Meyer Burger welcomes the delegates to WRETC Are your ready for the next solar wave ?
Passionate about PV «We will shape the future energy mix by combining leading technology with the infinite power of the sun .» «We will further develop the photovoltaic, semiconductor and other high-end niche markets using both new and exisiting technologies.» From ingot to solar module to complete BIPV energy system Meyer Burger, WRETC 2013 2
PV will play a key role in a sustainable future mix Potential : 2050 scenarii according to IEA Meyer Burger, WRETC 2013 3
Learning curve [€/W p ] η cell [%] = 10 15 18 20 22 25 100 1980 1990 2000 2004 10 2007 2012 80% experience curve: 2020 cost reduction appr. 10% pa. 1 But 2012: 60% in one year 60% -> 6 years in advance d [µm] = 400 300 200 100 50 Meyer Burger, WRETC 2013 10 -1 10 1 10 3 10 -4 10 -3 10 -2 10 2 Cumulative installed capacity [GWp] 4 4 Source: ISE, MBT
Difficult market environment for cell and module manufacturers – Price decline in solar modules puts enormous pressure on module manufacturers – however, it is necessary to reach and keep grid parity – Cell and module manufacturers still cautious on undertaking any major investments – Cost-/price ratio disadvantage of solar modules expected to reverse Solar modules cost/price development US$/Wp 1.5 1.2 0.9 0.6 Meyer Burger, WRETC 2013 profit 0.3 E E E E 2010 2011 2012 2013 2014 2015 Modul prices Modul cost 5 Source: PVinsights & Management estimates. Note: Average price for end-user for installed on-roof systems up to 10 kWp.
PV Industry Drivers Total life cycle cost LCOE = Total life cycle energy production Customer and global Customer and global services services (feedback) up, maintenance) (training, ramp Ingot/Wafer Mono- /Multi c-Si Solar cells Solar modules Solar systems slicing $ $ $ $ $ kg Wafer Wp Wp kWh TCO = Total cost of ownership BOS = Balance of system LCC = Life cycle cost PR = OEE = Overall equipment effectiveness Performance ratio VDMA 34160 : 2006-06; SEMI E35, SEMI:E 79 Meyer Burger, WRETC 2013 2 3 1 Performance Cell & module efficiency, ratio, 4 yield, uptime, TCO longevity, BOS MES automation system 6
Disruptive wafering technology 3 strategic initiatives CellLine WaferLine Material Utilization Combine best in class wafering Thin Wafer / Wire Yield >95% >90% >80% Line Utilization High efficient cell technology Yield Improvement Diamond coated, Ni plated Meyer Burger, WRETC 2013 7
Heterojunction – more power per surface and more yield at high temperatures Crystalline technology Thin-film HJT Technology high efficiency Low efficiency High efficiency + = Proven, reliable High harvesting factor High harvesting factor in hot technology in hot climates climates High BOS Proven process steps Meyer Burger, WRETC 2013
Reduced complexity with MB-Cell-Technologies Standard process Selective Emitter MB-HJT process MB-iPerc upgrade process FS Metallization Texture SiN layer Emitter Si material AlOx layer p-type wafer SiNx layer Laser openings Al Screen print Local Al-BSF Texture Texture Texture Texture Doping / Diffusion Doping / Diffusion Doping / Diffusion a -Si Front/ Rear Side Additional ??? Edge Isolation Edge Isolation TCO / Metal Rear Contact Additional ??? PSG Etch PSG Etch Print Front Side Additional ??? SiNx Capping layer AR Coating AlOx passivation layer Curing Additional ??? Print Rear Side AR Coating Edge Isolation Print Front Side Test & Sort Laser contact opening PSG Etch Firing Print Rear Side AR Coating Low temperature Test & Sort Print Front Side (< 250°C) processes Print Rear Side Reduced complexity Meyer Burger, WRETC 2013 Print Front Side Firing Test & Sort Firing Test & Sort CZ :18,5% CZ n-type: MC: 16,8- CZ: 18,5%- 20~23%, potencially to 9 17% 19% MC: reach even 24% in soon 17%-18% future
Smart Wire Connection 5% higher power output 10% higher energy yield Rays descending on a bus bar tabbing (left) and on a round wire (right). The wire can be divided into three regions: Black arrows indicate the descending rays, green rays will reach the surface of the cell and red rays will not reach the surface. Source: Stefan Braun, University Konstanz Meyer Burger, WRETC 2013 • Highly effective front side without shading by bus bars • Higher sensitivity in regard of partial cell shading • Higher light efficiency based on the better light trapping • 80% less silver consumption 10 • Route to very thin wafers
MB technology road map at a glance 1 Diamond wire wafering 1 3 -> thinner wafer -> lower costs High efficiency -> lower system cost (BOS) 2 PECVD -> independent of wafer thickness Only 6 process steps -> low COO PECVD Temperature coefficient -> higher energy yield Bifacial -> higher energy yield 4 TCO layer and wafer thickness 2 3 texture + suitable for SmartWire WET surface preparation -> 80% less silver, i/n Si SCREEN PRINT -> higher energy yield i/p Si 5 -> higher efficiency -> longevity Front contact CHARACTERIZATION PVD -> microcrack resistent Back Meyer Burger, WRETC 2013 PVD -> less sand dust sensitive contact contacting 4 Adapted test metrology test & sort -> high cap cells -> BB0 -> dragon back -> PED (Chipping) HJT cell 11 5 Single wafer tracking
Achievements – Temperature Coefficient -0,20 %/K on Cell level! -0,22 %/K on Module level! Meyer Burger, WRETC 2013 Excellent Temperature Coefficient certified by Fraunhofer ISE CalLab and TÜV Rheinland! 12
HJT – SmartWire Technology Damp Heat Test DAMP 1000h 2000h 5000h 8000h HEAT IEC MB HJT -0.7% -1% -1% -8% � Even after 5000 hours of Damp Heat testing Meyer Burger HJT modules still stable without power losses. � Fully compatible with IEC conditions (< 5% power loss) � Even after 8000 hours damp heat still working with only 8% power loss � Higher longevity Meyer Burger, WRETC 2013 Damp Heat Testing up to 8000h (8 x IEC) ! 13
We think in material-Process flows & act on technologies Fab-level Material-Process flow Technology Latest single technologies 1 GW-fab 160MW cluster FS Metallization Texture Meyer Burger, WRETC 2013 SiN layer Emitter Si material AlOx layer p-type wafer SiNx layer Laser openings Al Screen print Local Al-BSF 14
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