F F B B B B B B A A A F F F 0.00 0.00 1.00 1.00 0.99 0.99 0.99 1.00 0.00 1.00 1.00 1.00 0.00 Flip*chip*bonding* A F A A A A F A B F A A E 5 A A A F F F A A A A A A A A A A A A F F F A A A B C C F F F A A A A B B D F F 1.00 0.00 0.99 1.00 1.00 0.99 0.00 1.00 0.99 0.00 1.00 1.00 0.00 B A B F A F A A B A F 4 B B B A A A B B B F F F A A A F F F A A A A A A B B B A A A F F F 1.00 1.00 0.99 0.00 1.00 0.00 0.99 1.00 1.00 1.00 0.00 F A A A F C B A A A F 3 F F F A B B A C B A A A F F F C C C B B B A A A A A A A A A F F F 0.00 1.00 0.97 0.99 0.00 1.00 0.94 0.99 1.00 1.00 0.00 F A A B B B A A F 2 F F F A A A A A A B B B B C C B B B A A A A A A F F F 0.00 1.00 1.00 1.00 1.00 1.00 0.99 1.00 0.00 A A A A D Electrical* 1 A A A A A A A A A A A A D D D Shipping*together*with*the* 1.00 1.00 1.00 1.00 1.00 Assembly*acceptance* measurement* report*and*log*file/files* Shipping*for*wire*bonding* 18/08/17 Advacam Oy | Company presentation | Espoo, Finland 12