Loranger Socket Families Socket Families Loranger Over 3,000 - PowerPoint PPT Presentation

Loranger Socket Families Socket Families Loranger Over 3,000 Socket Designs - - 0.25mm and Larger Pitches 0.25mm and Larger Pitches Over 3,000 Socket Designs QFN – – MLF MLF - - LLP LLP BGA - - LGA LGA CSP QFN BGA CSP Other Socket Types Other Socket Types

QFN - - MLF MLF - - LLP Socket Features LLP Socket Features QFN • 0.25 mm Pitch and Up 0.25 mm Pitch and Up • Heat Pipe Heat Pipe • Dual Row Dual Row • • Non Non- -Magnetic Option Magnetic Option • • Double Duty Kelvin Double Duty Kelvin • • PTH / Clam Shell or Open Top PTH / Clam Shell or Open Top • • SMT / Compliant Cover SMT / Compliant Cover • • Thermal Management Thermal Management • Heat Sink Heat Sink Over 850 850 QFN Socket Designs QFN Socket Designs Over

BGA / CSP / LGA Socket Features / CSP / LGA Socket Features BGA • Micro Micro- -spring / APS Contacts spring / APS Contacts • • 0.25 mm Pitch and Up 0.25 mm Pitch and Up • • Current Rating: Up to 1AMP / Contact Current Rating: Up to 1AMP / Contact • • Frequency: 5 GHz Frequency: 5 GHz • • > 50,000 Cycles > 50,000 Cycles • • Non Non- -Magnetic Option Magnetic Option • • Clam Shell Style Clam Shell Style • • SMT / Compliant Cover SMT / Compliant Cover • • Thermal Management Thermal Management • • Heat Sink • Heat Sink • RTD • RTD - - Heater Heater • Programmable Smart Socket Programmable Smart Socket • Over 700 700 BGA / CSP / LGA Socket Designs BGA / CSP / LGA Socket Designs Over

Wide Range of Socket Styles Wide Range of Socket Styles Burn- -in and Kelvin Test Designs in and Kelvin Test Designs Burn • Gull Wing • Gull Wing • • TO TO • • SMD SMD • • ZigZag ZigZag • • Microwave / Hybrid Microwave / Hybrid • • LCC / PLCC LCC / PLCC • • Axial / Radial / Melf Axial / Radial / Melf • • SIP / DIP SIP / DIP • • Optical Transceivers Optical Transceivers • • Connectors Connectors Ask about Thermal and Non- -Magnetic Options Magnetic Options Ask about Thermal and Non

Printed Circuit Boards Printed Circuit Boards

Dedicated Burn- -in Boards in Boards Dedicated Burn • Highest Density to Maximize Throughput • Highest Density to Maximize Throughput • Lowest Cost per Device Position for Volume • Lowest Cost per Device Position for Volume • Input Isolation & Output Loading Availability • Input Isolation & Output Loading Availability • All Device Types and Package Styles • All Device Types and Package Styles

Universal Burn- -in Boards in Boards Universal Burn • Decreases Board Inventory • Decreases Board Inventory • Device Pin Programmability • Device Pin Programmability • High Density of Burn • High Density of Burn- -in Sockets in Sockets • Quick Response to New Schematics • Quick Response to New Schematics • Increase Board Service Life with Programming Features • Increase Board Service Life with Programming Features

HAST • • 85 / 85 THB 85 / 85 THB HAST Loranger Loranger HAST and Humidity boards use special board materials, optional HAST and Humidity boards use special board materials, optional inner inner layer trace routings, optimal trace spacing, surface mount or PTH components, and H components, and layer trace routings, optimal trace spacing, surface mount or PT low thermal mass designs to aid in rapid temperatures changes. low thermal mass designs to aid in rapid temperatures changes.

Program Cards & Connectors Program Cards & Connectors • Several Styles of Program Cards are available, including dedicated designs with components, or universal designs that can be configured by the user. • Also, several Loranger Edge Connectors are available in various pitches and I/O. Loranger 03199 A01 6218A connector with 49/98 contacts on 0.100 pitch Loranger 03199 A01 6218A connector with 49/98 contacts on 0.100 pitch to accommodate a keyed 98 I/O universal program card to accommodate a keyed 98 I/O universal program card

Environmental Systems Environmental Systems Dynamic • • Static Static • • Humidity Humidity • • Ambient Ambient Dynamic • Optional computer controlled burn-in and data collection • Custom signal generation boards • Single or multiple chamber systems • Various chamber sizes • Powered cool down racks • Feed through back chamber wall

Environmental Systems Environmental Systems Backplane Multifunction Boards Backplane Multifunction Boards • Custom board designs for signal generation, data collection, fuses, and resistive loads • Caged, external rack on rear of system holds the multifunction boards • Burn in boards pass through the chamber back wall to connect to an interconnect assembly • Power and ground buss bars inside the rear cage provide power to the interconnect assemblies • Multifunction boards plug into the interconnect assemblies

Environmental Systems Environmental Systems Four Chamber Burn- -in System in System Four Chamber Burn

Environmental Systems Environmental Systems Ambient Burn- -in System in System Ambient Burn • Room temperature burn-in for high power devices • Board racks set at an angle to provide proper airflow and cooling • Ventilated walls for airflow • Backplane connectors and power supplies

Loranger International Corporation International Corporation Loranger Visit Us At www.bce.it www.bce.it for Information Regarding for Information Regarding Visit Us At Sockets Sockets PC Boards PC Boards Systems Systems

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