for Next xt-Generation Smartphone Performance Requirements May 30 - PowerPoint PPT Presentation

Advanced In Insulating Fil ilm for Next xt-Generation Smartphone Performance Requirements May 30 th th , IE IEEE EPS Seminar(ECTC2019) M , 2019 Yoshio Nis ishim imura Res esea earch Ins Insti titute for Bio Bioscie ience Pro roducts ts & Fin ine e Chemicals Ajin inomoto Co., In Inc. ww22, 2019 Proprietary and Confidential of AJICO 1

Pre resentation Contents 1. Brief Company Introduction of Ajinomoto Co., Inc. 2. Insulation Build-up Materials; Ajinomoto Build-up Film(ABF) Low Dielectric Loss ABF for high frequency package Next Generation ABF for Thinner Application 3. Molding Film(ABF-LE) ww22, 2019 Proprietary and Confidential of AJICO 2

Over Vie iew of the Ajin jinomoto Group May 20, 1909 Foundation Paid-in Capital JPY 79,863million Number of employee 34,452 Net sales FY2017 JPY 1,150.2 billion (as of March 31, 2017) Amino Science Foods Pharmaceuticals and Health ww22, 2019 Proprietary and Confidential of AJICO 3

In Insu sula lation Build ild-up Materials ls; Ajin jinomoto Build ild-up Film ilm(ABF) ww22, 2019 Proprietary and Confidential of AJICO 4

ABF F Appli licati tion Print Circuit Board (PCB) Electric Product CPU Package Underfill C4 solder IC Chip bump Solder resist Dielectric Material Packaging Substrate Core material (FR-4 or 5) PTH plugging resin X-sectional view Solder ball (2 nd level interconnect) ww22, 2019 Proprietary and Confidential of AJICO 5

Outli line of Manufacturin ing Substrates usin ing ABF 1; Preparation of 7 ; Patterning core-boards 8 ; Electro Cu plating 2 ; ABF vacuum lamination 3; Pre-curing 9; Dry Film removal 10; Thin Cu etching & 4 ; Laser Via formation Full-curing & Desmear (180-200degC) Repeat for multilayered Build-up 5 ; Thin Cu plating Semiconductor chip 6 ; Photo Dry Film Resist lamination 3L ABF 2L 1L core 3L 2L ABF [Packaging substrates] 1L ww22, 2019 Proprietary and Confidential of AJICO 6

Manufacturing Process of ABF Cover Film resin, filler ABF Mixing PET PET (10-100um) Coating Drying Film manufacturing Varnish Cover film ww22, 2019 Proprietary and Confidential of AJICO 7

Smartphone PKG trend & ABF develo lopment trend Patch antenna + (Yagi antenna) Feed layers Substrate (wiring) FPC socket EMI shield FPC Transceiver IC RF Front End IC Antenna Substrate RDL Application Processor ww22, 2019 Proprietary and Confidential of AJICO 8

Next xt Build ild-up Material for Hig igh Sp Speed Appli lication ■ Requirement for Low Transmission Loss Transmission loss ( a ) ■ ABF for High Speed Transmission = Dielectric loss( a d ) + Conductor loss( a c ) GX series (Epoxy and Phenol Hardener) e x tan d a d ∝ √ Polar moiety e : Dielectric constant tan d : Dielectric loss tangent GZ series (Epoxy and Cyanate Ester) a c a d GL series (Epoxy and Phenolic Ester Hardener) To reduce the transmission loss…  Low dielectric loss tangent (Df) Reduction of polar group ww22, 2019 Proprietary and Confidential of AJICO 9

Outli line of New ABF GL serie ies ww22, 2019 Proprietary and Confidential of AJICO 10

Evalu luation of Transmission Loss ＊ Formula of strip line impedance     30 ( 2 ) H t    Z   s e   ( 0 . 441 ( 2 ) W H t r W ： 45-50um 2 H ： 80um t ： 13-23um Z S ：50Ω Transmission Loss: GX92 >> GX-T31 > GZ41 > GL Low Df material shows lower transmission loss. ww22, 2019 Proprietary and Confidential of AJICO 11

Next xt Generation ABF for Thin inner Applic lication ■ Redistribution layer of 2.1D / Fan-out package Thinner LtL, Smaller via, Finer Line & Space  Using Smaller Silica  ■ Development of New ABF with smaller Silica Conventional ABF New ABF New ABF with smaller silica showed smooth surface after E-less Cu plating ww22, 2019 Proprietary and Confidential of AJICO 12

Fin ine Lin ine & Fin ine Via ia Formation After Wet desmear After Cu plating x10 K x10 K x5000 Smoother surface  L/S = 2/2 by SAP 5um f 5um via by UV Laser ww22, 2019 Proprietary and Confidential of AJICO 13

Insula In lation relia liabili lity (Line to Lin ine) I | Ni/Au SR ■ HAST condition 130degC, 85%RH, 3.3V ABF SiO 2 Si wafer ABF L/S=2/2um L/S=3/3um L/S=5/5um GX92 NG 150hrs pass 200hrs pass GX-T31 NG 200hrs pass 200hrs pass New ABF 200hrs pass 200hrs pass 200hrs pass with smaller Silica New ABF with smaller silica keeps good insulation even L/S = 2um /2um. ww22, 2019 Proprietary and Confidential of AJICO 14

Molding Film ww22, 2019 Proprietary and Confidential of AJICO 15

Backg kground  Market expectation for Fan-out WLCSP FC-BGA Fan-out WLCSP Fan-in WLCSP Advantages over FC-BGA  Advantages over fan-in WLCSP  Thinner  No pad pitch restriction due to fan-out area  Shorter inter connection due to  Only KGD is packaged!  substrate-less Potential SiP integration  Future potential for SiP / 3D  Lower thermal resistance  integration Lower thermal resistance   Wafer form to Panel form  Integrated antenna in FO-WLP Antenna array RFIC 12 inch 500mm x 500mm Heat 8 inch RFIC sink 300mm x 300mm ( IME Industry Forum: High Density FOWLP Platform for Next Generation Mobile/2.5D/5G Systems, March 2016 ) ww22, 2019 Proprietary and Confidential of AJICO 16

Characteris istics of Sheet Mold ldin ing Compound • Low CTE & Low Young’s Modulus Material Name LE ⇒ No warpage after the one-side CTE (30-150degC)(ppm/K) <15 resin curing CTE (50-150degC)(ppm/K) TMA <15 LE: No warpage! CTE (150-240degC)(ppm/K) <25 Young’s modulus ( GPa) <15 Tensile Breaking strength (MPa) 50 mode Elongation (%) >1.0 GX13:Big warpage! Dielectric constant (Dk) Cavity 3.2~3.3 Perturbation method Dissipation factor (Df) <0.01 @5.8GHz (Laminated on 4 inches φ Si wafer) Peel strength (kgf/cm) Cu Plating 0.4~0.5 • Low Df value 130degC, 85%, • Good insulation reliability x-y HAST L/S=15/15um >200h 3.3V Suitable for Molding Material! ww22, 2019 Proprietary and Confidential of AJICO 17

Summary 1. Advanced Build-up Materials; Next Generation ABF ・ Low Dielectric Loss ABF Lower Df ABF showed lower transmission loss >> Applicable to high frequency packages ・ Next Generation Material for Thinner Application Good Processability & Insulation Reliability >> Applicable to WLP/PLP redistribution layer and thinner packages 2. Molding Film (ABF-LE) Low Warpage, Good HAST Reliability, and Low Loss Tangent >> Suitable for FO-WLP/PLP ww22, 2019 Proprietary and Confidential of AJICO 18

Thank you very much for your attention! ww22, 2019 Proprietary and Confidential of AJICO 19