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Welcome to Celebrating 30 years in Semiconductor and Sensor - PowerPoint PPT Presentation

Aug 15, 2023 •89 likes •567 views

Welcome to Celebrating 30 years in Semiconductor and Sensor device manufacture! Sensor and Silicon Solutions Over 250 million die shipped per year Fab 3 Fab 1 Probe & Test Fab 2 Semefab Overview Commercial Foundry Global

  1. Welcome to Celebrating 30 years in Semiconductor and Sensor device manufacture!

  2. Sensor and Silicon Solutions Over 250 million die shipped per year

  3. Fab 3 Fab 1 Probe & Test Fab 2

  4. Semefab Overview � Commercial Foundry � Global Fabrication Player � CMOS/Bipolar Foundries – 6” & 4” � ≈ 83% Export Bias � MEMS Foundry – 6” & 4” � >46 Customers Worldwide � Ship >250 million die/year � Profitable, Cash Positive, Low Gearing � Technology Inductions � Private Limited Company � Design & Development Partnerships � Established 1986 >250 Million die shipped per year www.semefab.com

  5. Foundry Operations Fab Operations � Fab 3: 6” MOS/Bipolar to 0.8 µ m � Fab 2: 6” & 4” MEMS to 0.8 µ m � Fab 1: 4” MOS/Bipolar to 2.5 µ m � Probe & Test Operation � ISO9001, ISO14001 � UL & ESA Approval >250 Million die shipped per year www.semefab.com

  6. Foundry Operations Diverse Process Portfolio � MEMS � PiN Photo Diode � Si Gate CMOS & Opto CMOS � Lateral FET � Metal Gate CMOS & PMOS � Low Noise N Channel JFET � DI Complementary Bipolar � DMOS RF MOSFET � DI BiCMOS � Power Bipolar � Linear Bipolar � Fast Recovery Diode >250 Million die shipped per year www.semefab.com

  7. Diverse Process Portfolio MEMS & MOS/Bipolar Volume Foundry Cantilever Structure Courtesy of: Microvisk Technologies Inc. Limited Illustration – much of our foundry portfolio is customer proprietary �

  8. Production Capacity � Fab 3: 25,000 6” wafers per year capacity, potential 75,000 � Fab 2: 25,000 4”/6” wafers per year capacity � Fab 1: 50,000 4” wafers per year capacity � Probe & Test: � Test floor supports wafer test and package test � Electrical parametric testing � Sensor functional testing e.g. low pressure, etc. � Assembly: Subcontracted to Far East � Final Test: In house or Far East >250 Million die shipped per year www.semefab.com

  9. ¡ Device Applications Served ASIC & IC Foundry : � Opto CMOS ASIC Optical Smoke Detector � OptoCMOS ASIC + FILTER Light Sensing and Switching � OptoMCMOS Hazard Flasher � CMOS ASIC Smoke Detector Address � MCMOS ASIC Garage Door Opener � CMOS ASIC Automotive Windscreen Wiper � CMOS ASIC Automotive Window Lift � CMOS ASIC EC Motor Controller Interface � CMOS Foundry Secure Telecoms � DI BICMOS Precision Op-Amps � Linear Array Solar battery charger controller >250 Million die shipped per year www.semefab.com

  10. ¡ Device Applications Served Discretes: � JFET PIR Motion Sensors � Pin Diode Light Sensing � Lateral MOSFET Audio Power Amplification � Bipolar Power Power Devices and Module � FRD Power Devices and Module � RFMOSFET RF Base Stations and PMR � Photodiode Array Precision Measurement >250 Million die shipped per year www.semefab.com

  11. ¡ Device Applications Served MEMS Foundry: � NO2 & CO detectors Automotive Air Quality � Pressure Sensor 1 Bar Automotive Engine Management � Pressure Sensor Altimeter, Diving, Industrial � Pressure Sensor mBar Medical –respiratory � Thermopile Non contact temperature sensing � Gas Thermal conductivity Gas flow measurement >250 Million die shipped per year www.semefab.com

  12. Projects in Development � Silicon Nanowire bio sensor � MEMS micro hotplate � Ultra Low pressure medical pressure sensor � Blood analysis sensor >250 Million die shipped per year www.semefab.com

  13. ¡ Global Business Distribution FY2016 ¡ UK USA 18% 24% Europe 30% Asia 28% >250 Million die shipped per year www.semefab.com

  14. Revenue by Technology Family FY2016 ¡by ¡sector ¡ MEMS ¡ 32% ¡ CMOS ¡& ¡Bipolar ¡IC ¡ 44% ¡ Discrete ¡ 24% ¡ >250 Million die shipped per year www.semefab.com

  15. Fab 3 MOS / BIPOLAR 150mm

  16. Fab3 – Process Capability � ASML 5500 Stepper to 0.8µm (capable to 0.5µm) � Perkin Elmer Projection Alignment to 2.0µm � Furnace Stack 1: Oxidation, Oxidation, LPCVD PolySi (in situ Phos dope), Phos deposition � Furnace Stack 2: Oxidation, Oxidation, LPCVD Nitride (Std & Low Stress), Boron deposition � Furnace Stack 3: Oxidation (SiC), Oxidation, Alloy, LPCVD BP-TEOS � Mercury Automated Pre Diffusion Clean System >250 Million die shipped per year www.semefab.com

  17. Fab3 – Process Capability � Wet Etch – BOE, Metal etch, Solvent strip, PDC � SVG8800 Coat / Develop Track � LAM 4420 Nitride / Poly Etch � LAM 4520 Oxide Etch � LAM 9600 Metal Etch � Varian 3290 Al/1%Si, Al/1%Cu, TiW Sputter with pre-etch � Varian 350DE Ion implanter, B, P, As >250 Million die shipped per year www.semefab.com

  18. Fab 3 – 6” CMOS/Bipolar 1500 m 2 (15850 sq. ft.) Class 100 Photo, Class 10 >250 Million die shipped per year www.semefab.com

  19. Fab 3 Photolithography

  20. Fab 3 Diffusion

  21. Working With You Multi-Nationals, SMEs, Start-Ups and Academia

  22. Fab 3 Diffusion

  23. Fab 3 Implant

  24. Seamless Transition Induction, Development, Volume Solutions

  25. Fab 2 – Process Capability � ASML 2500 Stepper to 0.8 µ m � Double side proximity alignment to 2.0 µ m � Furnace Stack: Oxidation; LPCVD PolySi � Wet Etch - PDC, HF, BOE, Al etch, Si Etch, Solvent Strip � KOH wet etch � Acetone & NMP Lift-off � Multi-Metal Sputter – Au, TiW, Al, AlSi, AlCu, Ti, Ni, NiCr, Al2O3, Constantan, SiCr, Sn >250 Million die shipped per year www.semefab.com

  26. Fab 2 – Process Capability � Evaporation – Cr, Ni ,Pt, Au, Ti, Ta � 6” Dry Etch: LAM Rainbow Oxide, Poly/Nitride � 4” Dry Etch: LAM Autoetch 490 & 590 � PECVD Thin Films - SiO2, SiN, SiON � Wafer-Wafer & Wafer-Glass Bonding - Anodic, Eutectic, Fusion � SVG8800 Coat/Develop track – bulk dispense � SVG8800 Coat/Develop track – syringe dispense >250 Million die shipped per year www.semefab.com

  27. Fab 2 – Process Capability � Polyimide – coat and bake � XeF2 dry etch release of Polysilicon � Deep Reactive Ion Etch (Fab1 Annexe) � Resist strip dry etch, Matrix 101 � Critical point drying CO2 / IPA >250 Million die shipped per year www.semefab.com

  28. Fab 2 MEMS 100mm & 150mm

  29. Fab 2 Photolithography

  30. Fab 2 Wet Etch

  31. Fab 2 DRIE Etch

  32. DRIE Test Structures >250 Million die shipped per year www.semefab.com

  33. Fab 2 XeF2 Release Etch >250 Million die shipped per year www.semefab.com

  34. 3 Axis Accelerometer with CMOS >250 Million die shipped per year www.semefab.com

  35. Released Cantilever Structures >250 Million die shipped per year www.semefab.com

  36. Fab 2 Sputter

  37. Fab 2 Sputter

  38. Blood Viscosity Sensor Can:lever ¡structure ¡courtesy ¡of: ¡Microvisk ¡Technologies ¡Inc. ¡ >250 Million die shipped per year www.semefab.com

  39. Fab2 – 6” & 4” MEMS 800 m 2 (8450 sq. ft.) Class 100 Photo, Class 10 >250 Million die shipped per year www.semefab.com

  40. Diverse Process Portfolio MEMS & MOS/Bipolar Volume Foundry

  41. 1GHz RF LDMOS Cross Section >250 Million die shipped per year www.semefab.com

  42. Probe & Test Capability � 360m 2 (2,691 sq.ft.) Probe & Test Floor � Class 100 Operating Environment (Hoods) � Reedholm Instruments RI20/RI40 Parametric Tester (3) � Tesec 8101TT - Discrete Device Tester (3kV/20A) (1) � Multitest SOIC / DIP Handler –40°C to +125°C (5) � Electroglas 2001X Wafer Auto-prober (7) � Wentworth 1050 Semi-Auto Prober (high-voltage) (1) � Thermostream (1) >250 Million die shipped per year www.semefab.com

  43. Probe & Test

  44. Probe & Test

  45. A Global Business We export to over 20 countries worldwide

  46. Contact us semefab Glasgow Edinburgh Internation International al Airport Airport DRE Structure: 2mm x 2mm Semefab Ltd. Newark Road South, Eastfield Industrial Estate, Glenrothes, Fife, Scotland, UK, KY7 4NS T: +44 1592 630630 F: +44 1592 775265 E: info@semefab.com www.semefab.com

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