Panasonic's advanced packaging technologies for thin substrates May - PowerPoint PPT Presentation

1 Panasonic's advanced packaging technologies for thin substrates May 27 th , 2014 Mitsuru Hiroshima Micro Electronics Division Panasonic Factory Solutions Co., Ltd. The 64 th Electronic Components and Technology Conference (ECTC 2014) 2014

Panasonic's 4 Business Groups and Our Company 2 Figures as of April 2013 Automotive Appliances Eco Solutions Industrial Manufacturing Panasonic Welding Systems Co., Ltd. Panasonic Factory Solutions Co., Ltd. Automotive & Head Office Osaka, JAPAN AVC Networks Industrial Systems Establishment January 1, 2003 Funding 100% from Panasonic Corp. Paid-in capital 15 billion yen Employees 2,870 （World wide） Electric Component Mounting Business Area Microelectronics Systems etc.. The 64 th Electronic Components and Technology Conference (ECTC 2014) 2014

Product Portfolio -Electronic Circuit Manufacturing Solution- 3 Final Product Plasma Dry Etcher Die Bonder LCD Driver IC Bonder PCB Assembly FPX Series Mother Board Module MDP Series FPC APX300 Assembly Package LCD Panel RF Module Assembly Frontend & Image Pre-assembly Sensor SMD System GPS Module Bare Die SAW filter IC fabrication Plasma cleaner Pre-assembly Flip Chip Bonder Plasma Dicer APX300 FCB3 PSX307 NPM Series The 64 th Electronic Components and Technology Conference (ECTC 2014) 2014

Requirements for thin-substrate Manufacturing 4 Bendable Smart Phone Secured Plastic Card Wearable for Healthcare Source) LG Source) SAFE KEEPER CARD Source) Fitbit Flex Flexibility + “more Functions in Small Volume” Mounting “thin-Si die/component” on “thin-substrate” is essential ! Key requirements Source) zxhgroup.com Strength Reliability Support of thin-die of Interconnect thin-substrate The 64 th Electronic Components and Technology Conference (ECTC 2014) 2014

Panasonic’s PKG Solutions for thin substrate 5 Strength Reliability Support of thin-die of Interconnect thin-substrate e-Carrier Plasma Dicing Plasma Cleaning (Electrostatic Force) Wire Die Source)Win Industry Flexible Substrate Substrate Cover Die SMD Process Electrode DC Electrostatic carrier The 64 th Electronic Components and Technology Conference (ECTC 2014) 2014

What is “Plasma Dicing” ? 6 SF 6 + O 2 Blade Dicing Plasma Dicing SF x + F*,O* SiF 4 etc.. Resist Si x Sidewall O y F protection S z iF 4 SOLID based Dry Etching based Si The 64 th Electronic Components and Technology Conference (ECTC 2014) 2014

Plasma Dicing - Die Strength - 7 Blade Dicing Plasma Dicing 3 points bending test result 100% Top View 60 μ m Cumulative Frequency (-) 10% 1% TEM Image Blade Dicing Plasma Dicing damaged layer 0% 100 1000 10000 (500nm thick) Chip Strength (MPa) Strong thin-die by Plasma Dicing ! Dicing chip The 64 th Electronic Components and Technology Conference (ECTC 2014) 2014

Plasma Dicing - Makes dies stronger - 8 “R” edge Circular Hexagonal Highest Strength Dies The 64 th Electronic Components and Technology Conference (ECTC 2014) 2014

Plasma Cleaning - PoP interconnection - 9 ■ TMV (Through Mold Via) process ■ XPS depth profile on solder ball surface Laser Solder Ball Before plasma After plasma Mold-resin TMV Smears Atomic Concentration(%) Atomic Concentration(%) （Residues） Bottom PKG Carbon Sn Plasma Cleaning Sn Carbon Top PKG Reliable Solder Joint after cleaning ! XPS : X-ray Photoelectron Spectroscopy The 64 th Electronic Components and Technology Conference (ECTC 2014) 2014

Contribute to your thin-sub. manufacturing ! 10 Plasma Dicing Chip Bonding MD-P200US APX300 Plasma Cleaning Handling Panasonic’s Source)Win Industry PKG techniques PSX307 e-carrier The 64 th Electronic Components and Technology Conference (ECTC 2014) 2014

11 The 64 th Electronic Components and Technology Conference (ECTC 2014) 2014