Fault Sim ulation of Heterogeneous I ntegrated Biological System s - PowerPoint PPT Presentation

Fault Sim ulation of Heterogeneous I ntegrated Biological System s H.G. Kerkhoff & X. Zhang Jun-06 «Design for Micro & Nano Manufacture (NoE PATENT-DfMM)» Network of Excellence funded by the European Commission (EC FP6: IST, Unit C2, Contract 507255)

Contents • Introduction • Analog & digital microfluidics • Integrated homogeneous systems • Example: Peptide synthesis platform • Test issues: fluidics, interface MEF & microelectronics • Possible test solutions • Joint VHDL-AMS fault-simulations for DfT • Conclusions Jun-06 «Design for Micro & Nano Manufacture (NoE PATENT-DfMM)» Network of Excellence funded by the European Commission (EC FP6: IST, Unit C2, Contract 507255)

Analog Microfluidics: EOF Flow FETs Gate electrodes Gate electrodes Gate electrodes S S S ilica isolation ilica isolation ilica isolation P P P yrex wafer yrex wafer yrex wafer Gate electrode Gate electrode Gate electrode Jun-06 «Design for Micro & Nano Manufacture (NoE PATENT-DfMM)» Network of Excellence funded by the European Commission (EC FP6: IST, Unit C2, Contract 507255)

Digital Microfluidics: EW OD Droplets electrode U electrowetting equation: θ = cos( ( )) U ε ε 1 θ + 2 0 cos U σ Y 2 d lv droplet η Jun-06 «Design for Micro & Nano Manufacture (NoE PATENT-DfMM)» Network of Excellence funded by the European Commission (EC FP6: IST, Unit C2, Contract 507255)

Previous „I ntegrated“ MEF System s Jun-06 «Design for Micro & Nano Manufacture (NoE PATENT-DfMM)» Network of Excellence funded by the European Commission (EC FP6: IST, Unit C2, Contract 507255)

I ntegrated Hom ogenous MEF Construction capacitive observation Jun-06 «Design for Micro & Nano Manufacture (NoE PATENT-DfMM)» Network of Excellence funded by the European Commission (EC FP6: IST, Unit C2, Contract 507255)

Features Heterogenous I ntegrated System • Based on mainstream industrial (automotive) process of Philips Semiconductors (A-BCD3)+ BEP • Uses 90nm CMOS processing capabilities • Integrates 40V - 120V DMOS transistors for control • Uses pizza-topping techniques for merging with fluidic parts; electrodes can be contacted with CMOS parts Jun-06 «Design for Micro & Nano Manufacture (NoE PATENT-DfMM)» Network of Excellence funded by the European Commission (EC FP6: IST, Unit C2, Contract 507255)

Peptide Synthesis Fluidic Transport • Use microfluidic structures for fluidic transport • More flexibility & less parasitic effects • Application to peptide synthesis > diseases • Currently done at macro scale & very expensive • Enables massive parallel synthesis • Enables multiple different peptides • Using e.g. SPOT & Fomoc techniques Nice self-testing & repair features • Jun-06 «Design for Micro & Nano Manufacture (NoE PATENT-DfMM)» Network of Excellence funded by the European Commission (EC FP6: IST, Unit C2, Contract 507255)

Peptide Synthesis Principle Now: 7-stage peptides for EB & Pfeifer virus detection Formation of the peptide bond by-product R R R R O O 2 2 1 1 || | || | | | − − − − − − − ⎯⎯⎯ → − − − − − H O H N C OH + H N C COOH H N C N C COOH C 2 C 2 2 | | | | | | H H H H H H Amino acid R1 Amino acid R2 Mono Peptide Jun-06 «Design for Micro & Nano Manufacture (NoE PATENT-DfMM)» Network of Excellence funded by the European Commission (EC FP6: IST, Unit C2, Contract 507255)

Sym bolic Schem e Peptide Synthesizer DMF Reagent Amino acids 1 3 2 4 Peptide collector Reaction spot Waste tank Jun-06 «Design for Micro & Nano Manufacture (NoE PATENT-DfMM)» Network of Excellence funded by the European Commission (EC FP6: IST, Unit C2, Contract 507255)

Heterogeneous I ntegrated Fluidic Chip removable peptide substrate Production Platform fluidic topping interconnections CMOS-DMOS System on Chip Jun-06 «Design for Micro & Nano Manufacture (NoE PATENT-DfMM)» Network of Excellence funded by the European Commission (EC FP6: IST, Unit C2, Contract 507255)

library VHDL available PDA Com. (e.g. peptide) control sensing Altera Memory rerouting Cyclon 512 kB vast DSP DMOSTs fluid flow Electrodes sensing fluid flow Fluidic Chip fluidic SoC Jun-06 «Design for Micro & Nano Manufacture (NoE PATENT-DfMM)» Network of Excellence funded by the European Commission (EC FP6: IST, Unit C2, Contract 507255)

Layout/ I m plem entation of Fluidic A-BCD3 Chip electrode G sensing Jun-06 «Design for Micro & Nano Manufacture (NoE PATENT-DfMM)» Network of Excellence funded by the European Commission (EC FP6: IST, Unit C2, Contract 507255)

c Different Sizes in Bio System s Contamination in biomaterial -> clog Jun-06 «Design for Micro & Nano Manufacture (NoE PATENT-DfMM)» Network of Excellence funded by the European Commission (EC FP6: IST, Unit C2, Contract 507255)

c Tim e-Dependent Faults in Bio System s 200 um Contamination in biomaterial -> clog Jun-06 «Design for Micro & Nano Manufacture (NoE PATENT-DfMM)» Network of Excellence funded by the European Commission (EC FP6: IST, Unit C2, Contract 507255)

Testing Schem e Cycle of MEF System Electrode layout Jun-06 «Design for Micro & Nano Manufacture (NoE PATENT-DfMM)» Network of Excellence funded by the European Commission (EC FP6: IST, Unit C2, Contract 507255)

The Used DMOS A-BCD3 Transistors Courtesy of Philips Sem iconductors Jun-06 «Design for Micro & Nano Manufacture (NoE PATENT-DfMM)» Network of Excellence funded by the European Commission (EC FP6: IST, Unit C2, Contract 507255)

DMOS Tristate Fluidic Control Schem e Jun-06 «Design for Micro & Nano Manufacture (NoE PATENT-DfMM)» Network of Excellence funded by the European Commission (EC FP6: IST, Unit C2, Contract 507255)

DMOS Control Behaviour Jun-06 «Design for Micro & Nano Manufacture (NoE PATENT-DfMM)» Network of Excellence funded by the European Commission (EC FP6: IST, Unit C2, Contract 507255)

Critical: SoC to Fluidic Connections electrode fluidic channel electrode BEP bondpad via k metal k via k-1 Direct connections via/or bump technology Jun-06 «Design for Micro & Nano Manufacture (NoE PATENT-DfMM)» Network of Excellence funded by the European Commission (EC FP6: IST, Unit C2, Contract 507255)

Connectivity & C Test W ithout Fluidics Ce1 Z V high Ce2 f P-DMOS Rpar (0-100M Ω ) Rpar (0-100M Ω ) control logic N-DMOS C elec C elec Impedance (30 - 60 pF) (30 - 60 pF) test enable test enable measurement Jun-06 «Design for Micro & Nano Manufacture (NoE PATENT-DfMM)» Network of Excellence funded by the European Commission (EC FP6: IST, Unit C2, Contract 507255)

c MEF Fault Sim ulation in VHDL-AMS Jun-06 «Design for Micro & Nano Manufacture (NoE PATENT-DfMM)» Network of Excellence funded by the European Commission (EC FP6: IST, Unit C2, Contract 507255)

c Differences Due to Bio Clog in VHDL-AMS Fault-free Faulty Jun-06 «Design for Micro & Nano Manufacture (NoE PATENT-DfMM)» Network of Excellence funded by the European Commission (EC FP6: IST, Unit C2, Contract 507255)

Conclusions • Designed, implemented and tested a programmable Micro-Electronic Fluidic array, proven for bio applications and ready for heterogeneous integration • Used fluidic FEM & HDL modelling, simulation and System-on-Chip tools for joint fault simulation • Helps to find the influence of defects in both domains • New detection and control electronics are being developed for testing and the system itself • Promising, innovative industrial applications Jun-06 «Design for Micro & Nano Manufacture (NoE PATENT-DfMM)» Network of Excellence funded by the European Commission (EC FP6: IST, Unit C2, Contract 507255)

Questions ? Jun-06 «Design for Micro & Nano Manufacture (NoE PATENT-DfMM)» Network of Excellence funded by the European Commission (EC FP6: IST, Unit C2, Contract 507255)