SiPM Manufacture for Large Area Detection IP / Projects Manager Dr. - PDF document

SiPM Manufacture for Large Area Detection IP / Projects Manager Dr. John Murphy Oct. 2007

Core Competence Single Photon Counting (SPC) Silicon Photomultiplier (SPM) Photon Counting/Timing Imager (DigitalAPD) Identical Core Technology Multiple Configurations 2

SPM Product SPM 100/150mm Wafer SPM 1mm 2 , 9mm 2 Singulated Die TOX SPM Packaged Multiple Configuration Options, SPM Module see our Website! - SPMMicro - SPMMini - SPMScint SPM Arrays 3

Large Area Detection • Advances in solid state sensor technology (SPM) combined smart interconnect/ packaging solutions. – Large Area >1” (PMT size) – 2D spatial imaging • Primary Applications – Radiation Monitoring – Medical Imaging – High Energy Particle Detection – X Ray Detection – Flow Cytrometry – Confocal Microscopy – Microarray Scanning 4

SPM Packaging - Terminology Example Shown: N = 5; M =3 SPM Pixel NxN SPM Submodule MxM SPM Module • Scaled SPM array architecture • Submodules equivalent to 1.5” PMT sizes • 4-side buttable • Electronics integration 5

SPM Key Properties Sensitive to single photons • • Excellent Photon Counting (Resolvable Photoelectron Peaks) 1mm 2 and 9mm 2 available • High Intrinsic Gain 10 6 • High PDE • – 25-40% Green/Red – 40-60% Blue/UV • Good Dynamic Range/Linearity Low Operating Voltage <40V • • Insensitive to Magnetic Fields 6

SensL Die Manufacturing • Manufacturability is KEY Tyndall National Institute 100mm Commercial Foundry 150mm 7

Geometrical efficiency • A35H - 60% Fill Factor • A50H – 70% C20 A20L A20H 17% 34% 43% • PDE = effective QE x Fill Factor 8

Example Breakdown Uniformities Tight distributions, across wafer, wafer to wafer, run to run. Breakdown voltage independent of diode structure, size 9

Large Area SPM • PMT area equivalents >0.5” • 3 Array Approaches Pursued – Flex Arrays – Glass Arrays – Ceramic Arrays • Pixellated/Summed Outputs • Buttable Submodules (Pixellated) • Coupling Efficiency – Ideally butt coupled 10

Flex Arrays Detector Interconnection Detection Facet with metal tracks & bondpad sites Individual SPM detectors Emission Facet Detector Array (tiled NxN – example N =4) Source Block Transparent or perforated thin film sheet (polyimide flex) with metal tracks (tracks not shown) sandwiched between source & detector. 11

Flex Arrays SPMArray Flex Benefits – NxN SPM individually addressed • Low cost/Lightweight • Scalable – Spatial detection • Simplified electrical interconnections • Small Form Factor SPMPlus – NxN array summed output – Large Area detection British Patent Application No. 0621495.1, October 2006. 12

Package Concepts 3mm x 3mm SPM detectors Submodule of 25 SPM detectors Fig. 1: 3x3 Module showing 9 submodules each with a 5x5 hybrid assembly of SPM detectors Intermediate layer grid – between detector and scintillator. Glass Substrate. Electronics - PCB. Ribbon electrical interconnect . SPM detectors. Fig. 2: Concept for full module assembly – 1x3 module shown. (Drawings not to scale). 13

Glass Arrays • SPM flip-chip on glass 4x4 SPM Pixellated Output 4x4 SPM Summed Output “SPM Array” “SPM Plus” 14

Glass Manufacture • Shipping prototypes to customers 15

IV Curves 1.0E-02 1.0E-02 1.0E-03 1.0E-03 D1 D1 D2 1.0E-04 D2 D3 1.0E-04 D3 D4 D4 1.0E-05 D5 1.0E-05 D5 D6 D6 I(A) D7 1.0E-06 I(A) D7 1.0E-06 D8 D8 D9 1.0E-07 D9 D10 1.0E-07 D10 D11 D11 1.0E-08 D12 1.0E-08 D12 D13 D13 D14 1.0E-09 D14 1.0E-09 D15 D15 D16 1.0E-10 D16 1.0E-10 10 15 20 25 30 35 10 15 20 25 30 35 Bias Voltage(V) Bias Voltage(V) 1.0E-02 1.0E-03 D1 D2 1.0E-04 D3 D4 1.0E-05 D5 D6 I(A) D7 1.0E-06 D8 D9 1.0E-07 D10 D11 1.0E-08 D12 D13 D14 1.0E-09 D15 D16 1.0E-10 10 15 20 25 30 35 16 Bias Voltage(V)

17

SPM Plus & SPM Array Schematic Standoffs Jack socket Glass Module Motherboard Board to board Connectors Pre-amp circuit Wire to board SMA Connectors x 16 SMA Connectors x 1 18

Ceramic Arrays • In Assembly – due Nov. ’07 • 4 side buttable solution Specification Value SPM submodule size Variable from 0.5” to 1.5” (present) Pixel to pixel spacing <200µm (target 100µm) within submodule N x N Submodule Fill Typ. 46.6% Factor Submodule to Minimum 1mm submodule spacing Submodule Substrate Ceramic with BGA Optical Encapsulant OPTOCAST, DYMAX and EPOTEK 19

Summary & Q’s • Cooling is key development • 3 approaches – – Glass (now available) – Flex (true buttability, thinnnest working distance) – Ceramic (true buttability) • What is the total detector area required? • What wavelength region is of interest? • What are spatial resolution requirements? 20

21 www.sensl.com

jmurphy@sensl.com John Murphy Thank You!

Q.E. curve of new device Our blue-sensitive devices are currently in test, so it is fair to say that the 40-60% is a target value I think. The curve attached shows the predicted (modelled) values that we expect to achieve for our blue devices. 23