3D A 3D Aerosol Jet Printing An Emerging l J t P i ti A E i - PowerPoint PPT Presentation

3D A 3D Aerosol Jet Printing – An Emerging l J t P i ti A E i MID Manufacturing Process. Dr. Martin Hedges g Neotech Services MTP, Nuremberg, Germany info@neotechservices.com MID Fürth – 30.9.10

Aerosol Jet Printing Aerosol Jet Printing – Aerosol Jet Process Overview Aerosol Jet Process Overview – Current Application Examples Current Application Examples – 3D Printing 3D P i ti – Summary MID Fürth – 30.9.10

Aerosol Jet Process Overview Aerosol Jet Process Overview • Aerosol Jet is CAD driven printing technique. • Developed by Optomec Inc, Albuquerque, USA. • >$12m in Aerosol Jet Technology & Product Development. • 13 patents issued, 43+ pending… • Targeting $bn markets in Electronics, Energy, Life Science - Active Opportunities in Packaging, Display, Flex, Fuel Cell, Drug O C Discovery... Aerosol Jet 300CE MID Fürth – 30.9.10

How the Process Works How the Process Works 3 4 1 1 2 1. 1 Functional ink is placed in the atomiser gas flow creates an aerosol Functional ink is placed in the atomiser, gas flow creates an aerosol 2. Aerosol droplets ca.1-5 μ m, larger droplets return to ink (gravity effect) 3. The aerosol is carried to the deposition head, excess gas removed 4. The aerosol is focussed inside the nozzle by a secondary gas flow (sheath gas) MID Fürth – 30.9.10

Aerosol Jet Characteristics Aerosol Jet Characteristics 150 μ m Foc ssed Aerosol Focussed Aerosol Beam No contact to nozzle Natural stand-off from substrate MID Fürth – 30.9.10

Aerosol Jet Characteristics Aerosol Jet Characteristics Too close - line spreads p Ideal- line width constant with height Too far away - turbulent mixing, line widens 50 50 rons) 40 40 dth (micr 30 Line Wi 20 Focal Length Focal Length 10 0 1 2 3 4 5 6 Height of Nozzle above Substrate (mm) MID Fürth – 30.9.10

Conformal Deposition Conformal Deposition 60 μ m lines into 500 μ m trench Nozzle standoff distance of ca. 5mm and long focal length allows conformal deposition with no change in Z-height. MID Fürth – 30.9.10

Scalability – Line Width y • Trials underway to reduce minimum line width to 5µm and below. Trials underway to reduce minimum line width to 5µm and below. • Wide area nozzle development to print line widths 3mm+ (single pass). • Current Line width scalability through 3 orders of magnitude. Ultra fine lines 2.5-3.5µm Ag Grid on Glass 2.5 3.5µm Ag Grid on Glass MID Fürth – 30.9.10

Wide Area Nozzles • New contract signed with US Airforce for Wide Area Nozzles. New contract signed with US Airforce for Wide Area Nozzles. • Next step is 5cm wide swaths - ie: 50mm line width. • Fallback is to develop a multi-nozzle/head approach for area coating. Wide Area Nozzle CAD Model 3mm Ag on Si Wafer Wide Area Nozzle MID Fürth – 30.9.10

Examples of Materials Used Examples of Materials Used MID Fürth – 30.9.10

Application Areas pp Packaging and Assembly Electronic Devices Solar Cells* High Density Interconnects* Displays* Flip-Chip / Direct Die Attach Fuel Cells Embedded / Integrated Passives Flex Circuits Flex Circuits Sensors & MEMS Sensors & MEMS Hybrid Manufacture Meso-Dispensing Electronic Components 3D Smart Structures Life Science Resistors, Capacitors and Inductors Micro-Antennae Bio-Sensors* Micro-Arrays Micro-Batteries *Production Applications 2010 MID Fürth – 30.9.10

Connecting Stacked Dies (R (Replace Wire Bond or TSV) l Wi B d TSV) Interconnects: 25micron line width Interconnects: 25micron line width 10 microns thick Cross section for die interconnects. Insert shows close up of contact area . MID Fürth – 30.9.10

Printed Interconnect Advantages g F Features t •Interconnects as small as 10 μ m at <30 μ m Pitch. •Full Range of High Conductivity Materials. •High Aspect Ratio for Low Resistivity. g p y •Supports Non-Planar and 3D Surfaces. Cost & Functional Advantages. & g •Higher Frequencies* with Better Reliability than WireBond. •Much Better Time-to-Market and Cost Structure vs. TSV. •Reduced Form Factors vs. Package on Package. 3D Stacked Die 3D Stacked Die Working with Leading Smart Phone Players for Multi-Chip Packages (Processor/Memory Chip Sets) *Supports HF without antenna effect. Enables Multi-Chip Packages that combine Processor with Memory, etc. MID Fürth – 30.9.10

Touch Screen-Bridge/Jumper Circuit Touch Screen Bridge/Jumper Circuit Pre-Patterned ITO 5mm Step 1: Print Insulator Step 2: Print Nano-Silver 30 microns wide 10 microns wide MID Fürth – 30.9.10

Bridge Jumper on ITO Bridge Jumper on ITO REFLECTION REFLECTION Insulator Ag TRANSMISSION Step 1: Print Insulator 30 microns wide 30 microns wide MID Fürth – 30.9.10

All-Printed OE Circuit All Printed OE Circuit 8 NAND Gates, 3 Inverters 2m m Inverter Inverter Crossover Crossover NAND Gate NAND Gate *Optomec Inc. collaboration with Dan Frisbie Group UMN MID Fürth – 30.9.10

Printed Sensor Networks for St Structural Health Monitoring t l H lth M it i Ag Strain Gauge on Al CuNi Strain Gauge COURTESY: Ag Strain Gauge on CFC MID Fürth – 30.9.10

Printed Sensor Networks Simulation of Sensor Networks for Structural Health Monitoring Simulation of Sensor Networks for Structural Health Monitoring Pt Strain Gauge FEA Combination with 3D MID Substrates – Smart systems. MID Fürth – 30.9.10

Printed Temperature Sensor Printed Temperature Sensor Ag and Ni sensor structure MID Fürth – 30.9.10

Example of Current 2 1/2D printing. Ceramic MID with Gold Ink ca 5mm ca. 5mm Interconnects ca. 100microns wide MID Fürth – 30.9.10

6-Axis Aerosol Jet Printer 6 Axis Aerosol Jet Printer Test Part Part Gripper Nozzle Shutter Installed a 6-Axis Aerosol Jet printer which extends process capabilities to true, large area, 3D printing. Build volume: c. 850 x 1200 x 1000mm (x-y-z) MID Fürth – 30.9.10

6-Axis Aerosol Jet Printer 6 Axis Aerosol Jet Printer. AJ-6X System installed at the Electronics Lab of FAPS (Institute for Manufacturing Automation & Producton Systems), University Erlangen-Nuremberg. FAPS Lab has extensive expertise in electronic systems and MIDs. Aim for Synergistic Effect in 3D Electronics. MID Fürth – 30.9.10

Summary Summary Aerosol Jet Process Capability • Non-contact, conformal deposition • Scalability: Ultra fine printed fine features to wide area High Utility • Wide range of materials compatibility • Wide range of applications • Scalability for volume manufacture New 6-Axis Printer opens the way for novel 3D Printed MIDs over large areas. MID Fürth – 30.9.10

Thank You! Thank You! Neotech Services MTP - Dr. Martin Hedges Tel: +49 911 274 5501 info@neotechservices.com @ MID Fürth – 30.9.10